公开(公告)号：US12003282B2

公开(公告)日：2024-06-04

申请号：US18172430

申请日：2023-02-22

Applicant: Cisco Technology, Inc.

Inventor： Amendra Koul ,  David Nozadze ,  Mike Sapozhnikov ,  Joel Goergen ,  Arnav Shailesh Shah

IPC: H04B17/15 ,  H04B10/071 ,  H04B17/24

CPC classification number: H04B17/15 ,  H04B10/071 ,  H04B17/24

Abstract: Channel predictive behavior and fault analysis may be provided. A forward time value may be determined comprising a time a forward signal takes to travel from a transmitter over a channel to the receiver. Next, a reflected time value may be determined comprising a time a reflected signal takes to travel to the receiver. The reflected signal may be associated with the forward signal. A discontinuity may then be determined to exist on the channel based on the forward time value and the reflected time value. The reflected signal may be caused by the discontinuity and a high impedance or low impedance at the transmitter present after the forward signal is sent.

公开(公告)号：US20230198639A1

公开(公告)日：2023-06-22

申请号：US18172430

申请日：2023-02-22

Applicant: Cisco Technology, Inc.

Inventor： Amendra Koul ,  David Nozadze ,  Mike Sapozhnikov ,  Joel Goergen ,  Arnav Shailesh Shah

IPC: H04B17/15 ,  H04B17/24 ,  H04B10/071

CPC classification number: H04B17/15 ,  H04B17/24 ,  H04B10/071

Abstract: Channel predictive behavior and fault analysis may be provided. A forward time value may be determined comprising a time a forward signal takes to travel from a transmitter over a channel to the receiver. Next, a reflected time value may be determined comprising a time a reflected signal takes to travel to the receiver. The reflected signal may be associated with the forward signal. A discontinuity may then be determined to exist on the channel based on the forward time value and the reflected time value. The reflected signal may be caused by the discontinuity and a high impedance or low impedance at the transmitter present after the forward signal is sent.

公开(公告)号：US12289831B2

公开(公告)日：2025-04-29

申请号：US18305489

申请日：2023-04-24

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  Kameron Rose Hurst ,  D. Brice Achkir ,  Amendra Koul ,  Scott Hinaga ,  David Nozadze

IPC: H05K3/46 ,  H05K1/09

Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.

公开(公告)号：US12160948B2

公开(公告)日：2024-12-03

申请号：US18337724

申请日：2023-06-20

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

Abstract: A conductive signal transmission structure for a printed circuit includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps and/or a Nyquist frequency that is at least about 14 gigahertz (GHz).

公开(公告)号：US20230354505A1

公开(公告)日：2023-11-02

申请号：US18337724

申请日：2023-06-20

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

CPC classification number: H05K1/0239 ,  H05K1/0242 ,  H05K2201/09245

Abstract: A conductive signal transmission structure for a printed circuit includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps and/or a Nyquist frequency that is at least about 14 gigahertz (GHz).

公开(公告)号：US11606152B2

公开(公告)日：2023-03-14

申请号：US17342316

申请日：2021-06-08

Applicant: Cisco Technology, Inc.

Inventor： Amendra Koul ,  David Nozadze ,  Mike Sapozhnikov ,  Joel Goergen ,  Arnav Shailesh Shah

IPC: H04B17/15 ,  H04B17/24 ,  H04B10/071

Abstract: Channel predictive behavior and fault analysis may be provided. A forward time value may be determined comprising a time a forward signal takes to travel from a transmitter over a channel to the receiver. Next, a reflected time value may be determined comprising a time a reflected signal takes to travel to the receiver. The reflected signal may be associated with the forward signal. A discontinuity may then be determined to exist on the channel based on the forward time value and the reflected time value. The reflected signal may be caused by the discontinuity and a high impedance or low impedance at the transmitter present after the forward signal is sent.

公开(公告)号：US20250151198A1

公开(公告)日：2025-05-08

申请号：US18434943

申请日：2024-02-07

Applicant: Cisco Technology, Inc.

Inventor： Joel Richard Goergen ,  Elizabeth Kochuparambil ,  Scott Hinaga ,  Kameron Rose Hurst ,  Mike Sapozhnikov ,  Shobhana Punjabi ,  David Nozadze ,  Marco Croci

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/18 ,  H05K3/32

Abstract: Techniques to move high current power distribution layers for integrated circuit core power and serializer-deserializer (SERDES) power into a center area of the integrated circuit footprint. This provides a more reliable and higher current distribution into the center of a large integrated circuit footprint, without causing disruption of high speed signal routing or increased signal integrity burden to the high speed signals. Arrangements and methods for routing out the core power area of a main printed circuit board under an integrated circuit and replacing it with a custom power printed circuit board (power plug) that is attached by a metalized paste sintering process. This provides a more reliable and higher current distribution into the center of a large integrated circuit or other high-power component, without causing disruption of high speed signal routing.

公开(公告)号：US11894296B2

公开(公告)日：2024-02-06

申请号：US17446729

申请日：2021-09-02

Applicant: Cisco Technology, Inc.

Inventor： Mike Sapozhnikov ,  Sayed Ashraf Mamun ,  Tomer Osi ,  Amendra Koul ,  David Nozadze ,  Upendranadh R. Kareti ,  Joel R. Goergen

IPC: H01L23/50 ,  H01L23/367 ,  H01L23/498 ,  H05K7/20

CPC classification number: H01L23/50 ,  H01L23/3672 ,  H01L23/49838 ,  H05K7/209

Abstract: An apparatus includes an integrated circuit package and a heatsink. The integrated circuit package includes a substrate, an integrated circuit, a first plurality of signal conductors, and a second plurality of signal conductors. The substrate includes a first surface and a second surface opposite the first surface. The integrated circuit is coupled to the first surface of the substrate. The first plurality of signal conductors are arranged along a periphery of the first surface of the substrate. The second plurality of signal conductors are arranged along a periphery of the second surface of the substrate. The heatsink includes a first portion positioned along the first surface of the substrate and a second portion positioned along the second surface of the substrate.

公开(公告)号：US11777239B2

公开(公告)日：2023-10-03

申请号：US17653466

申请日：2022-03-04

Applicant: Cisco Technology, Inc.

Inventor： Mike Sapozhnikov ,  Sayed Ashraf Mamun ,  Tomer Osi ,  Amendra Koul ,  David Nozadze ,  Upendranadh R. Kareti ,  Joel R. Goergen

IPC: H01R12/75 ,  H01R12/72

CPC classification number: H01R12/727 ,  H01R12/75

Abstract: Certain aspects of the present disclosure provide techniques for pinless interconnect for twinaxial cables to an IC. This includes a socket coupled to an integrated circuit (IC), a port structure coupled to the socket, and a ground connector inserted into the port structure. It further includes a twinaxial cable including a pair of conductors inserted through the ground connector to establish an electrical connection between the twinaxial cable and the IC.

公开(公告)号：US11751322B2

公开(公告)日：2023-09-05

申请号：US17703051

申请日：2022-03-24

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

CPC classification number: H05K1/0239 ,  H05K1/0242 ,  H05K2201/09245

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.