公开(公告)号：US11152294B2

公开(公告)日：2021-10-19

申请号：US16376467

申请日：2019-04-05

Applicant: Corning Incorporated

Inventor： Tian Huang ,  Mandakini Kanungo ,  Ekaterina Aleksandrovna Kuksenkova ,  Prantik Mazumder ,  Chad Byron Moore ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

IPC: H01L23/15 ,  H01L23/48 ,  H01L23/492 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  C03C15/00 ,  C23C18/38 ,  H01L21/768 ,  H05K3/38 ,  C23C14/18 ,  C23C28/02 ,  C03C17/06 ,  C03C3/06 ,  C03C23/00 ,  C03C17/00 ,  H05K3/42 ,  C25D7/12 ,  C03C3/076 ,  H01L21/48 ,  H01L23/00 ,  H05K3/00

Abstract: An article includes a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and at least one via extending through the substrate from the first major surface to the second major surface over an axial length in an axial dimension. The article also includes a metal connector disposed within the via that hermetically seals the via. The article has a helium hermeticity of less than or equal to 1.0×10−8 atm-cc/s after 1000 thermal shock cycles, each of the thermal shock cycle comprises cooling the article to a temperature of −40° C. and heating the article to a temperature of 125° C., and the article has a helium hermeticity of less than or equal to 1.0×10−8 atm-cc/s after 100 hours of HAST at a temperature of 130° C. and a relative humidity of 85%.

公开(公告)号：US11078112B2

公开(公告)日：2021-08-03

申请号：US15978430

申请日：2018-05-14

Applicant: CORNING INCORPORATED

Inventor： Rachel Eileen Dahlberg ,  Tian Huang ,  Yuhui Jin ,  Garrett Andrew Piech ,  Daniel Ohen Ricketts

IPC: C03C15/00 ,  C03C23/00 ,  B23K26/06 ,  B23K26/062 ,  B23K26/0622 ,  B23K26/36 ,  B23K26/53 ,  B23K26/55 ,  B23K26/402 ,  B23K26/00 ,  B23K26/073 ,  B23K26/064 ,  H01L23/48 ,  H01L23/538 ,  B23K103/00 ,  H01L21/48 ,  H01L23/15 ,  H01L23/498

Abstract: Silica-containing substrates including vias with a narrow waist, electronic devices incorporating a silica-containing substrate, and methods of forming vias with narrow waist in silica-containing substrates are disclosed. In one embodiment, an article includes a silica-containing substrate including greater than or equal to 85 mol % silica, a first surface, a second surface opposite the first surface, and a via extending through the silica-containing substrate from the first surface toward the second surface. The via includes a first diameter at the first surface wherein the first diameter is less than or equal to 100 μm, a second diameter at the second surface wherein the first diameter is less than or equal to 100 μm, and a via waist between the first surface and the second surface. The via waist has a waist diameter that is less than the first diameter and the second diameter such that a ratio between the waist diameter and each of the first diameter and the second diameter is less than or equal to 75%.

公开(公告)号：US20200161232A1

公开(公告)日：2020-05-21

申请号：US16749503

申请日：2020-01-22

Applicant: Corning Incorporated

Inventor： Tian Huang ,  Yuhui Jin ,  Matthew Evan Wilhelm

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L23/15

Abstract: Articles and semiconductor packages that incorporate glass-based substrates are disclosed, as well as methods of forming thereof. An article includes a glass-based substrate comprising first and second major surfaces spaced a distance from and parallel to each other, and a tapered via extending through the substrate. The tapered via includes a cross section that is symmetrical about a plane that is between and equidistant to the first and second major surfaces of the glass-based substrate and an interior wall with a first tapered region and a second tapered region positioned between the first major surface and the plane. The respective slopes of the first and second tapered regions are constant and the slope of the first tapered region is not equal to the slope of the second tapered region.

公开(公告)号：US12180108B2

公开(公告)日：2024-12-31

申请号：US16204496

申请日：2018-11-29

Applicant: Corning Incorporated

Inventor： Hongmei Hu ,  Tian Huang ,  Yuhui Jin

IPC: C03C15/00 ,  C03B33/02 ,  C03C23/00 ,  C08F226/04

Abstract: Methods of forming vias in a glass-based article by laser-damage-and-etch processes including etching solutions having positive charge organic molecules are disclosed. In some embodiments, a method of forming a via in a glass-based article includes forming a damage track through a bulk of the glass-based article extending from a first surface of the glass-based article to a second surface of the glass-based article, and applying an etching solution to the glass-based article to form the via. The etching solution includes at least one acid and a positive charge organic molecule. An etch rate at the first surface and the second surface is lower than an etch rate at the damage track.

公开(公告)号：US11972993B2

公开(公告)日：2024-04-30

申请号：US17320646

申请日：2021-05-14

Applicant: CORNING INCORPORATED

Inventor： Rachel Eileen Dahlberg ,  Tian Huang ,  Yuhui Jin ,  Garrett Andrew Piech ,  Daniel Ohen Ricketts

IPC: H01L23/15 ,  B23K26/00 ,  B23K26/06 ,  B23K26/062 ,  B23K26/402 ,  B23K26/53 ,  B23K26/55 ,  C03C15/00 ,  C03C23/00 ,  H01L21/48 ,  H01L23/498 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/073 ,  B23K26/36 ,  B23K103/00 ,  H01L23/48 ,  H01L23/538

CPC classification number: H01L23/15 ,  B23K26/0006 ,  B23K26/06 ,  B23K26/062 ,  B23K26/402 ,  B23K26/53 ,  B23K26/55 ,  C03C15/00 ,  C03C23/0025 ,  B23K26/0617 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/0626 ,  B23K26/064 ,  B23K26/0738 ,  B23K26/36 ,  B23K2103/54 ,  H01L21/486 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H05K2201/09827 ,  H05K2201/09854 ,  Y10T428/24273

Abstract: Silica-containing substrates including vias with a narrow waist, electronic devices incorporating a silica-containing substrate, and methods of forming vias with narrow waist in silica-containing substrates are disclosed. In one embodiment, an article includes a silica-containing substrate including greater than or equal to 85 mol % silica, a first surface, a second surface opposite the first surface, and a via extending through the silica-containing substrate from the first surface toward the second surface. The via includes a first diameter at the first surface wherein the first diameter is less than or equal to 100 μm, a second diameter at the second surface wherein the first diameter is less than or equal to 100 μm, and a via waist between the first surface and the second surface. The via waist has a waist diameter that is less than the first diameter and the second diameter such that a ratio between the waist diameter and each of the first diameter and the second diameter is less than or equal to 75%.

公开(公告)号：US20220078920A1

公开(公告)日：2022-03-10

申请号：US17468063

申请日：2021-09-07

Applicant: CORNING INCORPORATED

Inventor： Tian Huang ,  Yuhui Jin ,  Ekaterina Aleksandrovna Kuksenkova ,  Heather Nicole Vanselous

IPC: H05K3/40 ,  H05K3/00 ,  H05K1/03 ,  H05K1/11 ,  B23K26/55 ,  B23K26/00 ,  B23K26/06

Abstract: A substrate comprising: (i) a first series of blind vias into a thickness of a substrate and open to a first primary surface; and (ii) a second series of blind vias into the thickness of a substrate and open to a second primary surface. Each blind via includes an interior wall. The interior wall includes a first tapered region and a second tapered region. The first tapered region and the second tapered region have a distinct slope. Each of the blind vias of the second series of blind vias is coaxial with a different blind via of the first series of blind vias. Each blind via of the first series of blind vias has a depth that deviates from a mean depth by less than +/−10%. Each blind via of the second series of blind vias has a depth that deviates from a mean depth by less than +/−10%.

公开(公告)号：US10580725B2

公开(公告)日：2020-03-03

申请号：US15977195

申请日：2018-05-11

Applicant: Corning Incorporated

Inventor： Tian Huang ,  Yuhui Jin ,  Matthew Evan Wilhelm

IPC: H01L23/498 ,  H01L23/15 ,  H01L21/48 ,  H01L23/00

Abstract: Articles and semiconductor packages that incorporate glass-based substrates are disclosed, as well as methods of forming thereof. An article includes a glass-based substrate comprising first and second major surfaces spaced a distance from and parallel to each other, and a tapered via extending through the substrate. The tapered via includes a cross section that is symmetrical about a plane that is between and equidistant to the first and second major surfaces of the glass-based substrate and an interior wall with a first tapered region and a second tapered region positioned between the first major surface and the plane. The respective slopes of the first and second tapered regions are constant and the slope of the first tapered region is not equal to the slope of the second tapered region.

公开(公告)号：US20190313524A1

公开(公告)日：2019-10-10

申请号：US16376467

申请日：2019-04-05

Applicant: Corning Incorporated

Inventor： Tian Huang ,  Mandakini Kanungo ,  Ekaterina Kuksenkova ,  Prantik Mazumder ,  Chad Byron Moore ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

IPC: H05K1/02 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H05K1/11 ,  H05K1/03

Abstract: An article includes a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and at least one via extending through the substrate from the first major surface to the second major surface over an axial length in an axial dimension. The article also includes a metal connector disposed within the via that hermetically seals the via. The article has a helium hermeticity of less than or equal to 1.0×10−8 atm-cc/s after 1000 thermal shock cycles, each of the thermal shock cycle comprises cooling the article to a temperature of −40° C. and heating the article to a temperature of 125° C., and the article has a helium hermeticity of less than or equal to 1.0×10−8 atm-cc/s after 100 hours of HAST at a temperature of 130° C. and a relative humidity of 85%.

公开(公告)号：US20190185373A1

公开(公告)日：2019-06-20

申请号：US16204496

申请日：2018-11-29

Applicant: Corning Incorporated

Inventor： Hongmei Hu ,  Tian Huang ,  Yuhui Jin

IPC: C03C15/00 ,  C03B33/02

CPC classification number: C03C15/00 ,  C03B33/0222 ,  C03C23/006 ,  C08F226/04

Abstract: Methods of forming vias in a glass-based article by laser-damage-and-etch processes including etching solutions having positive charge organic molecules are disclosed. In some embodiments, a method of forming a via in a glass-based article includes forming a damage track through a bulk of the glass-based article extending from a first surface of the glass-based article to a second surface of the glass-based article, and applying an etching solution to the glass-based article to form the via. The etching solution includes at least one acid and a positive charge organic molecule. An etch rate at the first surface and the second surface is lower than an etch rate at the damage track.

公开(公告)号：US20180130705A1

公开(公告)日：2018-05-10

申请号：US15344760

申请日：2016-11-07

Applicant: Corning Incorporated

Inventor： Tian Huang ,  Sean Mathew Garner

IPC: H01L21/768 ,  H01L21/683

CPC classification number: H01L21/76877 ,  H01L21/486 ,  H01L21/6835 ,  H01L21/76802 ,  H01L23/49827 ,  H01L2221/68345

Abstract: Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for forming vias in a substrate with non-via processing intervening between via processing steps.