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    Apparatus and method for inspecting laser defect inside of transparent material
    2.
    发明授权
    Apparatus and method for inspecting laser defect inside of transparent material 有权

    公开(公告)号：US12292387B2

    公开(公告)日：2025-05-06

    申请号：US17928005

    申请日：2021-05-25

    Applicant: CORNING INCORPORATED

    Inventor： Chong Pyung An ,  En Hong ,  Tian Huang ,  Yuhui Jin ,  Philip Robert LeBlanc ,  Garrett Andrew Piech

    IPC: G01N21/88 ,  G01N21/958

    Abstract: A method for inspecting a transparent workpiece comprises: directing light from an illumination source onto a plurality of defects formed in the transparent workpiece, wherein the plurality of defects extends in a defect direction, wherein the transparent workpiece comprises a first surface and a second surface; detecting a scattering image signal from light scattered by the plurality of defects using an imaging system, wherein an imaging axis of the imaging system extends at a non-zero imaging angle relative to the defect direction, wherein entireties of at least a subset of the plurality of defects are within a depth of field of the imaging system; and generating a three-dimensional image of at least one of the plurality of defects based on the scattering signal.

    Articles having vias with geometry attributes and methods for fabricating the same
    6.
    发明授权
    Articles having vias with geometry attributes and methods for fabricating the same 有权

    公开(公告)号：US11062986B2

    公开(公告)日：2021-07-13

    申请号：US16749503

    申请日：2020-01-22

    Applicant: Corning Incorporated

    Inventor： Tian Huang ,  Yuhui Jin ,  Matthew Evan Wilhelm

    IPC: H01L23/498 ,  H01L23/15 ,  H01L21/48 ,  H01L23/00

    Abstract: Articles and semiconductor packages that incorporate glass-based substrates are disclosed, as well as methods of forming thereof. An article includes a glass-based substrate comprising first and second major surfaces spaced a distance from and parallel to each other, and a tapered via extending through the substrate. The tapered via includes a cross section that is symmetrical about a plane that is between and equidistant to the first and second major surfaces of the glass-based substrate and an interior wall with a first tapered region and a second tapered region positioned between the first major surface and the plane. The respective slopes of the first and second tapered regions are constant and the slope of the first tapered region is not equal to the slope of the second tapered region.

    SILICA-CONTAINING SUBSTRATES WITH VIAS HAVING AN AXIALLY VARIABLE SIDEWALL TAPER AND METHODS FOR FORMING THE SAME
    7.
    发明申请
    SILICA-CONTAINING SUBSTRATES WITH VIAS HAVING AN AXIALLY VARIABLE SIDEWALL TAPER AND METHODS FOR FORMING THE SAME 审中-公开

    公开(公告)号：US20180342451A1

    公开(公告)日：2018-11-29

    申请号：US15978430

    申请日：2018-05-14

    Applicant: CORNING INCORPORATED

    Inventor： Rachel Eileen Dahlberg ,  Tian Huang ,  Yuhui Jin ,  Garrett Andrew Piech ,  Daniel Ohen Ricketts

    IPC: H01L23/498 ,  C03C23/00 ,  C03C15/00 ,  H01L23/15 ,  H01L21/48

    Abstract: Silica-containing substrates including vias with a narrow waist, electronic devices incorporating a silica-containing substrate, and methods of forming vias with narrow waist in silica-containing substrates are disclosed. In one embodiment, an article includes a silica-containing substrate including greater than or equal to 85 mol % silica, a first surface, a second surface opposite the first surface, and a via extending through the silica-containing substrate from the first surface toward the second surface. The via includes a first diameter at the first surface wherein the first diameter is less than or equal to 100 μm, a second diameter at the second surface wherein the first diameter is less than or equal to 100 μm, and a via waist between the first surface and the second surface. The via waist has a waist diameter that is less than the first diameter and the second diameter such that a ratio between the waist diameter and each of the first diameter and the second diameter is less than or equal to 75%.

    METHODS OF ETCHING GLASS SUBSTRATES AND GLASS SUBSTRATES
    9.
    发明申请
    METHODS OF ETCHING GLASS SUBSTRATES AND GLASS SUBSTRATES 审中-公开
    蚀刻玻璃基板和玻璃基板的方法

    公开(公告)号：US20160362331A1

    公开(公告)日：2016-12-15

    申请号：US15177431

    申请日：2016-06-09

    Applicant: CORNING INCORPORATED

    Inventor： Thomas Michael Castle ,  Tian Huang ,  Yuhui Jin ,  Daniel Wayne Levesque ,  Tammy Lynn Petriwsky

    IPC: C03C15/00 ,  B23K26/382 ,  B23K26/402 ,  C03C23/00

    CPC classification number: C03C15/00 ,  B23K2101/40 ,  C03C4/0071 ,  C03C23/0025 ,  H01L21/4807 ,  H01L23/15 ,  Y10T428/24182 ,  Y10T428/24273 ,  Y10T428/24479 ,  Y10T428/24777

    Abstract: A method of forming a glass substrate includes providing a glass substrate having alumina, translating a pulsed laser beam on the glass substrate to form one or more pilot holes, contacting the glass substrate with an etching solution, and providing agitation. The etching solution has a pH from about 0 to about 2.0, and an etch rate is less than about 3 μm/min. A glass substrate is disclosed having a first surface and a second surface opposite the first surface in a thickness direction, and at least one hole penetrating the first surface, wherein the at least one hole has been etched by an etching solution. A greatest distance d1 between (1) a first plane that contacts the first surface in regions that do not have the at least one hole or a deviation in a thickness of the substrate surrounding the at least one hole and (2) a surface of the deviation recessed from the first plane is less than or equal to about 0.2 μm.

    Abstract translation: 形成玻璃基板的方法包括提供具有氧化铝的玻璃基板，将脉冲激光束平移在玻璃基板上以形成一个或多个引导孔，使玻璃基板与蚀刻溶液接触并提供搅拌。 蚀刻溶液具有约0至约2.0的pH，蚀刻速率小于约3μm/ min。 公开了一种玻璃基板，其具有在厚度方向上与第一表面相对的第一表面和第二表面，以及穿过第一表面的至少一个孔，其中至少一个孔已经被蚀刻溶液蚀刻。 （1）在不具有至少一个孔的区域中接触第一表面的第一平面或围绕至少一个孔的基底的厚度偏差之间的最大距离d1，以及（2） 从第一平面凹陷的偏差小于或等于约0.2μm。

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