公开(公告)号：US20160362331A1

公开(公告)日：2016-12-15

申请号：US15177431

申请日：2016-06-09

Applicant: CORNING INCORPORATED

Inventor： Thomas Michael Castle ,  Tian Huang ,  Yuhui Jin ,  Daniel Wayne Levesque ,  Tammy Lynn Petriwsky

IPC: C03C15/00 ,  B23K26/382 ,  B23K26/402 ,  C03C23/00

CPC classification number: C03C15/00 ,  B23K2101/40 ,  C03C4/0071 ,  C03C23/0025 ,  H01L21/4807 ,  H01L23/15 ,  Y10T428/24182 ,  Y10T428/24273 ,  Y10T428/24479 ,  Y10T428/24777

Abstract: A method of forming a glass substrate includes providing a glass substrate having alumina, translating a pulsed laser beam on the glass substrate to form one or more pilot holes, contacting the glass substrate with an etching solution, and providing agitation. The etching solution has a pH from about 0 to about 2.0, and an etch rate is less than about 3 μm/min. A glass substrate is disclosed having a first surface and a second surface opposite the first surface in a thickness direction, and at least one hole penetrating the first surface, wherein the at least one hole has been etched by an etching solution. A greatest distance d1 between (1) a first plane that contacts the first surface in regions that do not have the at least one hole or a deviation in a thickness of the substrate surrounding the at least one hole and (2) a surface of the deviation recessed from the first plane is less than or equal to about 0.2 μm.

Abstract translation: 形成玻璃基板的方法包括提供具有氧化铝的玻璃基板，将脉冲激光束平移在玻璃基板上以形成一个或多个引导孔，使玻璃基板与蚀刻溶液接触并提供搅拌。 蚀刻溶液具有约0至约2.0的pH，蚀刻速率小于约3μm/ min。 公开了一种玻璃基板，其具有在厚度方向上与第一表面相对的第一表面和第二表面，以及穿过第一表面的至少一个孔，其中至少一个孔已经被蚀刻溶液蚀刻。 （1）在不具有至少一个孔的区域中接触第一表面的第一平面或围绕至少一个孔的基底的厚度偏差之间的最大距离d1，以及（2） 从第一平面凹陷的偏差小于或等于约0.2μm。