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公开(公告)号：US10746937B2
公开(公告)日：2020-08-18
申请号：US16663917
申请日：2019-10-25
Applicant: CORNING INCORPORATED
Inventor： Douglas Llewellyn Butler , Stephan Lvovich Logunov , Mark Alejandro Quesada , Alexander Mikhailovich Streltsov , James Scott Sutherland
Abstract: Assemblies, optical connectors, and methods for bonding optical elements to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical element to a substrate includes disposing a film layer on a surface of the substrate, disposing the optical element on a surface of the film layer, and directing a laser beam into the optical element. The method further includes melting, using the diameter laser beam, a material of the substrate to create a bond area between the optical element and the surface of the substrate. The film layer is capable of absorbing a wavelength of the laser beam to melt the material of the substrate at the bond area. The bond area includes laser-melted material of the substrate that bonds the optical element to the substrate.
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公开(公告)号：US20200057202A1
公开(公告)日：2020-02-20
申请号：US16663917
申请日：2019-10-25
Applicant: CORNING INCORPORATED
Inventor： Douglas Llewellyn Butler , Stephan Lvovich Logunov , Mark Alejandro Quesada , Alexander Mikhailovich Streltsov , James Scott Sutherland
Abstract: Assemblies, optical connectors, and methods for bonding optical elements to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical element to a substrate includes disposing a film layer on a surface of the substrate, disposing the optical element on a surface of the film layer, and directing a laser beam into the optical element. The method further includes melting, using the diameter laser beam, a material of the substrate to create a bond area between the optical element and the surface of the substrate. The film layer is capable of absorbing a wavelength of the laser beam to melt the material of the substrate at the bond area. The bond area includes laser-melted material of the substrate that bonds the optical element to the substrate.
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13.发明申请公开(公告)号：US20190232435A1
公开(公告)日：2019-08-01
申请号：US16257853
申请日：2019-01-25
Applicant: CORNING INCORPORATED
Inventor： Jeffery Alan DeMeritt , Davide Domenico Fortusini , Andrey Kobyakov , David Mark Lance , Leonard Thomas Masters , Ulrich Wilhelm Heinz Neukirch , Alexander Mikhailovich Streltsov , James Scott Sutherland
IPC: B23K26/384 , B23K26/40 , B23K26/00 , B23K26/06 , G02B6/36
CPC classification number: C03B33/082 , B23K26/009 , B23K26/0648 , B23K26/0665 , B23K26/384 , B23K26/40 , G02B6/3644
Abstract: The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.
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公开(公告)号：US09364814B2
公开(公告)日：2016-06-14
申请号：US14360942
申请日：2012-11-28
Applicant: Corning Incorporated
Inventor： Larry Gleason Hubbard, Jr. , James Scott Sutherland
CPC classification number: B01J19/248 , B28B11/006 , B28B11/12 , F28F7/02 , F28F21/006 , F28F21/04 , F28F2220/00 , F28F2255/16
Abstract: A method of making a fluidic device is provided. The method includes locating a meltable sheet material on a face of an extruded body including extended cells therein. At least some of the cells are interconnected by melting the sheet material such that the melted sheet material flows into the at least some of the cells to form a fluidic passage through the body defined within the at least some of the cells. The fluidic passageway may have a longitudinally serpentine path back and forth along the at least some of the cells.
Abstract translation: 提供制造流体装置的方法。 该方法包括将可熔片材定位在包括延伸单元的挤压体的表面上。 通过熔化片材材料使至少一些细胞相互连接，使得熔融的片材材料流入至少一些细胞，以形成穿过至少一些细胞内的身体的流体通道。 流体通道可以具有沿着至少一些单元来回的纵向蛇形路径。
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公开(公告)号：US20240174575A1
公开(公告)日：2024-05-30
申请号：US18283239
申请日：2022-03-21
Applicant: CORNING INCORPORATED
Inventor： George Edward Berkey , Alexander Lee Cuno , James Scott Sutherland
IPC: C04B35/565 , B01J19/00 , B28B3/02 , B28B7/18 , B28B7/34 , C04B35/628 , C04B35/645 , F28F7/02
CPC classification number: C04B35/565 , B01J19/0093 , B28B3/025 , B28B7/18 , B28B7/342 , C04B35/62802 , C04B35/6455 , F28F7/02 , B01J2219/0079 , B01J2219/00824 , B01J2219/00855 , B01J2219/0086 , C04B2235/3826 , C04B2235/6028 , C04B2235/786 , C04B2235/945 , C04B2235/95 , C04B2235/963 , F28F2210/02
Abstract: A device and a process for forming a monolithic substantially closed-porosity ceramic fluidic device having a tortuous fluid passage extending through the device, the tortuous fluid passage having a smooth interior surface, a material of the ceramic body having a continuous and uniform distribution of grains at least between opposed major surfaces of the ceramic body. The process includes positioning a positive fluid passage mold within a volume of binder-coated ceramic powder, pressing the volume of ceramic powder with the mold inside to form a pressed body, heating the pressed body to remove the mold, and sintering the pressed body. A relationship between a first stability characteristic of the volume of ceramic powder and a second stability characteristic of the mold prevents discontinuities in the pressed body after pressing and/or during heating.
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Patent Agency Ranking
公开(公告)号：US20240173889A1
公开(公告)日：2024-05-30
申请号：US18490972
申请日：2023-10-20
Applicant: CORNING INCORPORATED
Inventor： Bethany Rose Conway , James Scott Sutherland , James William Zimmerman
CPC classification number: B28B7/346 , B28B7/0097
Abstract: The disclosure relates to methods of fabricating of a graphite powder mold, including: applying a base layer to an exposed surface of a mold having one or more features; depositing a graphite powder onto the base layer to fill the one or more features; applying a cover layer onto an exposed surface of the graphite powder, wherein the cover layer and the base layer join at intersecting surfaces encasing the graphite powder to form the graphite powder mold having one or more raised features
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公开(公告)号：US20220401952A1
公开(公告)日：2022-12-22
申请号：US17763804
申请日：2020-09-30
Applicant: CORNING INCORPORATED
Inventor： George Edward Berkey , Alexander Lee Cuno , John Walter Grunden , Kyler Robert Hurlburt , Yanxia Ann Lu , James Scott Sutherland , Oscar Walter Wheeler
IPC: B01L3/00 , C04B35/645
Abstract: A module and a process for forming a monolithic substantially closed-porosity silicon carbide fluidic module having a tortuous fluid passage extending through the module, the tortuous fluid passage having an interior surface, the interior surface having a surface roughness in the range of from 0.1 to 10 μm Ra. The process includes positioning a positive fluid passage mold within a volume of silicon carbide powder, the powder coated with a binder; pressing the volume of silicon carbide powder with the mold inside to form a pressed body; heating the pressed body to remove the mold; and sintering the pressed body.
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公开(公告)号：US11247932B2
公开(公告)日：2022-02-15
申请号：US16257853
申请日：2019-01-25
Applicant: CORNING INCORPORATED
Inventor： Jeffery Alan DeMeritt , Davide Domenico Fortusini , Andrey Kobyakov , David Mark Lance , Leonard Thomas Masters , Ulrich Wilhelm Heinz Neukirch , Alexander Mikhailovich Streltsov , James Scott Sutherland
IPC: B23K26/38 , C03B33/08 , C03B33/02 , G02B6/36 , C03B33/04 , B23K26/384 , B23K26/00 , B23K26/06 , B23K26/40 , B23K26/122
Abstract: The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.
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公开(公告)号：US10407349B2
公开(公告)日：2019-09-10
申请号：US15567845
申请日：2016-04-21
Applicant: CORNING INCORPORATED
Inventor： Matthew John Dejneka , John Christopher Mauro , Mallanagouda Dyamanagouda Patil , Kim Doreen Pierotti , James Scott Sutherland , Akenda Zellet-Lukaso
IPC: C04B35/482 , C04B35/64 , F27D1/00 , C04B35/488 , C04B35/486 , C03C14/00 , C03B5/43
Abstract: Disclosed herein are methods for making a bonded refractory material, the methods comprising preparing a slurry comprising glass precursor particles having an average particle size ranging from about 1 nm to about 200 nm; combining zirconia particles with the slurry to form a batch composition comprising at least about 80% by weight of zirconia; forming a green body from the batch composition; and sintering the green body to form a sintered refractory material. Sintered high-zirconia refractory materials can comprise at least about 80% by weight of zirconia having an average grain size of 100 microns or less, wherein the zirconia is interspersed in a glassy phase, and wherein the sintered refractory materials comprise about 15% or less by weight of the glassy phase. Melting vessels having at least one interior surface comprising such sintered zirconia refractory materials are further disclosed herein.
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公开(公告)号：US20190271814A1
公开(公告)日：2019-09-05
申请号：US16410903
申请日：2019-05-13
Applicant: CORNING INCORPORATED
Inventor： Stephan Lvovich Logunov , Mark Alejandro Quesada , Alexander Mikhailovich Streltsov , Douglas Llewellyn Butler , James Scott Sutherland
Abstract: Assemblies, optical connectors, and methods for bonding optical fibers to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate includes directing a laser beam into the optical fiber disposed on a surface of the substrate, wherein the optical fiber has a curved surface and the curved surface of the optical fiber focuses the laser beam to a diameter that is smaller than a diameter of the laser beam as it enters the optical fiber. The method further includes melting, using the laser beam, a material of the substrate at a bond area between the optical fiber and the surface of the substrate such that the optical fiber is bonded to the surface of the substrate.
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