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公开(公告)号：US11781858B2
公开(公告)日：2023-10-10
申请号：US17573219
申请日：2022-01-11
Applicant: Cisco Technology, Inc.
Inventor： Amendra Koul , Yaochao Yang , Mike Sapozhnikov , Joel Richard Goergen , Kartheek Nalla
IPC: G01B11/24 , G01N21/956 , G01B11/26 , H05K3/00
CPC classification number: G01B11/24 , G01B11/26 , G01N21/956 , H05K3/00 , G01N2021/95638
Abstract: A method is provided that includes inspecting a layer of a printed circuit board through an inspection window comprising an opening formed in one or more other layers of the printed circuit board and identifying a location of a trace aligned with the inspection window, relative to a marker in a fiber bundle of a fiber weave to assess fiber weave skew.
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公开(公告)号：US11293752B2
公开(公告)日：2022-04-05
申请号：US16868383
申请日：2020-05-06
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Amendra Koul , Yaochao Yang , Mike Sapozhnikov , Joel Richard Goergen , Kartheek Nalla
IPC: G01B11/24 , G01N21/956 , G01B11/26 , H05K3/00
Abstract: In one embodiment, a method includes inspecting a fiber weave for use in a printed circuit board with an automated optical inspection tool and identifying a distance between fiber bundles in the fiber weave. The fiber weave comprises a plurality of the fiber bundles woven to form the fiber weave and a portion of the fiber bundles comprise markers and identifying a distance between the fiber bundles in the fiber weave comprises measuring a distance between the markers.
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公开(公告)号：US10674598B1
公开(公告)日：2020-06-02
申请号：US16596623
申请日：2019-10-08
Applicant: CISCO TECHNOLOGY, INC.
Inventor： David Nozadze , Amendra Koul , Joel Richard Goergen , Mike Sapozhnikov
Abstract: In one embodiment, an apparatus includes a printed circuit board, a via-stub resonator formed in the printed circuit board, a plurality of vias surrounding the via-stub resonator, and a microstrip connected to the via-stub resonator for use in measuring an insertion loss to provide a resonance frequency. The via-stub resonator is designed to reproduce a dielectric constant value of a known material in a simulation. A via dielectric constant in an x and y plane is calculated based on the resonance frequency. A method for measuring the via dielectric constant using the via-stub resonator is also disclosed herein.
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公开(公告)号：US20250055208A1
公开(公告)日：2025-02-13
申请号：US18448279
申请日：2023-08-11
Applicant: Cisco Technology, Inc.
Inventor： Jason Visneski , George Curtis , Mike Sapozhnikov
Abstract: In some aspects, the techniques described herein relate to an apparatus including: a cable termination connection assembly, comprising: a base including a body defining a groove therein; a signal contact member that is engageable with the base, at least a portion of the signal contact member being insertable into the groove of the body of the base, the signal contact member including pins extending therefrom; and a cover that is engageable with the signal contact member, wherein the cover can be pressed by a user to cause the pins to extend through the base and engage a PCB.
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公开(公告)号：US12003282B2
公开(公告)日：2024-06-04
申请号：US18172430
申请日：2023-02-22
Applicant: Cisco Technology, Inc.
Inventor： Amendra Koul , David Nozadze , Mike Sapozhnikov , Joel Goergen , Arnav Shailesh Shah
IPC: H04B17/15 , H04B10/071 , H04B17/24
CPC classification number: H04B17/15 , H04B10/071 , H04B17/24
Abstract: Channel predictive behavior and fault analysis may be provided. A forward time value may be determined comprising a time a forward signal takes to travel from a transmitter over a channel to the receiver. Next, a reflected time value may be determined comprising a time a reflected signal takes to travel to the receiver. The reflected signal may be associated with the forward signal. A discontinuity may then be determined to exist on the channel based on the forward time value and the reflected time value. The reflected signal may be caused by the discontinuity and a high impedance or low impedance at the transmitter present after the forward signal is sent.
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Patent Agency Ranking
公开(公告)号：US11761755B2
公开(公告)日：2023-09-19
申请号：US17556521
申请日：2021-12-20
Applicant: Cisco Technology, Inc.
Inventor： Amendra Koul , Yaochao Yang , Mike Sapozhnikov , Joel Richard Goergen , Kartheek Nalla
IPC: G01B11/24 , G01N21/956 , G01B11/26 , H05K3/00
CPC classification number: G01B11/24 , G01B11/26 , G01N21/956 , H05K3/00 , G01N2021/95638
Abstract: In one embodiment, a method includes inspecting a fiber weave for use in a printed circuit board with an automated optical inspection tool and identifying a distance between fiber bundles in the fiber weave. The fiber weave comprises a plurality of the fiber bundles woven to form the fiber weave and a portion of the fiber bundles comprise markers and identifying a distance between the fiber bundles in the fiber weave comprises measuring a distance between the markers.
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公开(公告)号：US20230198639A1
公开(公告)日：2023-06-22
申请号：US18172430
申请日：2023-02-22
Applicant: Cisco Technology, Inc.
Inventor： Amendra Koul , David Nozadze , Mike Sapozhnikov , Joel Goergen , Arnav Shailesh Shah
IPC: H04B17/15 , H04B17/24 , H04B10/071
CPC classification number: H04B17/15 , H04B17/24 , H04B10/071
Abstract: Channel predictive behavior and fault analysis may be provided. A forward time value may be determined comprising a time a forward signal takes to travel from a transmitter over a channel to the receiver. Next, a reflected time value may be determined comprising a time a reflected signal takes to travel to the receiver. The reflected signal may be associated with the forward signal. A discontinuity may then be determined to exist on the channel based on the forward time value and the reflected time value. The reflected signal may be caused by the discontinuity and a high impedance or low impedance at the transmitter present after the forward signal is sent.
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公开(公告)号：US20220120558A1
公开(公告)日：2022-04-21
申请号：US17556521
申请日：2021-12-20
Applicant: Cisco Technology, Inc.
Inventor： Amendra Koul , Yaochao Yang , Mike Sapozhnikov , Joel Richard Goergen , Kartheek Nalla
IPC: G01B11/24 , G01N21/956 , G01B11/26 , H05K3/00
Abstract: In one embodiment, a method includes inspecting a fiber weave for use in a printed circuit board with an automated optical inspection tool and identifying a distance between fiber bundles in the fiber weave. The fiber weave comprises a plurality of the fiber bundles woven to form the fiber weave and a portion of the fiber bundles comprise markers and identifying a distance between the fiber bundles in the fiber weave comprises measuring a distance between the markers.
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公开(公告)号：US11287245B2
公开(公告)日：2022-03-29
申请号：US16868423
申请日：2020-05-06
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Amendra Koul , Yaochao Yang , Mike Sapozhnikov , Joel Richard Goergen , Kartheek Nalla
IPC: G01B11/24 , G01N21/956 , G01B11/26 , H05K3/00
Abstract: In one embodiment, a method includes inspecting a layer of a printed circuit board through an inspection window comprising an opening formed in one or more other layers of the printed circuit board and identifying a location of a trace aligned with the inspection window, relative to a marker in a fiber bundle of a fiber weave to assess fiber weave skew.
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公开(公告)号：US20200263976A1
公开(公告)日：2020-08-20
申请号：US16868383
申请日：2020-05-06
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Amendra Koul , Yaochao Yang , Mike Sapozhnikov , Joel Richard Goergen , Kartheek Nalla
IPC: G01B11/24 , H05K3/00 , G01B11/26 , G01N21/956
Abstract: In one embodiment, a method includes inspecting a fiber weave for use in a printed circuit board with an automated optical inspection tool and identifying a distance between fiber bundles in the fiber weave. The fiber weave comprises a plurality of the fiber bundles woven to form the fiber weave and a portion of the fiber bundles comprise markers and identifying a distance between the fiber bundles in the fiber weave comprises measuring a distance between the markers.
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