公开(公告)号：US09250292B2

公开(公告)日：2016-02-02

申请号：US13854372

申请日：2013-04-01

Applicant: CHROMA ATE INC.

Inventor： Chien-Ming Chen

IPC: G01R31/28

CPC classification number: G01R31/2896 ,  G01R31/2887

Abstract: A testing system for testing semiconductor package stacking chips is disclosed. The system includes a testing socket, a testing arm, and a testing mechanism. The testing mechanism includes a probe testing device. The probe testing device has a testing chip inside and a plurality of testing probes electrically connected to the testing chip. The plurality of testing probes extends toward the testing socket for contacting a chip-under-test loaded on the testing socket. When the testing mechanism moves to an upper position between the testing socket and the testing arm, the testing arm moves downward in the vertical direction and presses down the testing mechanism thereby coercing the plurality of testing probes in the testing mechanism to closely abut against the chip-under-test, so that the testing chip inside the testing mechanism can electrically connect to the chip-under-test for forming a test loop.

Abstract translation: 公开了一种用于测试半导体封装堆叠芯片的测试系统。 该系统包括测试插座，测试臂和测试机构。 测试机构包括探针测试装置。 探针测试装置内部具有测试芯片，并且多个测试探针电连接到测试芯片。 多个测试探针延伸到测试插座，用于接触加载在测试插座上的芯片下测试。 当测试机构移动到测试插座和测试臂之间的上部位置时，测试臂沿垂直方向向下移动并按压测试机构，从而迫使测试机构中的多个测试探针紧紧靠在芯片上 - 测试，使测试机构内的测试芯片可以电连接到芯片下测试以形成测试回路。

公开(公告)号：US11901213B2

公开(公告)日：2024-02-13

申请号：US17521952

申请日：2021-11-09

Applicant: Chroma Ate Inc.

Inventor： Chien-Ming Chen ,  Chin-Yi Ouyang

IPC: H01L21/683 ,  H01L21/677 ,  H01L21/67 ,  H01L21/673

CPC classification number: H01L21/6838 ,  H01L21/673 ,  H01L21/67144 ,  H01L21/67259 ,  H01L21/67775

Abstract: The present invention relates to a chip transfer device capable of floatingly positioning a chip and a method for floatingly positioning a chip. When a chip is placed in a chip socket, a control unit controls an air pressure switching valve to allow at least one vent hole to be communicated with a positive air pressure source. An air flow from the positive air pressure source blows a lower surface of the chip through the vent hole, so that the at least one chip is air-floated. Accordingly, when the chip socket is communicated with the positive air pressure source, the air flow blows the lower surface of the chip in the chip socket through the vent hole, so that the chip is air-floated in the chip socket to reduce the error displacement of the chip offset.

公开(公告)号：US20230023844A1

公开(公告)日：2023-01-26

申请号：US17580705

申请日：2022-01-21

Applicant: CHROMA ATE INC.

Inventor： Chin-Yi Ouyang ,  Wei-Cheng Kuo ,  Chien-Ming Chen ,  Xin-Yi Wu

IPC: G05B19/401 ,  G01B21/04

Abstract: A position calibration system and method are disclosed, in which a control unit is provided to control a positioner sensing module to scan a circular positioner provided on a positioning substrate in a first direction and a second direction so as to acquire midpoints of two scanned line segments and acquire an intersection of lines extending from the two center points in a direction perpendicular to the first and the second directions as a calibration reference point, which correspond to a centroid (a center) of the circular positioner. The calibration reference point functions as a reference point for positioning the positioning substrate with respect to the positioner sensing module and is stored in a memory unit. The calibration reference point can be used as a positioning point during installation of a machine and can also be used for calibration of a position of the machine.

公开(公告)号：US11970342B2

公开(公告)日：2024-04-30

申请号：US17930082

申请日：2022-09-07

Applicant: CHROMA ATE INC.

Inventor： Chien-Ming Chen ,  Jui-Hsiung Chen ,  Chi-Wei Wang

IPC: B65G47/90 ,  G01N3/04 ,  G01N3/06 ,  G01N3/12 ,  G01R31/28 ,  H01L21/673 ,  H05K13/04

CPC classification number: B65G47/905 ,  G01N3/04 ,  G01N3/06 ,  G01N3/12 ,  G01R31/2867 ,  G01R31/2874 ,  G01R31/2887 ,  G01R31/2893 ,  H01L21/67333 ,  H05K13/0408 ,  G01N2203/0044 ,  G01N2203/0411

Abstract: The present invention relates to a chip tray positioning device, which mainly comprises a frame body, a tray conveying module, a pulling module, a pushing module and a controller. The tray conveying module is disposed on the frame body, electrically connected to the controller and controlled to convey a chip tray from the start area to the end area. The pulling module and the pushing module are disposed on the frame body, electrically connected to the controller and controlled to cause the chip tray to be abutted against the end wall and the lateral wall of the frame body, thereby realizing the positioning of the chip tray and eliminating an error formed in the transfer process of the chip tray. In addition, the controller also controls the pushing module to knock the chip tray at a specific frequency so that the chip tray is vibrated.

公开(公告)号：US11740283B2

公开(公告)日：2023-08-29

申请号：US17834035

申请日：2022-06-07

Applicant: CHROMA ATE INC.

Inventor： Chin-Yi Ouyang ,  Chien-Ming Chen ,  Wei-Cheng Kuo ,  Xin-Yi Wu ,  Iching Tsai

IPC: G01R31/28 ,  G01R1/04

CPC classification number: G01R31/2893 ,  G01R1/0458

Abstract: The present invention relates to a multistory electronic device testing apparatus, which mainly comprises a feeding and binning device, a multi-axis transfer device, a chip-testing device and a main controller. The feeding and binning device includes an upper module and a lower module. The chip-testing device includes a plurality of testing units arranged vertically. The main controller not only controls the feeding, binning and testing operations, but also controls the multi-axis transfer device to transfer an electronic device to be tested or a tested electronic device between the feeding and binning device and the chip-testing device. Accordingly, the three-dimensional arrangement of the feeding and binning module and the testing device is realized, and the accommodating capacity and the testing capacity for the electronic devices to be tested and the tested electronic devices can be increased.

公开(公告)号：US11333704B2

公开(公告)日：2022-05-17

申请号：US16559701

申请日：2019-09-04

Applicant: Chroma Ate Inc.

Inventor： Chin-Yi Ouyang ,  Chien-Ming Chen ,  Meng-Kung Lu

IPC: G01R31/28 ,  G01R1/04

Abstract: The invention relates to a sliding test device for electronic components, which mainly comprises a base, a sliding frame and a pressing member, wherein an electronic component to be tested is placed in a chip receiving module of the base, and the sliding frame is slidably moved with respect to the base under sliding engagement between a first sliding guide and a second sliding guide so that a pressing block of the pressing member is aligned with the electronic component presses the electronic component. According to the present invention, the pressing member presses the electronic component and exerts a sufficient contact force on the electronic component, and a reaction force caused by the contact force and the elastic restoring force of probes is internally balanced in the device.

公开(公告)号：US11143640B2

公开(公告)日：2021-10-12

申请号：US16540162

申请日：2019-08-14

Applicant: Chroma Ate Inc.

Inventor： Yung-Chih Chen ,  Chien-Ming Chen ,  Yun-Jui Cheng

IPC: G01N33/00

Abstract: A rotating buffer station for a chip mainly comprises an upper cover plate, a rotatable plate, a movable jaw member and a lower base. The upper cover plate is arranged on the lower base and formed with a guide slot. The rotatable plate is located between the lower base and the upper cover plate and formed with a cam slot. The rotatable plate is pivotally coupled to the lower base. The movable jaw member is slidably engaged with the cam slot and the guide slot. When the rotatable plate is rotated, the cam slot forces the movable jaw member to move radially along the guide slot so as to form a chip socket. Accordingly, with rotation of the rotatable plate, the cam slot forces the movable jaw member to move radially along the guide slot so that the chip socket can be resized to hold various differently-sized chips.

公开(公告)号：US10254308B2

公开(公告)日：2019-04-09

申请号：US15480427

申请日：2017-04-06

Applicant: Chroma ATE Inc.

Inventor： Chien-Ming Chen

IPC: G01R1/04 ,  H01R13/629

Abstract: An electronic device testing apparatus with a locking mechanism for locking a press head and a socket plate is provided. When an electronic device is to be tested, a lifting arm is lowered so that a contact portion is in contact with the electronic device, and a locking mechanism is actuated to detain the press head on the socket plate. A pressing force generating device exerts a pressing force onto the electronic device and the socket plate, and at least a portion of a reaction force can be directed back to the locking mechanism. The locking mechanism is adapted to detain the press head on the socket plate. When the pressing force generating device generates a predetermined pressing force to certainly establish electrical connection between the electronic device and the chip socket, the reaction force produced by the chip socket may be distributed over the locking mechanism.

公开(公告)号：US09519024B2

公开(公告)日：2016-12-13

申请号：US14617892

申请日：2015-02-09

Applicant: CHROMA ATE INC.

Inventor： Chien-Ming Chen

IPC: G01R31/28 ,  G01R1/04

CPC classification number: G01R31/2893 ,  G01R1/0433 ,  G01R31/2867 ,  G01R31/2887 ,  G01R31/2896 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012

Abstract: An apparatus for testing a package-on-package semiconductor device comprises a pick and place device for loading a first chip into or unloading the first chip from a test socket and a lifting and rotating arm for moving a chip placement module which receives a second chip to a position between the pick and place device and the test socket. The pick and place device and the chip placement module are lowered, and then a test process is performed. After the test process is completed, the pick and place device and the chip placement module are lifted, and the lifting and rotating arm moves the chip placement module to one side of the pick and place device. Accordingly, a method for testing the semiconductor device could be performed automatically so as to greatly enhance test efficiency and accuracy and to significantly reduce costs.

Abstract translation: 一种用于测试封装封装半导体器件的装置，包括用于将第一芯片从测试插座加载到第一芯片或从其卸载的拾取和放置装置，以及用于移动芯片放置模块的提升和旋转臂，芯片放置模块接收第二芯片 到拾取和放置设备与测试插座之间的位置。 拾取和放置装置和芯片放置模块降低，然后进行测试处理。 测试过程完成后，拾取和放置设备和芯片放置模块被提起，提升和旋转臂将芯片放置模块移动到拾取和放置设备的一侧。 因此，可以自动进行半导体装置的测试方法，大大提高测试效率和精度，并显着降低成本。

公开(公告)号：US09470749B2

公开(公告)日：2016-10-18

申请号：US14108176

申请日：2013-12-16

Applicant: CHROMA ATE INC.

Inventor： Xin-Yi Wu ,  Hsuan-Jen Shen ,  Chien-Ming Chen ,  Chin-Yi Ou Yang

IPC: G01R31/28 ,  G01N1/42

CPC classification number: G01R31/2877 ,  G01N1/42 ,  G01R31/2865

Abstract: A test apparatus includes a test site, a buffer carrying device, a transport carrying device, a handling mechanism and a dry air flow guide mechanism. The test site performs a test procedure on the objects. The buffer carrying device is disposed close to a side of the test site, holds the objects and performs a temperature conditioning process. The transport carrying device is disposed close to another side of the test site, moves back and forth along a transporting direction, transports the objects into and out of the test site, and heats up the objects. The handling mechanism carries the objects among the buffer carrying device, the test site and the transport carrying device. The dry air flow guide mechanism guides a dry air to surround the test site, the buffer carrying device, the transport carrying device and the handling mechanism and generates a dry environment to prevent dew condensation.

Abstract translation: 试验装置包括试验部位，缓冲载体装置，输送装置，搬运机构以及干燥空气引导机构。 测试站点对对象执行测试程序。 缓冲载体装置靠近试验部位的一侧设置，保持物体并进行温度调节处理。 运送装置靠近试验场的另一侧，沿运送方向前后移动，运送物体进出试验场地，并加热物体。 处理机构携带缓冲运送装置，试验部位和运送装置中的物体。 干燥空气流动引导机构引导干燥空气围绕测试场所，缓冲装置，输送装置和处理机构，并产生干燥环境以防止结露。