THIN FILM TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY PANEL

    公开(公告)号:US20170207248A1

    公开(公告)日:2017-07-20

    申请号:US15324791

    申请日:2016-04-07

    Abstract: The application provides a thin film transistor, a method for manufacturing the thin film transistor, and a display panel, the thin film transistor includes a metal electrode, and a step of forming the metal electrode includes: forming a first material layer on a substrate; performing a pattering process on the first material layer to form a groove pattern in the first material layer such that the groove pattern matches with a pattern of the metal electrode to be formed; forming the metal electrode in the groove pattern such that a gap is formed between an edge of the metal electrode and an edge of the groove pattern; forming a protection pattern on the substrate formed with the metal electrode such that the protection pattern covers the metal electrode and its edge. In the application, the protection pattern is formed on the resultant metal electrode and can effectively protect conductive metal.

    DISPLAY SUBSTRATE, MANUFACTURING METHOD AND DRIVING METHOD THEREOF, AND DISPLAY DEVICE

    公开(公告)号:US20170162629A1

    公开(公告)日:2017-06-08

    申请号:US15307090

    申请日:2016-03-31

    Abstract: A display substrate, a manufacturing method and a driving method thereof, and a display device are provided. The display substrate includes a substrate, a gate layer disposed on the substrate, a gate insulating layer disposed on the gate layer, a pixel defining layer disposed on the gate insulating layer, the pixel defining layer includes a plurality of defining regions, a light emitting layer in the defining regions of the pixel defining layer disposed on the gate insulating layer, wherein the light emitting layer includes an electron excitation layer, a light excitation layer and a hole excitation layer, and a source/drain layer disposed on the light emitting layer. According to an embodiment of the present disclosure, light emission and control of light emission can be realized merely by a three-layer structure of a gate layer, a light emitting layer and a source/drain layer, and compared with the OLED light emitting structure of the prior art, the layer structure is simpler, the light emitted is less blocked, and luminous efficiency is higher.

    METHOD FOR FABRICATING FLEXIBLE SUBSTRATE AND FLEXIBLE SUBSTRATE PREFABRICATED COMPONENT
    14.
    发明申请
    METHOD FOR FABRICATING FLEXIBLE SUBSTRATE AND FLEXIBLE SUBSTRATE PREFABRICATED COMPONENT 有权
    柔性基板和柔性基板预制构件的制作方法

    公开(公告)号:US20160262256A1

    公开(公告)日:2016-09-08

    申请号:US14353389

    申请日:2013-12-12

    Abstract: A method for fabricating a flexible substrate and a flexible substrate prefabricated component are disclosed, the flexible substrate comprises an electronic device and a flexible layer provided with the electronic device. The fabrication method comprises: disposing a single-sided adhesive layer at a central portion of a surface of a support substrate, an adhesive side of the single-sided adhesive layer being in contact with the support substrate; disposing a double-sided adhesive layer at a peripheral region of the support substrate; disposing the flexible layer on surfaces of the single-sided adhesive layer and the double-sided adhesive layer, the flexible layer being bonded to the double-sided adhesive layer; disposing the electronic device in a region of a surface of the flexible layer corresponding to the single-sided adhesive layer; cutting the flexible layer along a boundary of the electronic device and removing the flexible layer from the single-sided adhesive layer.

    Abstract translation: 公开了一种用于制造柔性基板和柔性基板预制部件的方法,柔性基板包括电子装置和设置有电子装置的柔性层。 制造方法包括:在支撑基板的表面的中心部分处设置单面粘合剂层,单面粘合剂层的粘合剂侧与支撑基板接触; 在支撑基板的周边区域设置双面粘合剂层; 将柔性层设置在单面粘合剂层和双面粘合剂层的表面上,柔性层粘合到双面粘合剂层上; 将所述电子器件设置在与所述单面粘合剂层相对应的所述柔性层的表面的区域中; 沿着电子设备的边界切割柔性层并从柔性层从单面粘合剂层移除。

    METHOD FOR MANUFACTURING THIN FILM TRANSISTOR, AND THIN FILM TRANSISTOR

    公开(公告)号:US20230317826A1

    公开(公告)日:2023-10-05

    申请号:US18022620

    申请日:2022-03-09

    CPC classification number: H01L29/66742 H01L29/401 H01L29/7869

    Abstract: A method for manufacturing a thin film transistor, and a thin film transistor are provided. The method includes: forming an active layer on a substrate by a single patterning process; forming a gate insulating layer by deposition on a side of the active layer away from the substrate; forming a first via hole and a second via hole penetrating through the gate insulating layer by a single patterning process, the first and second via holes being located at two ends of the active layer respectively; and forming a first electrode, a gate electrode, and a second electrode on the gate insulating layer by a single patterning process, the first and second electrodes being connected to the active layer through the first and second via holes, respectively, and an orthographic projection of the gate electrode on the substrate at least partially overlapping that of the active layer on the substrate.

    DISPLAY COVER PLATE, METHOD FOR MANUFACTURING THE SAME AND DISPLAY DEVICE

    公开(公告)号:US20210191213A1

    公开(公告)日:2021-06-24

    申请号:US16908547

    申请日:2020-06-22

    Abstract: A display cover plate, a manufacturing method therefor and a display device are provided, The display cover plate includes: a substrate; and an electrochromic unit on the substrate, the electrochromic unit includes: a first electrode on the substrate; an electrochromic layer on a side of the first electrode away from the substrate; and a second electrode on a side of the electrochromic layer away from the substrate, wherein the first electrode and the second electrode are configured to generate an electric field, and the electrochromic layer allows light of different colors to pass through based on a change of the electric field.

    THIN FILM TRANSISTOR, METHOD OF FABRICATING THIN FILM TRANSISTOR AND ARRAY SUBSTRATE

    公开(公告)号:US20190267493A1

    公开(公告)日:2019-08-29

    申请号:US16330990

    申请日:2018-08-27

    Abstract: The present application provides a thin film transistor, a method of fabricating a thin film transistor and an array substrate. The thin film transistor includes: a gate electrode on a substrate and having first and second side surfaces facing each other; and an active layer between the first side surface and the second side surface of the gate electrode and having a third side surface and a fourth side surface. The third side surface of the active layer and the first side surface of the gate electrode face and are spaced apart from each other, the fourth side surface of the active layer and the second side surface of the gate electrode face and are spaced apart from each other, and at least one portion of the gate electrode is in the same range as at least one portion of the active layer in a height direction.

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