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11.发明授权公开(公告)号：US09685252B2
公开(公告)日：2017-06-20
申请号：US14527518
申请日：2014-10-29
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Can Wang , Fang Liu , Yingwei Liu
CPC classification number: H01B1/023 , B32B15/017 , C23C14/16 , C23C14/18
Abstract: The present disclosure relates to an aluminum electrode, a method of forming an aluminum electrode and an electronic device therewith. An aluminum electrode according to one aspect of the present disclosure comprises: a bottom layer consisting of molybdenum; a top layer consisting of molybdenum; and an aluminum layer located between the bottom layer and the top layer, wherein the bottom layer, the top layer and the aluminum layer are formed at a temperature below 120° C. An aluminum electrode according to one embodiment of the present disclosure eliminates the mouse bite phenomenon. An aluminum electrode according to another aspect of the present disclosure comprises: a bottom layer consisting of a metal or metal-alloy nitride; a top layer consisting of molybdenum; and an aluminum layer located between the bottom layer and the top layer, wherein the bottom layer, the top layer and the aluminum layer are formed at a temperature below 120° C. An aluminum electrode according to another embodiment of the present disclosure eliminates both of the mouse bite phenomenon and the undercut phenomenon, and can further arrive at a desired profile angle by controlling the content of nitrogen.
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12.发明授权公开(公告)号：US09627546B2
公开(公告)日：2017-04-18
申请号：US14535772
申请日：2014-11-07
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
IPC: H01L29/786 , H01L29/66 , H01L29/24 , H01L21/02 , H01L27/12
CPC classification number: H01L29/7869 , H01L21/02118 , H01L27/1225 , H01L27/1248 , H01L29/24 , H01L29/66969 , H01L29/78633
Abstract: An oxide thin film transistor, an array substrate, methods of manufacturing the same and a display device are disclosed. The oxide thin film transistor includes: a base substrate; and a gate electrode, a gate insulating layer, an oxide active layer, drain/source electrodes sequentially disposed on the base substrate. The oxide TFT transistor further includes an ultraviolet barrier layer disposed on the oxide active layer, the ultraviolet barrier layer is made of a resin material contains an ultraviolet absorbent. The stability of the oxide TFT is enhanced by disposing the ultraviolet barrier layer over the oxide active layer of the oxide TFT, since the ultraviolet barrier layer blocks the impact of UV light on the oxide TFT.
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公开(公告)号：US09613986B2
公开(公告)日：2017-04-04
申请号：US14388182
申请日：2013-10-31
IPC: H01L27/12 , H01L29/786 , G02F1/1343 , G02F1/1362 , G02F1/1368
CPC classification number: H01L27/124 , G02F1/136286 , G02F1/1368 , G02F2001/134372 , H01L27/1222 , H01L27/1288 , H01L29/78642
Abstract: An array substrate including: a base substrate and a thin film transistor unit provided on the base substrate; the thin film transistor unit comprises: a first gate electrode provided on the base substrate, a gate insulating layer provided on the first gate electrode, a source electrode disposed in a same layer as the first gate electrode, an active layer provided on the source electrode, a drain electrode provided on the active layer, and the gate insulating layer disposed between the first gate electrode and the source electrode. This array substrate reduces a channel length of a conducting channel of the thin film transistor unit, and meanwhile increases an aperture ratio of a pixel.
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公开(公告)号：US20250022886A1
公开(公告)日：2025-01-16
申请号：US18548962
申请日：2022-10-28
Applicant: BOE Technology Group Co., Ltd.
Inventor： Jinxiang Xue , Zhongyuan Sun , Wenqi Liu , Che An , Weijie Wang , Fengjie Zhang , Fang Liu
IPC: H01L27/12
Abstract: A display substrate and a display device relate to the technical field of displaying. The display substrate includes a plurality of display units spaced apart from each other and a plurality of connecting units, the plurality of connecting units being connected between two adjacent display units; the plurality of connecting units including: two connecting units arranged along a first direction, wherein the first direction is parallel to a stretching direction of the display substrate; wherein the two connecting units arranged along the first direction are axisymmetric about a first reference line, so that the plurality of connecting units arranged along a second direction have a same deformation amount in a stretching state, the second direction is perpendicular to the stretching direction, and an extension direction of the first reference line is parallel to the second direction.
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Patent Agency Ranking
公开(公告)号：US20250008784A1
公开(公告)日：2025-01-02
申请号：US18264041
申请日：2022-11-17
Applicant: BOE Technology Group Co., Ltd.
Inventor： Hao Zhang , Pinfan Wang , Fang Liu
IPC: H10K59/126 , G09G3/3233 , G09G3/3266 , H10K59/131
Abstract: A display substrate is provided. The display substrate includes a display substrate, comprising one or more scan circuits and one or more electrostatic discharge protection circuits in a peripheral area. An electrostatic discharge protection circuit is configured to provide a start signal to a scan unit of a scan circuit. The display substrate comprises a plurality of islands and a plurality of bridges connecting the plurality of islands in the peripheral area; a respective island of the plurality of islands comprises at least one scan unit of the scan circuit; and one or more signal lines connecting the electrostatic discharge protection circuit and the scan unit is at least partially in an individual bridge connecting the electrostatic discharge protection circuit and the scan unit.
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公开(公告)号：US11387212B2
公开(公告)日：2022-07-12
申请号：US16346008
申请日：2018-03-14
Applicant: BOE Technology Group Co., Ltd.
Inventor： Guan Huang , Yijie Huo , Fang Liu
Abstract: The present application discloses a method for transferring a plurality of micro light emitting diodes (micro LEDs) to a target substrate. The method includes providing a first substrate having an array of the plurality of micro LEDs; providing a target substrate having a bonding layer having a plurality of bonding contacts; applying the plurality of bonding contacts with an electrical potential; aligning the plurality of micro LEDs with the plurality of bonding contacts having the electrical potential; and transferring the plurality of micro LEDs in the first substrate onto the target substrate.
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公开(公告)号：US20210335752A1
公开(公告)日：2021-10-28
申请号：US16346008
申请日：2018-03-14
Applicant: BOE Technology Group Co., Ltd.
Inventor： Guan Huang , Yijie Huo , Fang Liu
Abstract: The present application discloses a method for transferring a plurality of micro light emitting diodes (micro LEDs) to a target substrate. The method includes providing a first substrate having an array of the plurality of micro LEDs; providing a target substrate having a bonding layer having a plurality of bonding contacts; applying the plurality of bonding contacts with an electrical potential; aligning the plurality of micro LEDs with the plurality of bonding contacts having the electrical potential; and transferring the plurality of micro LEDs in the first substrate onto the target substrate.
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公开(公告)号：US11127350B2
公开(公告)日：2021-09-21
申请号：US16071667
申请日：2017-08-02
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Cuili Gai , Zhongyuan Wu , Baoxia Zhang , Ling Wang , Yicheng Lin , Quanhu Li , Fang Liu
IPC: G06F3/038 , G09G5/00 , G09G3/3258 , G09G3/3233 , G09G3/3291
Abstract: A pixel circuit includes a first transistor having a bottom gate and a top gate, a drain supplied with a high-level power-supply voltage, and a source coupled to a light-emitting diode (LED). The bottom gate is provided with a first voltage signal and the source is provided with a second voltage signal in a compensation period during which a present value of a threshold voltage of the first transistor is sensed at the source and a third voltage signal is determined based on the present value of the threshold voltage. The top gate is configured to be provided with the third voltage signal in an emission period to reduce the present value of the threshold voltage.
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19.发明授权公开(公告)号：US10371882B2
公开(公告)日：2019-08-06
申请号：US15982031
申请日：2018-05-17
Inventor： Lianjie Qu , Huijuan Wang , Yonglian Qi , Bingqiang Gui , Fang Liu , Hebin Zhao , Huipeng Guo
Abstract: The present disclosure relates to a manufacturing method for a light adjusting structure, a light adjusting structure, a backlight module and a display device. The manufacturing method includes: providing a light guide plate; forming a substrate having a plurality of micro structures; and placing the micro structures upside down on a light exit surface of the light guide plate; heating the light guide plate; adhering the tips of the micro structures to the light guide plate; cooling the light guide plate; and forming a first reflective layer on the side surface of each micro structure.
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