公开(公告)号：US11387212B2

公开(公告)日：2022-07-12

申请号：US16346008

申请日：2018-03-14

Applicant: BOE Technology Group Co., Ltd.

Inventor： Guan Huang ,  Yijie Huo ,  Fang Liu

IPC: H01L23/00 ,  H01L33/00 ,  H01L25/16

Abstract: The present application discloses a method for transferring a plurality of micro light emitting diodes (micro LEDs) to a target substrate. The method includes providing a first substrate having an array of the plurality of micro LEDs; providing a target substrate having a bonding layer having a plurality of bonding contacts; applying the plurality of bonding contacts with an electrical potential; aligning the plurality of micro LEDs with the plurality of bonding contacts having the electrical potential; and transferring the plurality of micro LEDs in the first substrate onto the target substrate.

公开(公告)号：US20210335752A1

公开(公告)日：2021-10-28

申请号：US16346008

申请日：2018-03-14

Applicant: BOE Technology Group Co., Ltd.

Inventor： Guan Huang ,  Yijie Huo ,  Fang Liu

IPC: H01L23/00 ,  H01L25/16 ,  H01L33/00

Abstract: The present application discloses a method for transferring a plurality of micro light emitting diodes (micro LEDs) to a target substrate. The method includes providing a first substrate having an array of the plurality of micro LEDs; providing a target substrate having a bonding layer having a plurality of bonding contacts; applying the plurality of bonding contacts with an electrical potential; aligning the plurality of micro LEDs with the plurality of bonding contacts having the electrical potential; and transferring the plurality of micro LEDs in the first substrate onto the target substrate.