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11.发明申请THIN FILM TRANSISTOR, MANUFACTURING METHOD THEREOF, ARRAY SUBSTRATE AND DISPLAY DEVICE 审中-公开薄膜晶体管，其制造方法，阵列基板和显示器件公开(公告)号：US20150295094A1
公开(公告)日：2015-10-15
申请号：US14342234
申请日：2013-07-29
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Qingrong Ren , Wei Guo , Qianqian Bu , Lei Zhao , Lu Wang , Zhiqiang Jiang
IPC: H01L29/786 , H01L21/306 , H01L29/45 , H01L21/285 , H01L29/66 , H01L21/02
CPC classification number: H01L29/78675 , H01L21/02532 , H01L21/02592 , H01L21/02667 , H01L21/28568 , H01L21/30604 , H01L21/31116 , H01L21/76802 , H01L21/76841 , H01L29/456 , H01L29/66757
Abstract: A thin film transistor, a manufacturing method thereof, an array substrate and a display device are provided. The method for manufacturing the thin film transistor including: forming an active layer; forming an etch barrier layer on the active layer at a position for forming interlayer via holes subsequently; forming an insulating layer on the active layer and the etch barrier layer, and forming the interlayer via holes in the insulating layer to expose the etch barrier layer.
Abstract translation: 提供薄膜晶体管，其制造方法，阵列基板和显示装置。 薄膜晶体管的制造方法，其特征在于，包括：形成有源层; 在随后形成中间通孔的位置上在活性层上形成蚀刻阻挡层; 在有源层和蚀刻阻挡层上形成绝缘层，以及在绝缘层中形成中间层通孔以露出蚀刻阻挡层。
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公开(公告)号：US11088314B2
公开(公告)日：2021-08-10
申请号：US16225419
申请日：2018-12-19
Applicant: BOE Technology Group Co., Ltd.
Inventor： Lei Zhao
IPC: H01L41/08 , H01L41/297 , H01L41/09 , B81C1/00 , H01L41/332 , B81B7/04 , H01L41/113 , H01L41/23
Abstract: The present disclosure provides an ultrasonic transducer and a method for manufacturing an ultrasonic transducer, a display substrate and a method for manufacturing a display substrate. The method for manufacturing the ultrasonic transducer includes: forming a via hole in a substrate; forming a structural layer on a side of the substrate, the structural layer cover the via hole; and etching the structural layer from a side of the substrate away from the structural layer by using the substrate formed with the via hole as a blocking layer, to form a cavity at a position of the structural layer corresponding to that of the via hole.
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公开(公告)号：US11013121B2
公开(公告)日：2021-05-18
申请号：US16301397
申请日：2018-03-22
Inventor： Zhifu Yang , Zhiyang Cui , Dahua Zhu , Lei Zhao
Abstract: The present disclosure relates to a circuit bonding structure, a circuit bonding method, and a display device. The circuit bonding structure includes a carrying portion configured to carry a driving circuit and having two sides which are adjacent to each other and form a preset acute angle and a preset circuit board having a bonding region having two sides which are adjacent to each other and form a preset acute angle. The driving circuit is bonded to the bonding region by the carrying portion.
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14.发明申请公开(公告)号：US20150323592A1
公开(公告)日：2015-11-12
申请号：US14497861
申请日：2014-09-26
IPC: G01R31/28 , H01R13/635
CPC classification number: G02F1/1309 , G01R31/2889 , H01R13/635
Abstract: The present disclosure provides a connector disengagement apparatus and an inspection system for a liquid crystal display module. The connector disengagement apparatus comprises a first member, a second member, a third member, a rotation axle and a stiffener carrying a part of a connector, one end of the first member being connected to one end of the second member, the other end of the first member being arranged towards the stiffener, the other end of the second member being connected to the third member, wherein the second member is rotatable about the rotation axle. The connector disengagement apparatus acts on the stiffener in a down-to-up direction to lift the stiffener to interrupt efficiently the connection of the connector. In the disengagement process, the pins of the connector will not be damaged as the force of the disengagement apparatus is not directly applied onto the connector.
Abstract translation: 本公开提供了一种用于液晶显示模块的连接器分离装置和检查系统。 连接器分离装置包括第一构件，第二构件，第三构件，旋转轴和承载连接器的一部分的加强件，第一构件的一端连接到第二构件的一端，另一端 所述第一构件朝向所述加强件布置，所述第二构件的另一端连接到所述第三构件，其中所述第二构件可绕所述旋转轴旋转。 连接器分离装置在向下 - 向上的方向上作用在加强件上以提升加强件以有效地中断连接器的连接。 在分离过程中，由于分离装置的力不直接施加到连接器上，连接器的销不会被损坏。
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公开(公告)号：US20220059631A1
公开(公告)日：2022-02-24
申请号：US17416417
申请日：2020-11-11
Applicant: BOE Technology Group Co., Ltd.
Inventor： Yongfeng Zhang , Xue Dong , Zhiqiang Jiao , Lei Zhao , Jiushi Wang
Abstract: Disclosed are a preparation method of a display panel, a display panel and a displaying device. The display panel comprises a plurality of first-color subpixels, and each first-color subpixel comprises a base, the base comprising a first driving electrode and a second driving electrode; a flat layer disposed on the side, near the first driving electrode and the second driving electrode, of the base; a patterned passivation layer and at least one first electrode disposed on the side, away from the base, of the flat layer, the first electrode being connected with the first driving electrode through via holes penetrating the flat layer; and at least one second electrode disposed on the side, away from the base, of the passivation layer, the second electrode being connected with the second driving electrode through via holes penetrating the passivation layer and the flat layer.
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Patent Agency Ranking
公开(公告)号：US11239292B2
公开(公告)日：2022-02-01
申请号：US16476578
申请日：2018-08-27
Applicant: BOE Technology Group Co., Ltd.
Inventor： Jiangbo Chen , Youngsuk Song , Wenjun Hou , Lei Zhao , Guoying Wang
Abstract: Provided are an array substrate, a display panel, a display apparatus and a preparation method therefor. The array substrate comprises: a base substrate; and multiple pixel units arranged on one side of the base substrate, each of the pixel units comprising: a thin-film transistor and an electroluminescent structure, and a shading structure located between the thin-film transistor and the base substrate, wherein the thin-film transistor comprises: an active layer located on one side, away from the base substrate, of the shading structure; the electroluminescent structure comprises: first electrodes for driving the pixel units; and one of the shading structure and the active layer is a same-layer structure fabricated by the same mask plate as the first electrodes so as to reduce the number of mask procedures required in preparation of an array substrate.
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公开(公告)号：US20210022251A1
公开(公告)日：2021-01-21
申请号：US16301397
申请日：2018-03-22
Inventor： Zhifu Yang , Zhiyang Cui , Dahua Zhu , Lei Zhao
Abstract: The present disclosure relates to a circuit bonding structure, a circuit bonding method, and a display device. The circuit bonding structure includes a carrying portion configured to carry a driving circuit and having two sides which are adjacent to each other and form a preset acute angle and a preset circuit board having a bonding region having two sides which are adjacent to each other and form a preset acute angle. The driving circuit is bonded to the bonding region by the carrying portion.
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公开(公告)号：US10468271B2
公开(公告)日：2019-11-05
申请号：US16108185
申请日：2018-08-22
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Qingzhao Liu , Jiushi Wang , Lei Zhao
IPC: H01L21/321 , H01L21/3213 , H01L29/786 , H01L29/66 , H01L29/423
Abstract: A dry etching method, including: etching a silicon-containing thin film with a first gas by a first preset thickness; etching the silicon-containing thin film with a second gas by a second preset thickness, to remove etching residues generated after etching the silicon-containing thin film by the first preset thickness; after the etching residues are removed, etching the silicon-containing thin film with the first gas by a third preset thickness, which is less than the first preset thickness; wherein the first gas includes chlorine gas, and the second gas includes fluoride gas.
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公开(公告)号：US09947713B2
公开(公告)日：2018-04-17
申请号：US14894865
申请日：2015-05-15
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Lei Zhao
IPC: H01L31/062 , H01L31/113 , H01L21/00 , H01L27/146 , H01L31/105 , G01T1/20 , H01L31/0224 , H01L31/18
CPC classification number: H01L27/14663 , G01T1/2018 , H01L27/14612 , H01L27/14692 , H01L27/14696 , H01L31/022408 , H01L31/105 , H01L31/1884
Abstract: A detection substrate and a manufacturing method thereof, and a detector are provided. The detection substrate comprises a base substrate, a thin film transistor, a PIN photodiode and a scintillation layer. The thin film transistor and the PIN photodiode are provided above a first face of the base substrate and the scintillation layer is provided above a second face of the base substrate. The visible light obtained after the X-ray passes through the scintillation layer is directly irradiated on the PIN photodiode after passing through the base substrate with relative high transmittance, thus preventing intensity of the light irradiated on the PIN photodiode from being weakened, and improving light utilization efficiency of the detection substrate.
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20.发明授权公开(公告)号：US09627414B2
公开(公告)日：2017-04-18
申请号：US14771267
申请日：2014-12-24
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
IPC: H01L29/786 , H01L27/12 , H01L21/34 , H01L21/02 , H01L21/027 , H01L21/467 , H01L21/4757 , H01L29/24 , H01L29/423 , H01L29/66
CPC classification number: H01L27/1225 , H01L21/02186 , H01L21/02266 , H01L21/02565 , H01L21/0273 , H01L21/31122 , H01L21/34 , H01L21/467 , H01L21/47573 , H01L27/12 , H01L27/124 , H01L27/1288 , H01L29/24 , H01L29/42356 , H01L29/66969 , H01L29/786 , H01L29/7869 , H01L29/78696
Abstract: The present invention provides a metallic oxide thin film transistor and its manufacturing method, an array substrate and its manufacturing method, as well as a display device, which is belong to the field of thin film transistor manufacturing technology. The method for manufacturing the metallic oxide thin film transistor comprises a step of forming patterns of an oxide active layer and an etch stopping layer through a one-time patterning process.
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