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公开(公告)号：US20200048744A1
公开(公告)日：2020-02-13
申请号：US16530830
申请日：2019-08-02
Applicant: Apple Inc.
Inventor： Brian M. Gable , Herng-Jeng Jou , Weiming Huang , Graeme W. Paul , William A. Counts , Eric W. Hamann , Katie L. Sassaman , Abhijeet Misra , Zechariah D. Feinberg , James A. Yurko , Brian P. Demers , Rafael Yu , Anuj Datta Roy , Susannah P. Calvin
Abstract: The disclosure provides an aluminum alloy may include iron (Fe) of at least 0.10 wt %, silicon (Si) of at least 0.35 wt %, and magnesium (Mg) of at least 0.45 wt %, manganese (Mn) in amount of at least 0.005 wt %, and additional elements, the remaining wt % being Al and incidental impurities.
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公开(公告)号：US20180016667A1
公开(公告)日：2018-01-18
申请号：US15406153
申请日：2017-01-13
Applicant: Apple Inc.
Inventor： Abhijeet Misra , James A. Wright , Herng-Jeng Jou
Abstract: The disclosure provides aluminum alloys having varying ranges of alloying elements and properties.
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公开(公告)号：US20230227947A1
公开(公告)日：2023-07-20
申请号：US18082980
申请日：2022-12-16
Applicant: Apple Inc.
Inventor： Herng-Jeng Jou , Isabel Yang , Sonja R. Postak , Tyler J. Harrington , James A. Curran , Todd S. Mintz , Abhijeet Misra
Abstract: The disclosure provides aluminum alloys having varying ranges of alloying elements and properties.
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公开(公告)号：US11207795B1
公开(公告)日：2021-12-28
申请号：US16137434
申请日：2018-09-20
Applicant: Apple Inc.
Inventor： Jeffrey L. Mattlin , Abhijeet Misra , Herng-Jeng Jou , James A. Wright , James A. Yurko , Lei Gao , Weiming Huang , William A. Counts
Abstract: A mold apparatus to form a ceramic (or glass) includes a first mold portion having a first coefficient of thermal expansion and a second mold portion having a second coefficient of thermal expansion. In some embodiments, the first mold portion and/or the second mold portion are substantially immiscible with the ceramic material, such as silicon oxide, at a temperature greater than 600° C. In some embodiments, the first coefficient of thermal expansion and the second coefficient of thermal expansion are substantially similar to that of the glass or ceramic material. In some embodiments, the first coefficient of thermal expansion is different from the second coefficient of thermal expansion. In some embodiments, the first mold portion and the second mold portion contain a surface coating and a passivation layer.
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公开(公告)号：US20210087664A1
公开(公告)日：2021-03-25
申请号：US17020346
申请日：2020-09-14
Applicant: Apple Inc.
Inventor： Eric W. Hamann , Weiming Huang , Brian M. Gable , Herng-Jeng Jou , William A. Counts
Abstract: An aluminum alloy that may include 0.45 to 0.85 wt % Si, 0.15 to 0.25 wt % Cu, 0.40 to 0.80 wt % Fe, 1.20 to 1.65 wt % Mg, and 0.80 to 1.10 wt % Mn, where the balance is aluminum and incidental impurities. The alloy can include used beverage can (UBC) scrap.
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Patent Agency Ranking
公开(公告)号：US12000030B2
公开(公告)日：2024-06-04
申请号：US17661695
申请日：2022-05-02
Applicant: Apple Inc.
Inventor： Herng-Jeng Jou , Jacob L. Smith , Weiming Huang
CPC classification number: C22C9/00 , C23C14/14 , C23C14/34 , C25D3/38 , H01M4/662 , H01M10/0525 , C22C2200/00 , H01M2004/021
Abstract: A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include a Copper-Silver alloy (Cu—Ag) with between about 0.5-2 at %-Ag.
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公开(公告)号：US11985781B2
公开(公告)日：2024-05-14
申请号：US17446432
申请日：2021-08-30
Applicant: Apple Inc.
Inventor： Herng-Jeng Jou , Hoishun Li , James A. Yurko
CPC classification number: H05K5/0286 , B21D22/02 , H04M1/026
Abstract: A component for an electronic device can include a metal injection molded (MIM) metallic body that at least partially defines an exterior surface. The metallic body can have an average porosity less than 1% in a first region that extends from the external surface to a depth of at least 100 microns below the external surface, and an average porosity greater than 1% in a second region adjacent to the first region.
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公开(公告)号：US20220095467A1
公开(公告)日：2022-03-24
申请号：US17446432
申请日：2021-08-30
Applicant: Apple Inc.
Inventor： Herng-Jeng Jou , Hoishun Li , James A. Yurko
Abstract: A component for an electronic device can include a metal injection molded (MIM) metallic body that at least partially defines an exterior surface. The metallic body can have an average porosity less than 1% in a first region that extends from the external surface to a depth of at least 100 microns below the external surface, and an average porosity greater than 1% in a second region adjacent to the first region.
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公开(公告)号：US20210388468A1
公开(公告)日：2021-12-16
申请号：US17344711
申请日：2021-06-10
Applicant: Apple Inc.
Inventor： Herng-Jeng Jou , Brian M. Gable , Katie L. Sassaman
Abstract: The disclosure provides an aluminum alloy including iron (Fe) in an amount of 0.10 wt % to 0.50 wt %; silicon (Si) in an amount of 0.50 wt % to 1.00 wt %; magnesium (Mg) in amount of 0.50 wt % to 0.90 wt %; one of manganese (Mn) or chromium (Cr) in amount from 0.040 to 0.500 wt %; additional non-aluminum (Al) elements in an amount not exceed 3.5 wt %; and the remaining wt % being Al and incidental impurities, wherein the alloy has a Mg/Si ratio of equal to or greater than 0.90.
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公开(公告)号：US20200157669A1
公开(公告)日：2020-05-21
申请号：US16654855
申请日：2019-10-16
Applicant: Apple Inc.
Inventor： Abhijeet Misra , James A. Wright , Herng-Jeng Jou
Abstract: The disclosure provides aluminum alloys having varying ranges of alloying elements and properties.
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