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公开(公告)号：US09318666B2
公开(公告)日：2016-04-19
申请号：US14085804
申请日：2013-11-21
Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
Inventor： Hsing-Fen Lo , Lung-Hsin Chen
IPC: H01L21/00 , H01L27/15 , H01L29/267 , H01L31/12 , H01L33/00 , H01L33/48 , H01L23/00 , H01L33/54 , H01L33/62
CPC classification number: H01L33/486 , H01L24/97 , H01L33/54 , H01L33/62 , H01L2224/16245 , H01L2224/80047 , H01L2924/12041 , H01L2924/181 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: An LED device includes a substrate having a top surface and a bottom surface. The substrate defines a through hole at a center thereof. The LED device also includes an electrode board. The electrode board defines a concave portion at a center thereof, and a convex portion connected to and surrounding two sides of the concave portion. The concave portion includes a first electrode and a second electrode isolated from each other, and is located in the through hole of the substrate. A bottommost surface of the concave portion is substantially coplanar with the bottom surface of the substrate, and a top surface of the convex portion is substantially coplanar with the top surface of the substrate. An LED chip is arranged on the concave portion, and is electrically connected to the first electrode and the second electrode. A method for manufacturing plural such LED devices is also provided.
Abstract translation: LED装置包括具有顶表面和底表面的基底。 基板在其中心处形成通孔。 LED装置还包括电极板。 电极板在其中央形成有凹部，与凹部的两侧连接并包围的凸部。 凹部包括彼此隔离的第一电极和第二电极，并且位于基板的通孔中。 凹部的最下表面与基板的底面基本共面，并且凸部的顶面与基板的顶面基本共面。 LED芯片设置在凹部上，与第一电极和第二电极电连接。 还提供了一种用于制造多个这样的LED器件的方法。
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公开(公告)号：US09065028B2
公开(公告)日：2015-06-23
申请号：US14096031
申请日：2013-12-04
Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
Inventor： Hou-Te Lin , Chao-Hsiung Chang , Pin-Chuan Chen , Lung-Hsin Chen
CPC classification number: H01L33/60 , H01L33/44 , H01L33/486 , H01L33/62 , H01L2224/13 , H01L2924/0002 , H01L2924/00
Abstract: An exemplary light emitting diode (LED) package includes a substrate, a first electrode penetrating downward through the substrate, a second electrode penetrating downward through the substrate and spaced from the first electrode, an LED die arranged on the substrate and mounted to the first and second electrodes by flip-chip technology, and an encapsulation layer formed on the substrate to encapsulate the LED die therein. The substrate includes a top surface and a bottom surface at opposite sides thereof. Top ends of the first and second electrodes are exposed at the top surface of the substrate, and bottom ends of the first and second electrodes are exposed at the bottom surface of the substrate. A moisture barrier layer is attached on the bottom of the LED package to cover a joint of the first and/or second electrode and the substrate.
Abstract translation: 示例性发光二极管（LED）封装包括衬底，穿过衬底向下穿过的第一电极，穿过衬底向下穿过并与第一电极间隔开的第二电极，布置在衬底上并安装到第一和 通过倒装芯片技术的第二电极，以及形成在基板上以将LED管芯封装在其中的封装层。 基板包括在其相对侧的顶表面和底表面。 第一电极和第二电极的顶端在基板的顶表面露出，第一和第二电极的底端在基板的底表面露出。 在LED封装的底部附着防潮层，以覆盖第一和/或第二电极和基板的接头。
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公开(公告)号：US09041022B2
公开(公告)日：2015-05-26
申请号：US14011682
申请日：2013-08-27
Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
Inventor： Che-Hsang Huang , Pin-Chuan Chen , Lung-Hsin Chen , Wen-Liang Tseng , Yu-Liang Huang
IPC: H01L33/36 , H01L25/075 , H01L23/00 , H01L33/62
CPC classification number: H01L33/36 , H01L24/97 , H01L25/0753 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
Abstract: An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Front side and rear side faces of the first and second electrodes are exposed out of a front side face and a rear side face of the substrate whereby the front or rear side faces of the first and second electrodes can connect with welding pads of a printed circuit board. Circumferential side faces of the third electrode are encapsulated in the substrate.
Abstract translation: 示例性发光二极管（LED）封装包括电绝缘基板，嵌入绝缘基板中的电极结构以及分别与电极结构的电极电连接的多个LED芯片。 电极结构包括位于第一和第二电极之间的第一电极，第二电极和第三电极。 第一，第二和第三电极的顶表面露出绝缘衬底的顶表面以支撑LED芯片。 第一和第二电极的前侧面和后侧面从基板的前侧面和后侧面露出，由此第一和第二电极的前侧面和后侧面可与印刷电路板的焊盘连接 板。 第三电极的周向侧面被封装在基板中。
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公开(公告)号：US08981447B2
公开(公告)日：2015-03-17
申请号：US14014424
申请日：2013-08-30
Applicant: Advanced Optoelectronic Technology, Inc.
Inventor： Hou-Te Lin , Pin-Chuan Chen , Lung-Hsin Chen
CPC classification number: H01L33/486 , H01L33/48 , H01L33/483 , H01L33/52 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2924/0002 , H01L2924/00014 , H01L2924/00
Abstract: An LED package includes a first electrode, a second electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED chip. The first electrode includes a first main portion and a first connecting portion extending outwardly from the first main portion. The first connecting portion has a first connecting face away from the first main portion. The second electrode includes a second main portion and a second connecting portion extending outwardly from the second main portion. The second connecting portion has a second connecting face away from the second main portion. The first main portion and the second main portion are embedded into the receiving cup, and the first connecting face of the first connecting portion and the second connecting face of the second connecting portion are exposed outside the receiving cup.
Abstract translation: LED封装包括第一电极，第二电极，连接第一电极和第二电极的反射杯以及LED芯片。 第一电极包括第一主要部分和从第一主要部分向外延伸的第一连接部分。 第一连接部分具有远离第一主要部分的第一连接面。 第二电极包括从第二主要部分向外延伸的第二主要部分和第二连接部分。 第二连接部分具有远离第二主要部分的第二连接面。 第一主要部分和第二主要部分嵌入到接收杯中，并且第一连接部分的第一连接面和第二连接部分的第二连接面暴露在接收杯的外部。
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公开(公告)号：US10705376B2
公开(公告)日：2020-07-07
申请号：US15800165
申请日：2017-11-01
Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
Inventor： Hsin-Chiang Lin , Chien-Cheng Kuo , Pin-Chuan Chen , Lung-Hsin Chen , Wen-Liang Tseng
IPC: G02F1/1335 , G02F1/13357
Abstract: A liquid crystal display device comprises a backlight module and a liquid crystal display module in a light emitting path of the backlight module. The liquid crystal display module includes a first conductive substrate facing the backlight module, a second conductive substrate spaced apart from the first conductive substrate, and a liquid crystal layer sandwiched between the first conductive substrate and the second conductive substrate. The second conductive substrate includes a transparent substrate, a color filter layer formed on the transparent substrate, and a light converting layer formed on the color filter layer, and a transparent conductive layer formed on the light converting layer.
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Patent Agency Ranking
公开(公告)号：US09899587B2
公开(公告)日：2018-02-20
申请号：US15434173
申请日：2017-02-16
Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
Inventor： Yau-Tzu Jang , Yu-Liang Huang , Wen-Liang Tseng , Pin-Chuan Chen , Lung-Hsin Chen , Hsing-Fen Lo , Chao-Hsiung Chang , Che-Hsang Huang , Yu-Lun Hsieh
IPC: H01L33/62 , H01L33/64 , H01L25/075 , H01L33/60 , H01L25/16 , H01L29/866 , H01L33/52 , H01L27/02 , H01L33/50 , H01L33/56
CPC classification number: H01L33/647 , H01L25/0753 , H01L25/167 , H01L27/0248 , H01L29/866 , H01L33/502 , H01L33/52 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48137
Abstract: A lead frame for an LED package includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes separated first and second connecting surfaces. Top surfaces of the bonding electrode, the first connecting electrode, and the second connecting electrode are exposed, and support and electrically connect with light emitting chips. LED packages can be mounted on the lead frame and electrically connect with each other. The conductive layout of the lead frame further permits installation of a zener diode which can be connected to the LED packages in series or in parallel.
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公开(公告)号：US09543486B1
公开(公告)日：2017-01-10
申请号：US14946110
申请日：2015-11-19
Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
Inventor： Hou-Te Lin , Pin-Chuan Chen , Lung-Hsin Chen , Wen-Liang Tseng
CPC classification number: H01L33/60 , H01L33/486 , H01L33/50 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/56 , H01L33/58 , H01L2224/16245 , H01L2224/73253
Abstract: The present disclosure provides a light emitting diode package which includes a plurality of electrodes, an LED die, a reflecting cup, a reflecting layer, and a phosphor layer. The LED die are electrically connected with the electrodes. The reflecting cup is formed on the electrodes and surrounds the LED die. The reflecting cup includes an inner surface. The reflecting layer is formed between the inner surface and LED die, and the reflecting layer has a higher pyrogenation temperature than the reflecting cup. The phosphor layer covers the LED die.
Abstract translation: 本公开提供一种发光二极管封装，其包括多个电极，LED管芯，反射杯，反射层和荧光体层。 LED管芯与电极电连接。 反射杯形成在电极上并围绕LED管芯。 反射杯包括内表面。 反射层形成在内表面和LED管芯之间，反射层的热解温度高于反射杯。 磷光体层覆盖LED芯片。
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公开(公告)号：USD763206S1
公开(公告)日：2016-08-09
申请号：US29522885
申请日：2015-04-03
Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
Designer： Hou-Te Lin , Chao-Hsiung Chang , Pin-Chuan Chen , Lung-Hsin Chen
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公开(公告)号：US09147809B1
公开(公告)日：2015-09-29
申请号：US14686114
申请日：2015-04-14
Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
Inventor： Hou-Te Lin , Chao-Hsiung Chang , Pin-Chuan Chen , Lung-Hsin Chen
CPC classification number: H01L33/38 , H01L33/40 , H01L33/507 , H01L33/54 , H01L33/62 , H01L33/647 , H01L2924/181 , H01L2924/00012
Abstract: A flip chip light emitting diode packaging structure includes a substrate and an LED located on the substrate. The LED includes a P electrode and a N electrode. The substrate includes a first electrode and a second electrode mounted on a top surface of the substrate. The first electrode and the second electrode have a first protrusion and a second protrusion. The P electrode and the N electrode are fixed on the top surface of the first protrusion and the second protrusion through the solder. The bottom edge of the P electrode and the N electrode is beyond the top edge of the first protrusion and the second protrusion.
Abstract translation: 倒装芯片发光二极管封装结构包括基板和位于基板上的LED。 LED包括P电极和N电极。 衬底包括安装在衬底顶表面上的第一电极和第二电极。 第一电极和第二电极具有第一突起和第二突起。 P电极和N电极通过焊料固定在第一突起的顶表面和第二突起上。 P电极和N电极的底部边缘超过第一突起和第二突起的顶部边缘。
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公开(公告)号：US08979312B2
公开(公告)日：2015-03-17
申请号：US14014366
申请日：2013-08-30
Applicant: Advanced Optoelectronic Technology, Inc.
Inventor： Lung-Hsin Chen , Wen-Liang Tseng
IPC: F21V5/00 , F21K99/00 , F21V5/04 , F21Y111/00
CPC classification number: F21K9/135 , F21K9/20 , F21K9/232 , F21K9/60 , F21V3/00 , F21V5/048 , F21Y2107/40 , F21Y2115/10
Abstract: A light emitting diode (LED) bulb includes a connecting body, a mounting base located on the connecting body and a plurality of LED modules mounted on the mounting base. The mounting base has a top face spaced from the connecting body and at least three surrounding walls. The top face of the mounting base orients toward a direction different that of each of the at least three surrounding walls. A lamp cover is secured to the connecting body and encloses the LED modules. An extension of the top face of the mounting base interests with the lamp cover at a point. A tangent line of the lamp cover through the point and the extension of the top face form an included angle which is less than 60 degrees. Furthermore, a center of the lamp cover is located above the top face.
Abstract translation: 发光二极管（LED）灯泡包括连接体，位于连接体上的安装基座和安装在安装基座上的多个LED模块。 安装基座具有与连接体和至少三个周围壁间隔开的顶面。 安装基座的顶面朝向不同于至少三个周围壁中的每一个的方向。 灯罩固定在连接体上并封闭LED模块。 安装座顶面的延伸部分与灯罩的某一点有关。 灯盖的切线穿过点和顶面的延伸部形成小于60度的夹角。 此外，灯罩的中心位于顶面上方。
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