公开(公告)号：US09899587B2

公开(公告)日：2018-02-20

申请号：US15434173

申请日：2017-02-16

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Yau-Tzu Jang ,  Yu-Liang Huang ,  Wen-Liang Tseng ,  Pin-Chuan Chen ,  Lung-Hsin Chen ,  Hsing-Fen Lo ,  Chao-Hsiung Chang ,  Che-Hsang Huang ,  Yu-Lun Hsieh

IPC: H01L33/62 ,  H01L33/64 ,  H01L25/075 ,  H01L33/60 ,  H01L25/16 ,  H01L29/866 ,  H01L33/52 ,  H01L27/02 ,  H01L33/50 ,  H01L33/56

CPC classification number: H01L33/647 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/0248 ,  H01L29/866 ,  H01L33/502 ,  H01L33/52 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48137

Abstract: A lead frame for an LED package includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes separated first and second connecting surfaces. Top surfaces of the bonding electrode, the first connecting electrode, and the second connecting electrode are exposed, and support and electrically connect with light emitting chips. LED packages can be mounted on the lead frame and electrically connect with each other. The conductive layout of the lead frame further permits installation of a zener diode which can be connected to the LED packages in series or in parallel.

公开(公告)号：US09620692B2

公开(公告)日：2017-04-11

申请号：US14876980

申请日：2015-10-07

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Yau-Tzu Jang ,  Yu-Liang Huang ,  Wen-Liang Tseng ,  Pin-Chuan Chen ,  Lung-Hsin Chen ,  Hsing-Fen Lo ,  Chao-Hsiung Chang ,  Che-Hsang Huang ,  Yu-Lun Hsieh

IPC: H01L33/00 ,  H01L33/62 ,  H01L25/075 ,  H01L33/60 ,  H01L25/16 ,  H01L29/866 ,  H01L33/52

CPC classification number: H01L33/647 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/0248 ,  H01L29/866 ,  H01L33/502 ,  H01L33/52 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48137

Abstract: An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.

公开(公告)号：US09184358B2

公开(公告)日：2015-11-10

申请号：US14059463

申请日：2013-10-22

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Yau-Tzu Jang ,  Yu-Liang Huang ,  Wen-Liang Tseng ,  Pin-Chuan Chen ,  Lung-Hsin Chen ,  Hsing-Fen Lo ,  Chao-Hsiung Chang ,  Che-Hsang Huang ,  Yu-Lun Hsieh

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/60

CPC classification number: H01L33/647 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/0248 ,  H01L29/866 ,  H01L33/502 ,  H01L33/52 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48137

Abstract: An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.

Abstract translation: 示例性引线框架包括衬底和接合电极，第一连接电极和嵌入在衬底中的第二连接电极。 接合电极的顶表面包括与第一接合表面间隔开的第一接合表面和第二接合表面。 第一连接电极的顶表面包括与第一连接表面间隔开的第一连接表面和第二连接表面。 接合电极的顶表面，第一连接电极和第二连接电极从基板露出，以支撑并与发光芯片电连接。 发光芯片可以安装在引线框架上并联或串联电连接; 因此，发光芯片可以通过各种方式连接。