公开(公告)号：US20240266233A1

公开(公告)日：2024-08-08

申请号：US18431884

申请日：2024-02-02

Applicant: Applied Materials, Inc.

Inventor： Wonjae Lee ,  Pradeep Kumar Subrahmanyan ,  D. Jeffrey Lischer ,  Frank Sinclair

IPC: H01L21/66 ,  C23C14/48 ,  C23C14/54 ,  H01L21/02

CPC classification number: H01L22/20 ,  C23C14/48 ,  C23C14/54 ,  H01L21/02321 ,  H01L21/02351 ,  H01L21/0217

Abstract: Disclosed systems and techniques are directed to correcting an out-of-plane (OPD) deformation of a substrate by causing a stress-compensation layer (SCL) to be deposited on the substrate, obtaining, using optical inspection data, a profile of the OPD of the substrate. The techniques further include obtaining a dataset with a representation of an influence function for the substrate, the influence function characterizing a deformation response of the substrate caused by a point-like mechanical influence. The techniques further include performing a regression computation to determine, based at least on the profile of the OPD of the substrate and the influence function, a distribution of a stress-mitigation irradiation of the SCL that mitigate the OPD of the substrate. The techniques further include performing, using the determined distribution of the stress-mitigation irradiation, a stress-mitigation irradiation of the SCL.

公开(公告)号：US20240266230A1

公开(公告)日：2024-08-08

申请号：US18431834

申请日：2024-02-02

Applicant: Applied Materials, Inc.

Inventor： Wonjae Lee ,  Pradeep Kumar Subrahmanyan ,  D. Jeffrey Lischer ,  Frank Sinclair

IPC: H01L21/66 ,  G01B11/16 ,  H01L21/3115 ,  H01L21/67

CPC classification number: H01L22/12 ,  G01B11/16 ,  H01L21/31155 ,  H01L21/67288

Abstract: Disclosed systems and techniques are directed to correct an out-of-plane deformation (OPD) of a substrate (e.g., wafer) by identifying, using optical inspection data, a profile of the OPD of the substrate and performing a polynomial decomposition of the profile to determine polynomial coefficients characterizing elemental deformation shapes of the substrate. The techniques further include identifying, based on the polynomial coefficients, characteristics of a stress-compensation layer (SCL) for the substrate and causing the SCL to be deposited on the substrate. The techniques further include performing statistical simulations to identify settings for a non-uniform stress-mitigation irradiation of the SCL, by sampling from one or more statistical distributions associated with previously performed stress-mitigation irradiations, and performing the non-uniform stress-mitigation irradiation of the SCL using the identified settings.

公开(公告)号：US11557496B2

公开(公告)日：2023-01-17

申请号：US16826970

申请日：2020-03-23

Applicant: Applied Materials, Inc.

Inventor： Michael Blanchard ,  Steven M. Anella ,  Brant S. Binns ,  Jordan B. Tye ,  D. Jeffrey Lischer

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/673

Abstract: A cassette with embedded temperature sensors that is disposed within a load lock is disclosed. The temperature sensors may be disposed in a plurality of shelves of the load lock cassette to monitor the temperature of each of a plurality of workpieces disposed in the load lock. The output of these temperature sensors may be provided to a controller, which controls when the load lock is opened. The load lock cassette may also include cooling channels to accelerate the cooling of the workpieces to improve throughput. The cooling may be controlled using closed loop control, where a controller monitors the temperature of the workpieces during the cooling operation.

公开(公告)号：US11473978B2

公开(公告)日：2022-10-18

申请号：US16560566

申请日：2019-09-04

Applicant: APPLIED Materials, Inc.

Inventor： Dawei Sun ,  D. Jeffrey Lischer ,  Qin Chen ,  Dale K. Stone ,  Lyudmila Stone ,  Steven Anella ,  Ron Serisky ,  Chi-Yang Cheng

IPC: G01K1/16 ,  G01J5/02 ,  G01J5/10 ,  G01K7/02

Abstract: A temperature measurement apparatus. The temperature measurement apparatus may include a temperature sensor body, the temperature sensor body having a substrate support surface; and a heat transfer layer, disposed on the substrate support surface, the heat transfer layer comprising an array of aligned carbon nanotubes.