Methodology and Apparatus for Testing Conductive Adhesive Within Antenna Assembly
    11.
    发明申请
    Methodology and Apparatus for Testing Conductive Adhesive Within Antenna Assembly 有权
    天线组件内导电胶粘剂测试方法与装置

    公开(公告)号:US20150050893A1

    公开(公告)日:2015-02-19

    申请号:US13968166

    申请日:2013-08-15

    Applicant: Apple Inc.

    CPC classification number: G01N3/56 G01N3/08 G01N3/24 G01N19/04 H04B17/16

    Abstract: Damage to conductive material that serves as bridging connections between conductive structures within an electronic device may result in deficiencies in radio-frequency (RF) and other wireless communications. A test system for testing device structures under test is provided. Device structures under test may include substrates and a conductive material between the substrates. The test system may include a test fixture for increasing tensile or compressive stress on the device structures under test to evaluate the resilience of the conductive material. The test system may also include a test unit for transmitting RF test signals and receiving test data from the device structures under test. The received test data may include scattered parameter measurements from the device structures under test that may be used to determine if the device structures under test meet desired RF performance criteria.

    Abstract translation: 用作电子设备内的导电结构之间桥接连接的导电材料的损坏可能导致射频(RF)和其他无线通信的缺陷。 提供了一种用于测试被测设备结构的测试系统。 被测器件结构可以包括衬底和衬底之间的导电材料。 测试系统可以包括用于增加被测装置结构上的拉伸或压缩应力以评估导电材料的弹性的测试夹具。 测试系统还可以包括用于发送RF测试信号并从被测设备结构接收测试数据的测试单元。 所接收的测试数据可以包括来自被测器件结构的散射参数测量,其可以用于确定被测器件结构是否满足期望的RF性能标准。

    Input controls using pressure sensors

    公开(公告)号:US10585524B2

    公开(公告)日:2020-03-10

    申请号:US16044223

    申请日:2018-07-24

    Applicant: Apple Inc.

    Abstract: An input control for controlling various features of an electronic device is described. The input control can be positioned along an exterior surface of the electronic device and cover an opening leading into the electronic device. A pressure sensor can then be positioned within the electronic device and adjacent to the covered opening. The pressure sensor is able to measure a pressure of a volume of air positioned between the pressure sensor and the input control. When movement of the input control changes the pressure of the volume of air, the sensor readings from the pressure sensor can be used to register a user input. The input control can take many forms including rocker buttons, slider switches and input regions.

    Methodology and apparatus for testing conductive adhesive within antenna assembly
    15.
    发明授权
    Methodology and apparatus for testing conductive adhesive within antenna assembly 有权
    用于测试天线组件内的导电胶的方法和装置

    公开(公告)号:US09404842B2

    公开(公告)日:2016-08-02

    申请号:US13968166

    申请日:2013-08-15

    Applicant: Apple Inc.

    CPC classification number: G01N3/56 G01N3/08 G01N3/24 G01N19/04 H04B17/16

    Abstract: Damage to conductive material that serves as bridging connections between conductive structures within an electronic device may result in deficiencies in radio-frequency (RF) and other wireless communications. A test system for testing device structures under test is provided. Device structures under test may include substrates and a conductive material between the substrates. The test system may include a test fixture for increasing tensile or compressive stress on the device structures under test to evaluate the resilience of the conductive material. The test system may also include a test unit for transmitting RF test signals and receiving test data from the device structures under test. The received test data may include scattered parameter measurements from the device structures under test that may be used to determine if the device structures under test meet desired RF performance criteria.

    Abstract translation: 用作电子设备内的导电结构之间桥接连接的导电材料的损坏可能导致射频(RF)和其他无线通信的缺陷。 提供了一种用于测试被测设备结构的测试系统。 被测器件结构可以包括衬底和衬底之间的导电材料。 测试系统可以包括用于增加被测装置结构上的拉伸或压缩应力以评估导电材料的弹性的测试夹具。 测试系统还可以包括用于发送RF测试信号并从被测设备结构接收测试数据的测试单元。 所接收的测试数据可以包括来自被测器件结构的散射参数测量,其可以用于确定被测器件结构是否满足期望的RF性能标准。

    ELECTROMAGNETIC INTERFERENCE SHIELDING TECHNIQUES
    17.
    发明申请
    ELECTROMAGNETIC INTERFERENCE SHIELDING TECHNIQUES 有权
    电磁干扰屏蔽技术

    公开(公告)号:US20130114228A1

    公开(公告)日:2013-05-09

    申请号:US13631156

    申请日:2012-09-28

    Applicant: Apple Inc.

    Abstract: Methods and apparatuses are disclosed for fabricating a printed circuit board (PCB) having electromagnetic interference (EMI) shielding and also having reduced volume over conventional frame-and-shield approaches. Some embodiments include fabricating the PCB by mounting an integrated circuit to the PCB, outlining an area corresponding to the integrated circuit with a number of grounded vias, selectively applying an insulating layer over the PCB such that at least one of the grounded vias are exposed, and selectively applying a conductive layer over the PCB such that the conductive layer covers at least a portion of the integrated circuit and such that the conductive layer is coupled to the at least one of the grounded vias that are exposed.

    Abstract translation: 公开了用于制造具有电磁干扰(EMI)屏蔽的印刷电路板(PCB)的方法和装置,并且与传统的框架 - 屏蔽方法相比也具有减小的体积。 一些实施例包括通过将集成电路安装到PCB来制造PCB,通过多个接地通孔来概括对应于集成电路的区域,在PCB上选择性地施加绝缘层,使得接地通孔中的至少一个暴露, 以及选择性地在所述PCB上施加导电层,使得所述导电层覆盖所述集成电路的至少一部分,并且使得所述导电层耦合到暴露的所述接地通孔中的至少一个。

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