-
公开(公告)号：US09720462B2
公开(公告)日：2017-08-01
申请号：US14802970
申请日：2015-07-17
Applicant: Apple Inc.
Inventor： Nicholas G. Merz , John C. Difonzo , Stephen P. Zadesky , Michael J. Prichard
IPC: H05K7/20 , G06F1/20 , G06F1/16 , G02F1/1333 , G06F1/18 , G11B33/14 , H01L23/367 , H01L23/427 , F28D15/02 , F28F3/02 , G11B33/08
CPC classification number: G06F1/20 , F28D15/02 , F28D15/0275 , F28F3/02 , G02F1/133308 , G02F2201/503 , G06F1/1616 , G06F1/1637 , G06F1/1656 , G06F1/1658 , G06F1/1662 , G06F1/1681 , G06F1/183 , G06F1/184 , G06F1/187 , G06F1/203 , G11B33/08 , G11B33/1426 , H01L23/367 , H01L23/427 , H01L2924/0002 , H05K7/20336 , Y10T29/4935 , H01L2924/00
Abstract: A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.
-
公开(公告)号：US09116674B2
公开(公告)日：2015-08-25
申请号：US14055784
申请日：2013-10-16
Applicant: Apple Inc.
Inventor： Nicholas G. Merz , John C. DiFonzo , Stephen P. Zadesky , Michael J. Prichard
IPC: G06F1/20 , F28D3/02 , F28D15/02 , G02F1/1333 , G06F1/16 , G06F1/18 , G11B33/14 , H01L23/367 , H01L23/427 , F28F3/02 , H05K7/20 , G11B33/08
CPC classification number: G06F1/20 , F28D15/02 , F28D15/0275 , F28F3/02 , G02F1/133308 , G02F2201/503 , G06F1/1616 , G06F1/1637 , G06F1/1656 , G06F1/1658 , G06F1/1662 , G06F1/1681 , G06F1/183 , G06F1/184 , G06F1/187 , G06F1/203 , G11B33/08 , G11B33/1426 , H01L23/367 , H01L23/427 , H01L2924/0002 , H05K7/20336 , Y10T29/4935 , H01L2924/00
Abstract: A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.
Abstract translation: 公开了一种计算设备。 该计算装置包括一个冲击安装组件，其被配置为向诸如显示器和光盘驱动器的敏感部件提供冲击吸收。 计算设备还包括由机壳和计算设备的其他结构容纳的无外壳光盘驱动器。 计算装置还包括从计算装置的发热元件移除热量的传热系统。 传热系统被配置为将发热元件热耦合到计算装置的结构构件，以便通过结构构件吸收热量，结构构件通常具有用于散热的大的表面积。
-
公开(公告)号：US20140043751A1
公开(公告)日：2014-02-13
申请号：US14055784
申请日：2013-10-16
Applicant: Apple Inc.
Inventor： Nicholas G. Merz , John C. DiFonzo , Stephen P. Zadesky , Michael J. Prichard
CPC classification number: G06F1/20 , F28D15/02 , F28D15/0275 , F28F3/02 , G02F1/133308 , G02F2201/503 , G06F1/1616 , G06F1/1637 , G06F1/1656 , G06F1/1658 , G06F1/1662 , G06F1/1681 , G06F1/183 , G06F1/184 , G06F1/187 , G06F1/203 , G11B33/08 , G11B33/1426 , H01L23/367 , H01L23/427 , H01L2924/0002 , H05K7/20336 , Y10T29/4935 , H01L2924/00
Abstract: A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.
Abstract translation: 公开了一种计算设备。 该计算装置包括一个冲击安装组件，其被配置为向诸如显示器和光盘驱动器的敏感部件提供冲击吸收。 计算设备还包括由机壳和计算设备的其他结构容纳的无外壳光盘驱动器。 计算装置还包括从计算装置的发热元件移除热量的传热系统。 传热系统被配置为将发热元件热耦合到计算装置的结构构件，以便通过结构构件吸收热量，结构构件通常具有用于散热的大的表面积。
-
公开(公告)号：US20150323966A1
公开(公告)日：2015-11-12
申请号：US14802970
申请日：2015-07-17
Applicant: Apple Inc.
Inventor： Nicholas G. Merz , John C. Difonzo , Stephen P. Zadesky , Michael J. Prichard
CPC classification number: G06F1/20 , F28D15/02 , F28D15/0275 , F28F3/02 , G02F1/133308 , G02F2201/503 , G06F1/1616 , G06F1/1637 , G06F1/1656 , G06F1/1658 , G06F1/1662 , G06F1/1681 , G06F1/183 , G06F1/184 , G06F1/187 , G06F1/203 , G11B33/08 , G11B33/1426 , H01L23/367 , H01L23/427 , H01L2924/0002 , H05K7/20336 , Y10T29/4935 , H01L2924/00
Abstract: A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.
Abstract translation: 公开了一种计算设备。 该计算装置包括一个冲击安装组件，其被配置为向诸如显示器和光盘驱动器的敏感部件提供冲击吸收。 计算设备还包括由机壳和计算设备的其他结构容纳的无外壳光盘驱动器。 计算装置还包括从计算装置的发热元件移除热量的传热系统。 传热系统被配置为将发热元件热耦合到计算装置的结构构件，以便通过结构构件吸收热量，结构构件通常具有用于散热的大的表面积。
-
-
-
Search Results
4
records
(took 0.011 seconds)
