WAFER-LEVEL BOND STRENGTH MEASUREMENT
    2.
    发明公开

    公开(公告)号:US20240230516A9

    公开(公告)日:2024-07-11

    申请号:US17973316

    申请日:2022-10-25

    Inventor: Khaled AHMED

    CPC classification number: G01N19/04

    Abstract: This disclosure describes systems, methods, and devices related to bond strength measurement. A device may comprise a first portion of a plate connected to a movement mechanism, a second portion of the plate comprising a sticky probe and a third portion of the plate comprising a mirror with a reflective side pointing outwards. The device may further comprise an optical fiber sensor assembly comprising an optical fiber bundle for sending light through a first optical fiber and receiving light reflected from the mirror through a second optical fiber.

    METHODS AND SYSTEMS FOR INSPECTING BONDED STRUCTURES

    公开(公告)号:US20230211570A1

    公开(公告)日:2023-07-06

    申请号:US17568784

    申请日:2022-01-05

    Inventor: David W. Arnold

    Abstract: A method for inspecting a bonded structure, the bonded structure having a first structural member, a second structural member, and a bondline between the first structural member and the second structural member, includes projecting acoustic waves into the bonded structure at a non-zero angle relative to a normal axis defined by an external surface of the first structural member. The method further includes determining a magnitude of a total refraction of the acoustic waves after the acoustic waves pass through the bonded structure and comparing the magnitude of the total refraction to a predefined value.

    METHOD OF MEASURING ADHESIVE STRENGTH
    9.
    发明申请

    公开(公告)号:US20190212247A1

    公开(公告)日:2019-07-11

    申请号:US16240810

    申请日:2019-01-07

    Abstract: A method of measuring adhesive strength between an element body and a porous protection layer that are included in a sensor element includes (a) a step of holding a portion of the element body where the porous protection layer is absent with an elastic force exerted by a holding jig, and placing a peeling jig at a position between the porous protection layer and the holding jig in the longitudinal direction such that the element body is allowed to move in the longitudinal direction while the porous protection layer is prevented from moving in the longitudinal direction toward the holding jig; and (b) a step of moving, after the step (a), the peeling jig pushes the porous protection layer in the longitudinal direction, and measuring the adhesive strength of the porous protection layer.

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