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公开(公告)号：US20130119051A1
公开(公告)日：2013-05-16
申请号：US13668154
申请日：2012-11-02
Applicant: Apple Inc.
Inventor： Weyman Chen , Michael M. Nikkhoo , Amir Salehi
IPC: H05K13/04
CPC classification number: H05K13/0486
Abstract: Reworking a component solder attached to a printed circuit board is described. The reworking is accomplished by directing energy only at the solder/pad arrangement used to attach the component to the printed circuit board. In one embodiment, the directed energy takes the form of an alternating magnetic field that inductively couples with the solder/pad arrangement. The alternating magnetic field has a frequency at least 800 kHz. In another embodiment, the directed energy takes the form of a laser beam that is concurrently directed at the solder/pad arrangements for liquefying the solder.
Abstract translation: 描述了附着在印刷电路板上的部件焊料的重新加工。 返修是通过仅在用于将部件连接到印刷电路板的焊料/焊盘布置处引导能量来实现的。 在一个实施例中，定向能量采用与焊料/焊盘布置感应耦合的交变磁场的形式。 交变磁场的频率至少为800 kHz。 在另一个实施例中，定向能量采用激光束的形式，其同时指向用于液化焊料的焊料/焊盘布置。
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公开(公告)号：US20130120957A1
公开(公告)日：2013-05-16
申请号：US13631216
申请日：2012-09-28
Applicant: Apple Inc.
Inventor： Christopher Matthew Werner , Fletcher R. Rothkopf , Stephen Brian Lynch , Dennis R. Pyper , Wyeman Chen , Michael M. Nikkhoo , Amir Salehi
CPC classification number: H05K3/225 , H05K1/0216 , H05K9/0032 , H05K2201/1031 , H05K2201/10371 , H05K2203/176 , Y02P70/611 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144
Abstract: An RF shield formed of RF opaque material that permits access to components on a printed circuit board is described. The RF shield can include a first portion attached to the PCB and a removable top portion attached to the first portion at an interface. The top portion is removed from the first portion to expose the components on the PCB. In one aspect of the described embodiment, the top portion is peeled away from the first portion. The components are enclosed within the RF shield after the removal of the top portion by attaching and sealing another top portion to the first portion at the interface by, for example, laser attaching the first portion and the other top portion at the interface.
Abstract translation: 描述由RF不透明材料形成的RF屏蔽，其允许访问印刷电路板上的部件。 RF屏蔽件可以包括附接到PCB的第一部分和在界面处附接到第一部分的可移除顶部。 顶部从第一部分移除以露出PCB上的部件。 在所述实施例的一个方面，顶部从第一部分剥离。 在通过例如在接口处附接第一部分和另一顶部的激光器的激光附接和密封另一顶部到界面处的第一部分之后，将部件封装在RF屏蔽内。
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公开(公告)号：US09155188B2
公开(公告)日：2015-10-06
申请号：US13631156
申请日：2012-09-28
Applicant: Apple Inc.
Inventor： Nicholas G. Merz , Hong Wang , Michael M. Nikkhoo , Dennis R. Pyper , Christopher Matthew Werner
CPC classification number: H05K1/0218 , H05K3/284 , H05K2201/0317 , H05K2201/09618 , H05K2201/09872 , H05K2201/09909 , H05K2201/10371 , H05K2201/2018 , Y10T29/4913 , Y10T29/49146
Abstract: Methods and apparatuses are disclosed for fabricating a printed circuit board (PCB) having electromagnetic interference (EMI) shielding and also having reduced volume over conventional frame-and-shield approaches. Some embodiments include fabricating the PCB by mounting an integrated circuit to the PCB, outlining an area corresponding to the integrated circuit with a number of grounded vias, selectively applying an insulating layer over the PCB such that at least one of the grounded vias are exposed, and selectively applying a conductive layer over the PCB such that the conductive layer covers at least a portion of the integrated circuit and such that the conductive layer is coupled to the at least one of the grounded vias that are exposed.
Abstract translation: 公开了用于制造具有电磁干扰（EMI）屏蔽的印刷电路板（PCB）的方法和装置，并且与传统的框架 - 屏蔽方法相比也具有减小的体积。 一些实施例包括通过将集成电路安装到PCB来制造PCB，通过多个接地通孔来概括对应于集成电路的区域，在PCB上选择性地施加绝缘层，使得接地通孔中的至少一个暴露， 以及选择性地在所述PCB上施加导电层，使得所述导电层覆盖所述集成电路的至少一部分，并且使得所述导电层耦合到暴露的所述接地通孔中的至少一个。
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公开(公告)号：US20130114228A1
公开(公告)日：2013-05-09
申请号：US13631156
申请日：2012-09-28
Applicant: Apple Inc.
Inventor： Nicholas G. Merz , Hong Wang , Michael M. Nikkhoo , Dennis R. Pyper , Christopher Matthew Werner
CPC classification number: H05K1/0218 , H05K3/284 , H05K2201/0317 , H05K2201/09618 , H05K2201/09872 , H05K2201/09909 , H05K2201/10371 , H05K2201/2018 , Y10T29/4913 , Y10T29/49146
Abstract: Methods and apparatuses are disclosed for fabricating a printed circuit board (PCB) having electromagnetic interference (EMI) shielding and also having reduced volume over conventional frame-and-shield approaches. Some embodiments include fabricating the PCB by mounting an integrated circuit to the PCB, outlining an area corresponding to the integrated circuit with a number of grounded vias, selectively applying an insulating layer over the PCB such that at least one of the grounded vias are exposed, and selectively applying a conductive layer over the PCB such that the conductive layer covers at least a portion of the integrated circuit and such that the conductive layer is coupled to the at least one of the grounded vias that are exposed.
Abstract translation: 公开了用于制造具有电磁干扰（EMI）屏蔽的印刷电路板（PCB）的方法和装置，并且与传统的框架 - 屏蔽方法相比也具有减小的体积。 一些实施例包括通过将集成电路安装到PCB来制造PCB，通过多个接地通孔来概括对应于集成电路的区域，在PCB上选择性地施加绝缘层，使得接地通孔中的至少一个暴露， 以及选择性地在所述PCB上施加导电层，使得所述导电层覆盖所述集成电路的至少一部分，并且使得所述导电层耦合到暴露的所述接地通孔中的至少一个。
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