公开(公告)号：US20130119051A1

公开(公告)日：2013-05-16

申请号：US13668154

申请日：2012-11-02

Applicant: Apple Inc.

Inventor： Weyman Chen ,  Michael M. Nikkhoo ,  Amir Salehi

IPC: H05K13/04

CPC classification number: H05K13/0486

Abstract: Reworking a component solder attached to a printed circuit board is described. The reworking is accomplished by directing energy only at the solder/pad arrangement used to attach the component to the printed circuit board. In one embodiment, the directed energy takes the form of an alternating magnetic field that inductively couples with the solder/pad arrangement. The alternating magnetic field has a frequency at least 800 kHz. In another embodiment, the directed energy takes the form of a laser beam that is concurrently directed at the solder/pad arrangements for liquefying the solder.

Abstract translation: 描述了附着在印刷电路板上的部件焊料的重新加工。 返修是通过仅在用于将部件连接到印刷电路板的焊料/焊盘布置处引导能量来实现的。 在一个实施例中，定向能量采用与焊料/焊盘布置感应耦合的交变磁场的形式。 交变磁场的频率至少为800 kHz。 在另一个实施例中，定向能量采用激光束的形式，其同时指向用于液化焊料的焊料/焊盘布置。