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公开(公告)号：US20190140603A1
公开(公告)日：2019-05-09
申请号：US16178117
申请日：2018-11-01
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Keith G. Fife , Nevada J. Sanchez , Andrew J. Casper , Tyler S. Ralston
Abstract: A variable current trans-impedance amplifier (TIA) for an ultrasound device is described. The TIA may be coupled to an ultrasonic transducer to amplify an output signal of the ultrasonic transducer representing an ultrasound signal received by the ultrasonic transducer. During acquisition of the ultrasound signal by the ultrasonic transducer, one or more current sources in the TIA may be varied.
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公开(公告)号：US20190086525A1
公开(公告)日：2019-03-21
申请号：US16178871
申请日：2018-11-02
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Keith G. Fife , Tyler S. Ralston , Nevada J. Sanchez , Andrew J. Casper
Abstract: Methods and apparatus are described for implementing a coding scheme on ultrasound signals received by a plurality of ultrasonic transducers. The coding, and subsequent decoding, may allow for multiple ultrasonic transducers to be operated in a receive mode simultaneously while still differentiating the contribution of the individual ultrasonic transducers. Improved signal characteristics may result, including improved signal-to-noise ratio (SNR).
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公开(公告)号：US20190047850A1
公开(公告)日：2019-02-14
申请号：US16158999
申请日：2018-10-12
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston , Jaime Scott Zahorian
Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
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134.发明授权公开(公告)号：US09899371B2
公开(公告)日：2018-02-20
申请号：US15259243
申请日：2016-09-08
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Nevada J. Sanchez , Susan A. Alie
IPC: B81B3/00 , B81C1/00 , H01L21/768 , H01L27/06 , B06B1/02 , B81B7/00 , H01L21/3213 , H01L21/56 , H01L21/8238 , H01L23/522 , H01L23/528 , A61B8/00 , H01L27/092
CPC classification number: H01L27/0617 , A61B8/00 , A61B8/4494 , B06B1/02 , B06B1/0292 , B06B2201/51 , B81B3/0021 , B81B7/0006 , B81B2201/0271 , B81C1/00158 , B81C1/00246 , B81C2203/0735 , B81C2203/0771 , H01L21/32134 , H01L21/56 , H01L21/768 , H01L21/76838 , H01L21/823871 , H01L23/5226 , H01L23/528 , H01L27/0688 , H01L27/092 , H01L2224/16225
Abstract: Micromachined ultrasonic transducers formed in complementary metal oxide semiconductor (CMOS) wafers are described, as are methods of fabricating such devices. A metallization layer of a CMOS wafer may be removed by sacrificial release to create a cavity of an ultrasonic transducer. Remaining layers may form a membrane of the ultrasonic transducer.
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公开(公告)号：US20170360414A1
公开(公告)日：2017-12-21
申请号：US15631729
申请日：2017-06-23
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Nevada J. Sanchez , Tyler S. Ralston , Christopher Thomas McNulty , Jaime Scott Zahorian , Paul Francis Cristman , Matthew de Jonge , Keith G. Fife , David Elgena
CPC classification number: A61B8/4477 , A61B8/0883 , A61B8/0891 , A61B8/12 , A61B8/4236 , A61B8/4427 , A61B8/4444 , A61B8/4472 , A61B8/4494 , A61B8/465 , A61B8/467 , A61B8/483 , A61B8/485 , A61B8/488 , A61B8/5207 , A61B8/54 , A61B8/56 , B06B1/0292 , B06B1/0622
Abstract: A system comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles; and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.
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Patent Agency Ranking
公开(公告)号：US20170360413A1
公开(公告)日：2017-12-21
申请号：US15629666
申请日：2017-06-21
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Nevada J. Sanchez , Tyler S. Ralston , Christopher Thomas McNulty , Jaime Scott Zahorian , Paul Francis Cristman , Matthew de Jonge , Keith G. Fife
CPC classification number: A61B8/145 , A61B8/12 , A61B8/4236 , A61B8/4427 , A61B8/4444 , A61B8/4488 , A61B8/4494 , A61B8/465 , A61B8/467 , A61B8/54 , A61B8/56 , B06B1/0292 , B06B1/0622
Abstract: A universal ultrasound device having an ultrasound probe includes a semiconductor die; a plurality of ultrasonic transducers integrated on the semiconductor die, the plurality of ultrasonic transducers configured to operate a first mode associated with a first frequency range and a second mode associated with a second frequency range, wherein the first frequency range is at least partially non-overlapping with the second frequency range; and control circuitry configured to: control the plurality of ultrasonic transducers to generate and/or detect ultrasound signals having frequencies in the first frequency range, in response to receiving an indication to operate the ultrasound probe in the first mode; and control the plurality of ultrasonic transducers to generate and/or detect ultrasound signals having frequencies in the second frequency range, in response to receiving an indication to operate the ultrasound probe in the second mode.
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公开(公告)号：US20170307741A1
公开(公告)日：2017-10-26
申请号：US15517284
申请日：2015-10-07
Applicant: Butterfly Network, Inc.
Inventor： Tyler S. Ralston , Nevada J. Sanchez
CPC classification number: G01S7/5208 , A61B5/7257 , A61B8/4483 , A61B8/5207 , G01S7/5202 , G01S7/52025 , G01S7/52026 , G01S7/52033 , G01S7/52034 , G01S7/52047 , G01S15/8915
Abstract: Ultrasound signal processing circuitry and related apparatus and methods are described. Signal samples received from an ultrasound transducer array in an ultrasound transducer based imaging system may be processed, or conditioned, by application of one or more weighting functions. In some embodiments, one or more weighting functions may be applied to the signal samples in the time domain. In other embodiments, the signal samples may be converted to the frequency domain and one or more weighting functions may be applied in the frequency domain. In further embodiments, one or more weighting functions may be applied in the time domain and one or more weighting functions may be applied in the frequency domain. The weighting functions may be channel dependent and/or channel independent. The processed data can be provided to an image formation processor.
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公开(公告)号：US20170296144A1
公开(公告)日：2017-10-19
申请号：US15638331
申请日：2017-06-29
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
IPC: A61B8/00 , G01S15/89 , A61B8/14 , G01S15/02 , G01S7/52 , B81C1/00 , B06B1/02 , A61N7/02 , A61N7/00 , H04R1/00 , A61B8/08
CPC classification number: A61B8/4494 , A61B8/14 , A61B8/145 , A61B8/4483 , A61B8/4488 , A61B8/485 , A61B8/54 , A61N7/00 , A61N7/02 , B06B1/02 , B81C1/00246 , G01S7/52019 , G01S7/52034 , G01S7/52047 , G01S7/5208 , G01S15/02 , G01S15/8915 , G01S15/8977 , H04R1/00
Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the “ultrasound-on-a-chip” solution disclosed herein.
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139.发明申请公开(公告)号：US20170281138A1
公开(公告)日：2017-10-05
申请号：US15087962
申请日：2016-03-31
Applicant: Butterfly Network, Inc.
Inventor： Liewei Bao , Kailiang Chen , Tyler S. Ralston , Nevada J. Sanchez
IPC: A61B8/00
Abstract: Circuitry for ultrasound devices is described. A multi-level pulser is described, which can support time-domain and spatial apodization. The multi-level pulser may be controlled through a software-defined waveform generator. In response to the execution of a computer code, the waveform generator may access master segments from a memory, and generate a stream of packets directed to pulsing circuits. The stream of packets may be serialized. A plurality of decoding circuits may modulate the streams of packets to obtain spatial apodization.
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公开(公告)号：US20170258443A1
公开(公告)日：2017-09-14
申请号：US15606131
申请日：2017-05-26
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston , Gregory L. Charvat , Gregory Corteville
CPC classification number: A61B8/4444 , A61B8/13 , A61B8/14 , A61B8/4411 , A61B8/4477 , A61B8/4483 , A61B8/4488 , A61B8/4494 , A61B8/483 , A61B8/5207 , A61B8/54 , A61B8/56 , A61N7/02 , A61N2007/0078 , B06B1/0292 , G01S7/003 , G01S7/5208 , G01S7/52084 , G01S15/8915 , G03B27/423 , G03B27/52 , Y10T29/49005
Abstract: Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.
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