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公开(公告)号：US20210183832A1
公开(公告)日：2021-06-17
申请号：US17124100
申请日：2020-12-16
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Nevada J. Sanchez , Jianwei Liu
Abstract: Aspects of the technology described herein related to an ultrasound device including a first integrated circuit substrate having first integrated ultrasound circuitry and a second integrated circuit substrate having second integrated ultrasound circuitry. The first and second integrated circuit substrates are arranged in a vertical stack. A first conductive pillar is electrically coupled, through a first redistribution layer, to the first integrated circuit substrate, and a second conductive pillar is electrically coupled, through the first and second redistribution layers, to the second integrated circuit substrate.
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公开(公告)号：US20210114060A1
公开(公告)日：2021-04-22
申请号：US17086311
申请日：2020-10-30
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.
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公开(公告)号：US10972842B2
公开(公告)日：2021-04-06
申请号：US16016359
申请日：2018-06-22
Applicant: Butterfly Network, Inc.
Inventor： Joseph Lutsky , Nevada J. Sanchez , Kailiang Chen , Keith G. Fife , Tyler S. Ralston
Abstract: Aspects of the technology described herein relate to ultrasound circuits that employ a differential ultrasonic transducer element, such as a differential micromachined ultrasonic transducer (MUT) element. The differential ultrasonic transducer element may be coupled to an integrated circuit that is configured to operate the differential ultrasonic transducer element in one or more modes of operation, such as a differential receive mode, a differential transmit mode, a single-ended receive mode, and a single-ended transmit mode.
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公开(公告)号：US10695034B2
公开(公告)日：2020-06-30
申请号：US14714150
申请日：2015-05-15
Applicant: Butterfly Network, Inc.
Inventor： Tyler S. Ralston , Nevada J. Sanchez
Abstract: An ultrasound apparatus comprising a plurality of ultrasonic transducers, a non-acoustic sensor, a memory circuitry to store control data for operating the ultrasound apparatus to perform an acquisition task, and a controller. The controller is configured to receive an indication to perform the acquisition task, receive non-acoustic data obtained by the non-acoustic sensor, and control, based on the control data and the non-acoustic data, the plurality of ultrasonic transducers to obtain acoustic data for the acquisition task.
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公开(公告)号：US20190388935A1
公开(公告)日：2019-12-26
申请号：US16562821
申请日：2019-09-06
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.
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Patent Agency Ranking
公开(公告)号：US20190283081A1
公开(公告)日：2019-09-19
申请号：US16364388
申请日：2019-03-26
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.
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公开(公告)号：US20190282207A1
公开(公告)日：2019-09-19
申请号：US16432901
申请日：2019-06-05
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Nevada J. Sanchez , Christopher Thomas McNulty
Abstract: An exemplary system includes a first ultrasonic transducer assembly configured to deliver high intensity focused ultrasonic (HIFU) energy to a point of interest within a subject, and a second ultrasonic transducer assembly configured to perform imaging of the subject. In another embodiment, a housing is configured to receive an ultrasound probe. The housing may include a cooling circuit and power supply for the ultrasound probe.
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公开(公告)号：US20190261955A1
公开(公告)日：2019-08-29
申请号：US16404672
申请日：2019-05-06
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Nevada J. Sanchez , Susan A. Alie , Tyler S. Ralston , Jonathan M. Rothberg , Keith G. Fife , Joseph Lutsky
Abstract: Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.
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公开(公告)号：US20190261954A1
公开(公告)日：2019-08-29
申请号：US16404665
申请日：2019-05-06
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Nevada J. Sanchez , Susan A. Alie , Tyler S. Ralston , Jonathan M. Rothberg , Keith G. Fife , Joseph Lutsky
Abstract: Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.
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130.发明申请公开(公告)号：US20190142391A1
公开(公告)日：2019-05-16
申请号：US16245310
申请日：2019-01-11
Applicant: Butterfly Network, Inc.
Inventor： Liewei Bao , Kailiang Chen , Tyler S. Ralston , Nevada J. Sanchez
Abstract: Circuitry for ultrasound devices is described. A multi-level pulser is described, which can support time-domain and spatial apodization. The multi-level pulser may be controlled through a software-defined waveform generator. In response to the execution of a computer code, the waveform generator may access master segments from a memory, and generate a stream of packets directed to pulsing circuits. The stream of packets may be serialized. A plurality of decoding circuits may modulate the streams of packets to obtain spatial apodization.
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