公开(公告)号：US5964904A

公开(公告)日：1999-10-12

申请号：US219466

申请日：1998-12-23

Applicant: Sungho Jin ,  Brijesh Vyas ,  Susan M. Zahurak

Inventor： Sungho Jin ,  Brijesh Vyas ,  Susan M. Zahurak

IPC: H01M4/62 ,  C22C1/10 ,  C22C32/00 ,  H01M4/14 ,  H01M4/16 ,  H01M4/56 ,  H01M4/68 ,  H01M4/72 ,  H01M4/73 ,  H01M4/82 ,  H01M10/06 ,  B21D39/00 ,  H01M4/22

CPC classification number: C22C1/10 ,  C22C1/1094 ,  C22C32/00 ,  H01M4/16 ,  H01M4/56 ,  H01M4/68 ,  H01M4/73 ,  H01M4/82 ,  C22C2204/00 ,  H01M4/72 ,  Y02P70/54 ,  Y10T29/10 ,  Y10T29/301 ,  Y10T29/49115 ,  Y10T29/49924

Abstract: A lead-acid battery according to the invention contains an electrode grid structure that comprises dispersoid-containing lead having relatively high strength and good corrosion resistance. The dispersoid particles exemplarily are selected from the oxides, nitrides and carbides that are substantially insoluble in lead and in sulfuric acid of concentration suitable for use in a lead-acid battery. Significantly, the dispersoid-containing lead has average grain size of at least 20 .mu.m. In consequence of the relatively large grain size, the total length of grain boundaries exposed to electrolyte is relatively small, and corrosion resistance is improved. Exemplary techniques for forming the dispersoid-containing lead are disclosed.

Abstract translation: 根据本发明的铅酸蓄电池包含电极栅格结构，其包含具有相对高的强度和良好的耐腐蚀性的含分散质的铅。 分散质颗粒示例性地选自基本上不溶于铅的浓度的氧化物，氮化物和碳化物，以及适合用于铅酸电池的浓度的硫酸。 重要的是，含分散质的铅的平均粒度至少为20微米。 由于晶粒尺寸相对较大，暴露于电解质的晶界的总长度相对较小，因此耐蚀性得到改善。 公开了用于形成含分散质的铅的示例性技术。

公开(公告)号：US5846366A

公开(公告)日：1998-12-08

申请号：US698284

申请日：1996-08-14

Applicant: Sungho Jin ,  Mark Thomas McCormack

Inventor： Sungho Jin ,  Mark Thomas McCormack

IPC: B23K1/20 ,  B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34 ,  B23K31/02

CPC classification number: H01L24/81 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H05K3/3484 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K2201/0133 ,  H05K2201/0218 ,  H05K2201/083 ,  H05K2203/0156 ,  H05K2203/0338 ,  H05K2203/0425 ,  H05K2203/0528 ,  H05K2203/104 ,  Y10T156/1089 ,  Y10T156/1093

Abstract: In accordance with the invention, an electronic device having one or more contact pads is placed in contact with a carrier sheet bearing an array of transferable solder particles. Heat is applied to adhere the solder to the contact pads, and solder is selectively transferred onto the contact pads. In a preferred embodiment the solder-carrying medium comprises elastomeric material and the solder particles comprise solder-coated magnetic particles. Application of a magnetic field while the elastomer is curing produces a regular array of solder coated particles. Using this method, devices having smaller than conventional contact structures can be readily interconnected.

Abstract translation: 根据本发明，具有一个或多个接触垫的电子设备被放置成与承载有可转移焊料颗粒阵列的载体片接触。 施加热量以将焊料粘附到接触焊盘，并且将焊料选择性地转移到接触焊盘上。 在优选实施例中，焊料载体介质包括弹性材料，焊料颗粒包括焊料涂覆的磁性颗粒。 在弹性体固化时施加磁场产生规则的焊料涂覆颗粒阵列。 使用这种方法，具有小于常规接触结构的装置可以容易地相互连接。

公开(公告)号：US5834709A

公开(公告)日：1998-11-10

申请号：US234528

申请日：1994-04-28

Applicant: Greg E. Blonder ,  Robert Albert Boie ,  Sungho Jin ,  Mark Thomas McCormack

Inventor： Greg E. Blonder ,  Robert Albert Boie ,  Sungho Jin ,  Mark Thomas McCormack

IPC: G01B7/00 ,  G01D5/14 ,  G01D5/16 ,  G01D5/18 ,  G01R33/09 ,  G06F3/033 ,  G06F3/046 ,  G11B5/39 ,  H01F1/00 ,  H01F1/40 ,  H01L43/08 ,  H01L43/10 ,  G08C21/00

CPC classification number: G06F3/046 ,  B82Y25/00 ,  G01D5/145 ,  G01R33/09 ,  H01F1/0036 ,  H01F1/407 ,  H01L43/10

Abstract: The present invention provides a position-sensing system which employs sensors incorporating magnetoresistive materials. The position of a magnetic information input member is determined through the resistance change of the magnetoresistive sensor in response to the magnetic field from the magnetic information input member. Exemplary magnetoresistive materials are lanthanum manganites having high magnetoresistive ratios. Two-dimensional position sensing systems for graphics tablets are also described.

Abstract translation: 本发明提供了采用包含磁阻材料的传感器的位置感测系统。 响应于来自磁信息输入构件的磁场，磁信息输入构件的位置由磁阻传感器的电阻变化确定。 示例性的磁致电阻材料是具有高磁阻率的锰酸镧。 还描述了用于图形片的二维位置感测系统。

公开(公告)号：US5808401A

公开(公告)日：1998-09-15

申请号：US548720

申请日：1995-10-26

Applicant: Sungho Jin ,  Gregory Peter Kochanski ,  Wei Zhu

Inventor： Sungho Jin ,  Gregory Peter Kochanski ,  Wei Zhu

IPC: H01J1/304 ,  H01J9/02 ,  H01J31/12 ,  H01J1/02 ,  H01J1/16 ,  H01J1/62 ,  H01J19/08

CPC classification number: H01J9/025 ,  H01J1/304 ,  H01J2201/30403 ,  H01J2201/30457 ,  H01J2329/8625

Abstract: In accordance with the invention, a field emission device is made by disposing emitter material on an insulating substrate, applying masking particles to the emitter material, applying an insulating film and a gate conductor film over the masking particles and emitter material and removing the particles to reveal a random distribution of apertures to the emitter material. The result is a novel and economical field emission device having numerous randomly distributed emission apertures which can be used to make low cost flat panel displays.

Abstract translation: 根据本发明，通过将发射体材料设置在绝缘基板上，将掩模粒子施加到发射极材料，在掩模颗粒和发射体材料上施加绝缘膜和栅极导体膜，并将颗粒除去，制成场致发射器件 揭示孔径随机分布到发射体材料。 结果是一种新颖且经济的场致发射装置，其具有许多随机分布的发射孔，其可用于制造低成本的平板显示器。

公开(公告)号：US5725938A

公开(公告)日：1998-03-10

申请号：US699515

申请日：1996-08-29

Applicant: Sungho Jin ,  David Wilfred Johnson, Jr. ,  Henry Hon Law ,  John Thomson, Jr. ,  Thomas Henry Tiefel

Inventor： Sungho Jin ,  David Wilfred Johnson, Jr. ,  Henry Hon Law ,  John Thomson, Jr. ,  Thomas Henry Tiefel

IPC: H05K1/16 ,  C04B41/45 ,  C04B41/51 ,  C04B41/52 ,  C04B41/81 ,  C04B41/85 ,  C04B41/88 ,  C04B41/89 ,  H01L39/24 ,  H01L41/22 ,  H05K1/03 ,  H05K3/10 ,  H05K3/12 ,  B32B3/00 ,  B22F3/00 ,  B32B9/06 ,  B32B15/00

CPC classification number: C04B41/009 ,  C04B41/4558 ,  C04B41/51 ,  C04B41/52 ,  C04B41/81 ,  C04B41/88 ,  C04B41/89 ,  H01L39/2474 ,  H01L41/29 ,  H05K3/105 ,  C04B2111/00844 ,  H05K1/0306 ,  Y10S428/901 ,  Y10T428/12007 ,  Y10T428/12493 ,  Y10T428/24926

Abstract: The present invention provides improved techniques for metallizing ceramic substrates. The method comprises providing a ceramic substrate and depositing a layer of reducible material on the ceramic substrate. The layer of reducible material includes a reducible ceramic such as copper oxide. The ceramic substrate having the layer of reducible material disposed thereon is heated and the reducible material is contacted with a reducing agent to create a conductive region. The conductive region is either a metallized region formed by reduction, or it is a conductive ceramic formed through surface reduction. The present invention further provides a metallized ceramic substrate. The metallized layer comprises ceramic regions having at least one constituent in common with the ceramic substrate. The ceramic substrate and the ceramic regions of the metallized layer are sintered to each other such that the metallized region is interspersed between the sintered ceramic regions. In this fashion, the metal is firmly held to the ceramic substrate due to the presence of the bonded ceramic within the metallized layer.

Abstract translation: 本发明提供了用于金属化陶瓷衬底的改进技术。 该方法包括提供陶瓷衬底并在陶瓷衬底上沉积一层可还原材料。 可还原材料层包括可还原陶瓷如氧化铜。 将具有设置在其上的可还原材料层的陶瓷基板加热并使可还原材料与还原剂接触以产生导电区域。 导电区域是通过还原形成的金属化区域，或者是通过表面还原形成的导电陶瓷。 本发明还提供一种金属化陶瓷衬底。 金属化层包括具有至少一种与陶瓷衬底相同的成分的陶瓷区域。 陶瓷基板和金属化层的陶瓷区域彼此烧结，使得金属化区域散布在烧结陶瓷区域之间。 以这种方式，由于在金属化层内存在结合的陶瓷，金属被牢固地保持在陶瓷基片上。

公开(公告)号：US5698160A

公开(公告)日：1997-12-16

申请号：US705035

申请日：1996-08-29

Applicant: Ho Sou Chen ,  Sungho Jin ,  Mark Thomas McCormack

Inventor： Ho Sou Chen ,  Sungho Jin ,  Mark Thomas McCormack

IPC: B23K35/26 ,  C22C13/00

CPC classification number: C22C13/00 ,  B23K35/262

Abstract: According to the present invention, an article of manufacture is provided having at least one region which includes a lead-free solder composition. The lead-free solder composition comprises an alloy of at least 50 wt. % tin and 7-30 wt. % zinc. An effective amount of silver is added to increase the ductility of the resultant alloy at least 25% over the ductility of the binary eutectic tin-zinc alloy. In a further embodiment, the present invention provides alloys useful in articles comprising lead-free solder compositions. The alloys include at least (8.0+y) wt. % zinc, 0.25 y to 0.5 y wt. % silver and at least 50 wt. % tin where y is from 0.2 to 22.

Abstract translation: 根据本发明，提供了具有至少一个包括无铅焊料组合物的区域的制造品。 无铅焊料组合物包含至少50wt。 ％锡和7-30重量％ ％锌。 加入有效量的银以使所得合金的延展性比二元共晶锡 - 锌合金的延展性提高至少25％。 在另一个实施方案中，本发明提供了可用于包含无铅焊料组合物的制品中的合金。 合金包括至少（8.0 + y）wt。 ％锌，0.25〜0.5重量％ ％银和至少50重量％ ％锡，其中y为0.2至22。

公开(公告)号：US5690530A

公开(公告)日：1997-11-25

申请号：US728254

申请日：1996-10-08

Applicant: Sungho Jin ,  Gregory Peter Kochanski ,  Wei Zhu

Inventor： Sungho Jin ,  Gregory Peter Kochanski ,  Wei Zhu

IPC: H01J31/12 ,  H01J5/03 ,  H01J9/18 ,  H01J9/24 ,  H01J29/02 ,  H01J29/87

CPC classification number: H01J29/028 ,  H01J31/123 ,  H01J9/185 ,  H01J2329/8625 ,  H01J2329/863 ,  H01J2329/8635 ,  H01J2329/864

Abstract: In accordance with the invention, a field emission device is provided with an improved pillar structure comprising multi-layer pillars. The pillars have a geometric structure that traps most secondary electrons and an exposed surface that reduces the number of secondary electrons. Processing and assembly methods permit low-cost manufacturing of high breakdown-voltage devices, including flat panel displays.

Abstract translation: 根据本发明，场发射装置具有包括多层支柱的改进的支柱结构。 支柱具有捕获大多数二次电子的几何结构和减少二次电子数的暴露表面。 加工和组装方法允许低成本制造包括平板显示器在内的高击穿电压装置。

公开(公告)号：US5681196A

公开(公告)日：1997-10-28

申请号：US560061

申请日：1995-11-17

Applicant: Sungho Jin ,  Gregory Peter Kochanski ,  John Thomson, Jr.

Inventor： Sungho Jin ,  Gregory Peter Kochanski ,  John Thomson, Jr.

IPC: H01J1/304 ,  H01J9/02 ,  H01J31/12

CPC classification number: H01J9/025 ,  H01J2201/30403 ,  H01J2201/30457 ,  H01J2329/00

Abstract: In accordance with the invention, a field emission device is made by disposing emitter material on an insulating substrate, applying a sacrificial film to the emitter material and forming over the sacrificial layer a conductive gate layer having a random distribution of apertures therein. In the preferred process, the gate is formed by applying masking particles to the sacrificial film, applying a conductive film over the masking particles and the sacrificial film and then removing the masking particles to reveal a random distribution of apertures. The sacrificial film is then removed. The apertures then extend to the emitter material. In a preferred embodiment, the sacrificial film contains dielectric spacer particles which remain after the film is removed to separate the emitter from the gate. The result is a novel and economical field emission device having numerous randomly distributed emission apertures which can be used to make low cost flat panel displays.

Abstract translation: 根据本发明，通过将发射极材料设置在绝缘衬底上，将牺牲膜施加到发射极材料并在牺牲层上形成具有其中孔径随机分布的导电栅极层而形成场致发射器件。 在优选的方法中，通过将掩模颗粒施加到牺牲膜，在掩模颗粒和牺牲膜上施加导电膜，然后去除掩模颗粒以显示孔的随机分布来形成栅极。 然后去除牺牲膜。 孔然后延伸到发射体材料。 在优选实施例中，牺牲膜包含介电间隔物颗粒，其在除去膜之后保留，以将发射极与栅极分离。 结果是一种新颖且经济的场致发射装置，其具有许多随机分布的发射孔，其可用于制造低成本的平板显示器。

公开(公告)号：US5665252A

公开(公告)日：1997-09-09

申请号：US501632

申请日：1995-07-12

Applicant: Sungho Jin ,  Wei Zhu

Inventor： Sungho Jin ,  Wei Zhu

IPC: C04B41/53 ,  C04B41/91 ,  H01L21/306 ,  B29D11/00 ,  B29D25/00

CPC classification number: C04B41/009 ,  C04B41/5361 ,  C04B41/91 ,  H01L21/306

Abstract: The method of shaping a polycrystalline diamond (PCD) body (exemplarily a wafer of CVD-PCD) utilizes our discovery that the rate and amount of diamond removal from a given region of a PCD body depends, for a given metal "etchant" at a given temperature, on the thickness of the etchant layer overlying the given region, with relatively larger etchant thickness being associated with relatively higher removal rate and amount. Exemplarily, the method can be used to substantially remove thickness variations and/or film curvature from as-produced PCD films. An exemplary metal that can be used in the practice of the invention is mischmetal. The metal etchant can be molten, partially molten or solid.

Abstract translation: 成型多晶金刚石（PCD）体（例如CVD-PCD的晶片）的方法利用我们的发现，从PCD体的给定区域去除金刚石的速率和量取决于给定的金属“蚀刻剂” 给定温度，覆盖给定区域的蚀刻剂层的厚度，相对较大的蚀刻剂厚度与相对较高的去除速率和量相关联。 示例性地，该方法可用于基本上从生产的PCD膜中去除厚度变化和/或膜弯曲。 可用于本发明实践中的示例性金属是混合稀土。 金属蚀刻剂可以熔融，部分熔融或固体。

公开(公告)号：US5625449A

公开(公告)日：1997-04-29

申请号：US509410

申请日：1995-07-31

Applicant: John E. Graebner ,  Sungho Jin

Inventor： John E. Graebner ,  Sungho Jin

IPC: G01N21/59

CPC classification number: G01N21/59

Abstract: A portion of a surface of a sample body is arranged to receive an incident optical beam having an optical intensity I.sub.0. On an opposing surface of the sample body is located an optical detector which senses the intensity I of the resulting optical radiation emerging from the opposing surface of the sample body. In order to measure the thickness t of the sample body, a thickness gauge is located either at another portion of the surface of the sample body or on the optical detector.

Abstract translation: 样品体的表面的一部分被布置成接收具有光强度I0的入射光束。 在样本体的相对表面上设置有光学检测器，其感测从样品体的相对表面出射的所得光学辐射的强度I. 为了测量样品体的厚度t，厚度计位于样品体表面的另一部分或光学检测器上。