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公开(公告)号：US20150087977A1
公开(公告)日：2015-03-26
申请号：US14561328
申请日：2014-12-05
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
CPC classification number: A61B8/4494 , A61B8/14 , A61B8/145 , A61B8/4483 , A61B8/4488 , A61B8/485 , A61B8/54 , A61N7/00 , A61N7/02 , B06B1/02 , B81C1/00246 , G01S7/52019 , G01S7/52034 , G01S7/52047 , G01S7/5208 , G01S15/02 , G01S15/8915 , G01S15/8977 , H04R1/00 , Y10T29/41
Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the “ultrasound-on-a-chip” solution disclosed herein.
Abstract translation: 为了实现单芯片超声成像解决方案，可以在接收信号路径中采用片上信号处理以减少数据带宽，并且可以使用高速串行数据模块来将数据作为数字的片外移动数据 数据流。 片上接收信号的数字化允许在芯片上执行高级数字信号处理，从而允许整个超声波成像系统完全集成在单个半导体衬底上。 同样公开了各种新颖的波形产生技术，换能器配置和偏置方法等。 HIFU方法可以额外地或替代地用作本文公开的“片上超声”解决方案的组件。
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公开(公告)号：US20150032002A1
公开(公告)日：2015-01-29
申请号：US14337813
申请日：2014-07-22
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston , Gregory L. Charvat , Gregory Corteville
CPC classification number: A61B8/4444 , A61B8/13 , A61B8/14 , A61B8/4411 , A61B8/4477 , A61B8/4483 , A61B8/4488 , A61B8/4494 , A61B8/483 , A61B8/5207 , A61B8/54 , A61B8/56 , A61N7/02 , A61N2007/0078 , B06B1/0292 , G01S7/003 , G01S7/5208 , G01S7/52084 , G01S15/8915 , G03B27/423 , G03B27/52 , Y10T29/49005
Abstract: Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.
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公开(公告)号：US20210386399A1
公开(公告)日：2021-12-16
申请号：US17209126
申请日：2021-03-22
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston , Gregory L. Charvat , Gregory Corteville
IPC: A61B8/00 , A61B8/13 , A61B8/08 , G03B27/42 , G03B27/52 , B06B1/02 , G01S7/00 , G01S7/52 , G01S15/89 , A61B8/14 , A61N7/02
Abstract: Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.
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公开(公告)号：US11039812B2
公开(公告)日：2021-06-22
申请号：US15606131
申请日：2017-05-26
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston , Gregory L. Charvat , Gregory Corteville
IPC: A61B8/13 , A61B8/00 , A61B8/08 , G03B27/42 , G03B27/52 , B06B1/02 , G01S7/00 , G01S7/52 , G01S15/89 , A61B8/14 , A61N7/02 , A61N7/00
Abstract: Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.
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公开(公告)号：US20210114060A1
公开(公告)日：2021-04-22
申请号：US17086311
申请日：2020-10-30
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.
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Patent Agency Ranking
公开(公告)号：US10972842B2
公开(公告)日：2021-04-06
申请号：US16016359
申请日：2018-06-22
Applicant: Butterfly Network, Inc.
Inventor： Joseph Lutsky , Nevada J. Sanchez , Kailiang Chen , Keith G. Fife , Tyler S. Ralston
Abstract: Aspects of the technology described herein relate to ultrasound circuits that employ a differential ultrasonic transducer element, such as a differential micromachined ultrasonic transducer (MUT) element. The differential ultrasonic transducer element may be coupled to an integrated circuit that is configured to operate the differential ultrasonic transducer element in one or more modes of operation, such as a differential receive mode, a differential transmit mode, a single-ended receive mode, and a single-ended transmit mode.
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107.发明申请公开(公告)号：US20200070206A1
公开(公告)日：2020-03-05
申请号：US16679500
申请日：2019-11-11
Applicant: Butterfly Network, Inc.
Inventor： Susan A. Alie , Keith G. Fife , Joseph Lutsky , David Grosjean
Abstract: An ultrasonic transducer includes a membrane, a bottom electrode, and a plurality of cavities disposed between the membrane and the bottom electrode, each of the plurality of cavities corresponding to an individual transducer cell. Portions of the bottom electrode corresponding to each individual transducer cell are electrically isolated from one another. Each portion of the bottom electrode corresponds to each individual transducer that cell further includes a first bottom electrode portion and a second bottom electrode portion, the first and second bottom electrode portions electrically isolated from one another.
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公开(公告)号：US20200066966A1
公开(公告)日：2020-02-27
申请号：US16666238
申请日：2019-10-28
Applicant: Butterfly Network Inc.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Jaime Scott Zahorian , Paul Francis Cristman , Keith G. Fife
IPC: H01L41/27 , H05K3/36 , H01L41/047 , B06B1/06 , B06B1/02
Abstract: An ultrasound-on-a-chip device has an ultrasonic transducer substrate with plurality of transducer cells, and an electrical substrate. For each transducer cell, one or more conductive bond connections are disposed between the ultrasonic transducer substrate and the electrical substrate. Examples of electrical substrates include CMOS chips, integrated circuits including analog circuits, interposers and printed circuit boards.
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公开(公告)号：US20200013691A1
公开(公告)日：2020-01-09
申请号：US16502553
申请日：2019-07-03
Applicant: Butterfly Network, Inc.
Inventor： Jianwei Liu , Keith G. Fife
IPC: H01L23/31 , H01L23/498 , H01L21/56 , H01L23/00 , A61B8/00
Abstract: Described herein are methods and apparatuses for packaging an ultrasound-on-a-chip. An ultrasound-on-a-chip may be coupled to a redistribution layer and to an interposer layer. Encapsulation may encapsulate the ultrasound-on-a-chip device and first metal pillars may extend through the encapsulation and electrically couple to the redistribution layer. Second metal pillars may extend through the interposer layer. The interposer layer may include aluminum nitride. The first metal pillars may be electrically coupled to the second metal pillars. A printed circuit board may be coupled to the interposer layer.
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公开(公告)号：US20190388935A1
公开(公告)日：2019-12-26
申请号：US16562821
申请日：2019-09-06
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.
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