Abstract:
This inspection jig is provided with: a plurality of probes (Pr) for bringing leading end portions (Pra) thereof into contact with a plurality of inspection points on a substrate (100); a support member (300) that supports the probes (Pr) in a state wherein the leading end portions (Pra) are disposed to be in contact with the inspection points on the substrate (100) respectively; device-side connecting terminals (36) electrically connected to an inspection device main body (2); a plurality of standard disposition electrodes (332), which are conducted to the device-side connecting terminals (36), and are disposed in previously set standard disposition; and a conversion block (31), which has a first surface (311) and a second surface (312) on sides opposite to each other, and in which first electrodes (E1) are formed on the first surface (311), and in which second electrodes (E2) are formed on the second surface (312).
Abstract:
A circuit board testing apparatus detects sparking and partial discharge between wiring patterns on a circuit board to determine if the circuit board is defective. A constant current source feeds a constant current to a wiring pattern to be tested. A voltage measurement part measures the resulting voltage at the wiring pattern. A normal state voltage gradient calculation part calculates a voltage gradient in a normal state where there is no sparking or partial discharge. A determination part determines whether the voltage gradient remains invariant, by comparing voltage measurement results within a predetermined range with an estimated value of the voltage based on the voltage gradient in the normal state. The determination part determines whether a circuit board is defective, on the basis of whether the voltage gradient remains invariant.
Abstract:
Provided is a contact probe which may achieve improved heat resistance even when a spring portion thereof is compressed and released in a high temperature environment. The contact probe includes an Ni—P layer, and the Ni—P layer has different concentrations of P at different positions in a thickness direction of the Ni—P layer.
Abstract:
A circuit board inspecting apparatus is disclosed for inspecting a circuit board having wiring patterns separated from each other and forming a plurality of wiring pattern pairs. The apparatus includes a low-voltage inspection part to apply a first low-potential difference below a threshold voltage between wiring patterns in a first of the plurality of wiring pattern pairs, and to detect a first current flowing therebetween. A resistance measurement part is provided to measure a first resistance value between the wiring patterns of the first wiring pattern pair upon detection of the first current and a high-voltage inspection part is configured to selectively apply, based on the first resistance value, a high-potential difference above said threshold voltage, between the wiring patterns in a second of said plurality of wiring pattern pairs.
Abstract:
An inspection apparatus is provided with a holder configured to set an inspection target thereon, the inspection target configured to detect a contact position on the inspection target touched by a human finger; pseudo finger(s) configured to be detected as the human finger upon contact with the inspection target; a positioner configured to move the pseudo finger(s) relative to the inspection target and to change the contact position of the pseudo finger(s) relative to the inspection target; a memory configured to store, respectively, a value of a pressing force in a range of pressing forces said range including a zero pressing force for each of the pseudo finger(s) on the inspection target; a controller configured to regulate the pressing force for pseudo finger(s) of the pseudo finger(s) based on the respective value; and a sensor configured to acquire an electric signal output from the inspection target.
Abstract:
An inspection apparatus for inspecting wires of an object in which a plurality of x-axis and y-axis wires are arranged perpendicular to each other, each x-axis and y-axis wire having a display wire and tab wire, respectively. The apparatus includes a power supply device supplying an AC signal to the wire as an inspection object; a connecting device being in conductive contact with the tab wire to transmit the AC signal, a first detecting device disposed in a non-contact manner at one end of the display wire and conductively connected to one end of the power supply device, a second detecting device disposed in the non-contact manner and opposed to the display wire and conductively connected to the one end of the power supply device, and a determining device determining quality of the wire on the basis of results of the first and second detecting devices.
Abstract:
In an insulation inspection apparatus configured to perform insulation inspection of a wiring pattern, when a voltage for performing the insulation inspection is applied between inspection objects, a current control unit controls a first current to be greater than a second current, the first current being supplied until the potential difference between the first inspection part and the second inspection part reaches the predetermine potential difference, the second current being supplied when the predetermined potential difference is reached.
Abstract:
A substrate inspection system includes a plurality of processing units, and each processing unit is provided with a transport mechanism configured to transport an substrate to be inspected along a transport passage which extends substantially horizontally, a lift mechanism configured to lift the substrate to be inspected to a height position, at a set position on the transport passage, and processors each configured to perform a predetermined process on the substrate to be inspected positioned at the height position. The processing units are arranged such that transport passages thereof are aligned and such that the transport directions thereof are the same direction. Between two adjacent transport passages, the substrate to be inspected is delivered from the transport passage on an upstream side to the transport passage on a downstream side.
Abstract:
In a circuit board testing apparatus for performing a four-terminal measurement method on a wiring pattern formed of a plurality of wires on a circuit board, a control part connects in series contact probes to be connected to upstream-side voltage detection terminals or downstream-side voltage detection terminals, via connection terminals, allows a power supply part to apply power between the test points with which the contact probes connected in series are in contact, allows a voltage detection part to detect a voltage between the test points, and makes a determination as to conductive contact states of the contact probes with the test points, based on the detected voltage.
Abstract:
A method for maintaining a contact of a connection jig for connecting between a target object to be subjected to an electrical test and a testing apparatus configured to conduct the electrical test on the target object includes: detecting a change in voltage upon supply of power for the electrical test to a test point on the target object through the contact; and issuing maintenance information indicating the contact is abnormal, upon detection of a portion where the voltage does not successively rise.