公开(公告)号：US20200300930A1

公开(公告)日：2020-09-24

申请号：US16770631

申请日：2018-11-26

Applicant: NIDEC READ CORPORATION

Inventor： Masami YAMAMOTO ,  Kazuhiko KITANO ,  Norihiro OTA ,  Shigeki SAKAI ,  Kiyoshi NUMATA

IPC: G01R33/02 ,  H01L43/12 ,  H01F41/04

Abstract: A method for producing an MI element includes: an insulation step of forming an insulator layer on an outer periphery of an amorphous wire; an electroless plating step of forming an electroless plating layer on an outer peripheral surface of the insulator layer; an electrolytic plating step of forming an electrolytic plating layer on an outer peripheral surface of the electroless plating layer; a resist step of forming a resist layer on an outer peripheral surface of the electrolytic plating layer; an exposure step of exposing the resist layer with a laser to form a spiral groove strip on an outer peripheral surface of the resist layer; an etching step of performing etching using the resist layer as a masking material and removing the electroless plating layer and the electrolytic plating layer in the groove strip to form a coil with the remaining electroless plating layer and electrolytic plating layer.

公开(公告)号：US20190383858A1

公开(公告)日：2019-12-19

申请号：US16466656

申请日：2017-10-04

Applicant: NIDEC READ CORPORATION

Inventor： Masami YAMAMOTO ,  Norihiro OTA ,  Shigeki SAKAI

IPC: G01R1/067 ,  G01R3/00

Abstract: A contact probe may include a Ni pipe that may include a coiled spring structure, and the Ni pipe 11 may contain 0.5 to 10 wt % of phosphorus (P). The contact probe may have improved durability, by reducing shrinkage, after probing performed in a high temperature environment.

公开(公告)号：US20180340960A1

公开(公告)日：2018-11-29

申请号：US15989271

申请日：2018-05-25

Applicant: NIDEC READ CORPORATION

Inventor： Masami YAMAMOTO ,  Norihiro OTA ,  Shigeki SAKAI

IPC: G01R1/067 ,  C25D3/12 ,  C25D5/48

CPC classification number: G01R1/06761 ,  C23C18/1653 ,  C23C18/42 ,  C25D1/04 ,  C25D1/20 ,  C25D3/12 ,  C25D3/562 ,  C25D5/12 ,  C25D5/14 ,  C25D5/48 ,  G01R1/06722 ,  G01R35/00

Abstract: Provided is a contact probe which may achieve improved heat resistance even when a spring portion thereof is compressed and released in a high temperature environment. The contact probe includes an Ni—P layer, and the Ni—P layer has different concentrations of P at different positions in a thickness direction of the Ni—P layer.