Invention Application
US20160103172A1 CIRCUIT BOARD TESTING APPARATUS AND CIRCUIT BOARD TESTING METHOD 审中-公开
电路板测试装置和电路板测试方法

  • Patent Title: CIRCUIT BOARD TESTING APPARATUS AND CIRCUIT BOARD TESTING METHOD
  • Patent Title (中): 电路板测试装置和电路板测试方法
  • Application No.: US14876846
    Application Date: 2015-10-07
  • Publication No.: US20160103172A1
    Publication Date: 2016-04-14
  • Inventor: Munehiro Yamashita
  • Applicant: NIDEC-READ CORPORATION
  • Priority: JP2014-206975 20141008
  • Main IPC: G01R31/28
  • IPC: G01R31/28 G01R1/073
CIRCUIT BOARD TESTING APPARATUS AND CIRCUIT BOARD TESTING METHOD
Abstract:
In a circuit board testing apparatus for performing a four-terminal measurement method on a wiring pattern formed of a plurality of wires on a circuit board, a control part connects in series contact probes to be connected to upstream-side voltage detection terminals or downstream-side voltage detection terminals, via connection terminals, allows a power supply part to apply power between the test points with which the contact probes connected in series are in contact, allows a voltage detection part to detect a voltage between the test points, and makes a determination as to conductive contact states of the contact probes with the test points, based on the detected voltage.
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