Invention Application
US20160103172A1 CIRCUIT BOARD TESTING APPARATUS AND CIRCUIT BOARD TESTING METHOD
审中-公开
电路板测试装置和电路板测试方法
- Patent Title: CIRCUIT BOARD TESTING APPARATUS AND CIRCUIT BOARD TESTING METHOD
- Patent Title (中): 电路板测试装置和电路板测试方法
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Application No.: US14876846Application Date: 2015-10-07
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Publication No.: US20160103172A1Publication Date: 2016-04-14
- Inventor: Munehiro Yamashita
- Applicant: NIDEC-READ CORPORATION
- Priority: JP2014-206975 20141008
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G01R1/073

Abstract:
In a circuit board testing apparatus for performing a four-terminal measurement method on a wiring pattern formed of a plurality of wires on a circuit board, a control part connects in series contact probes to be connected to upstream-side voltage detection terminals or downstream-side voltage detection terminals, via connection terminals, allows a power supply part to apply power between the test points with which the contact probes connected in series are in contact, allows a voltage detection part to detect a voltage between the test points, and makes a determination as to conductive contact states of the contact probes with the test points, based on the detected voltage.
Public/Granted literature
- US10175284B2 Circuit board testing apparatus and circuit board testing method Public/Granted day:2019-01-08
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