公开(公告)号：US20230091760A1

公开(公告)日：2023-03-23

申请号：US17993897

申请日：2022-11-24

申请人： TSLC Corporation

发明人： Po-Wei LEE

IPC分类号： H01S5/0233 ,  H01S5/02315 ,  H01S5/02253 ,  H01S5/024 ,  H01S5/02355

摘要： A three-dimensional optoelectronic device package is disclosed. The three-dimensional optoelectronic device package comprises a first board having at least one surface on which one or more optoelectronic devices is disposed, and a second board having at least one surface on which a plurality of optoelectronic devices is disposed. A side of the second board is attached to the surface of the first board on which one or more optoelectronic devices is disposed to form an angle between the surface of the first board on which one or more optoelectronic devices is disposed and the surface of the second board on which one or more optoelectronic devices is disposed. A method for manufacturing a three-dimensional optoelectronic device package is also disclosed.

公开(公告)号：US11604256B2

公开(公告)日：2023-03-14

申请号：US16840037

申请日：2020-04-03

申请人： Samsung Electronics Co., Ltd. ,  Samsung Electro-Mechanics Co., Ltd.

发明人： Jaeyoung Huh ,  Kyungwan Park ,  Jungho Bae ,  Boram Kim ,  Youngjin Kim ,  Hyun Kim ,  Byeonghoon Park ,  Yoonsun Park ,  Woontahk Sung ,  Kyungwoo Lee ,  Kihoon Jang ,  Younho Choi

IPC分类号： G01S7/481 ,  H01S5/024 ,  H05K5/00 ,  H05K1/02 ,  H05K1/14 ,  G03B17/55 ,  H01S5/02 ,  H05K7/20 ,  G01S17/10 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235

摘要： An electronic device including a heat-radiant structure of a camera is provided. The electronic device includes a housing including a front plate, a back plate, an image sensor to receive light through a first region of the back plate, and a laser emitter to emit light through a second region of the back plate, a laser driver, a housing structure surrounding at least a part of a side face of the image sensor and driver, a first metal structure, a first heat transfer member including a first portion, a second portion, and a third portion extended from the second portion to a space between the driver and the front plate, a second heat transfer member extended from the third portion of the first heat transfer member, and a first thermal interface material (TIM) disposed between the second heat transfer member and the front plate.

公开(公告)号：US20230071897A1

公开(公告)日：2023-03-09

申请号：US17985997

申请日：2022-11-14

申请人： NICHIA CORPORATION

发明人： Kazuma KOZURU ,  Takuya HASHIMOTO

IPC分类号： H01S5/40 ,  G03B21/20 ,  H01S5/0237 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235

摘要： A light emitting module includes: a first light emitting device including: a first package, a plurality of first semiconductor laser elements mounted in the first package, and a first lens member having lens portions, a number of the lens portion is the same as a number of the first semiconductor laser elements; and a second light emitting device including: a second package, a plurality of second semiconductor laser elements mounted in the second package, wherein a quantity of the second semiconductor laser elements is fewer than a quantity of the first semiconductor laser elements, and a second lens member which is structured the same as the first lens member; and one or more mounting substrates in which the first light emitting device and the second light emitting device are mounted.

公开(公告)号：US20230058904A1

公开(公告)日：2023-02-23

申请号：US17785763

申请日：2020-12-18

申请人： ams Sensors Singapore Pte. Ltd.

发明人： Edgar FLORES PARRA

IPC分类号： H01S5/0239 ,  G02B6/42 ,  H01S5/0232 ,  H01S5/0233 ,  H01S5/183

摘要： An optical assembly comprising an interdigital capacitor, one or more electrical contacts in electrical connection with the interdigital capacitor and an insulating layer covering at least a portion of the interdigital capacitor. The one or more electrical contacts and a portion of the insulating layer are configured to receive conductive adhesive. The optical assembly further comprises a metallic layer positioned between the interdigital capacitor and the portion of the insulating layer configured to receive the conductive adhesive.

公开(公告)号：US11545813B2

公开(公告)日：2023-01-03

申请号：US16710186

申请日：2019-12-11

申请人： NICHIA CORPORATION

发明人： Kazuma Kozuru ,  Takuya Hashimoto

IPC分类号： H01S5/40 ,  G03B21/20 ,  H01S5/0237 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02325

摘要： A method of manufacturing a light emitting module comprising at least one light emitting device in which a plurality of light emitting elements are mounted, includes: providing a plurality of light emitting devices including one or more first light emitting devices and one or more second light emitting devices, wherein a number of the light emitting elements mounted in the first light emitting device is different from a number of the light emitting elements mounted in the second light emitting device; providing a first mounting substrate having a mounting surface provided with a plurality of connection patterns having the same pattern, each of the connection patterns corresponding to a respective one of the light emitting devices; and mounting at least some of the plurality of light emitting devices, selected from the one or more first light emitting devices and one or more second light emitting devices, on the connection patterns.

公开(公告)号：US20220311204A1

公开(公告)日：2022-09-29

申请号：US17703165

申请日：2022-03-24

申请人： NICHIA CORPORATION

发明人： Soichiro MIURA ,  Takuya HASHIMOTO

IPC分类号： H01S5/0233 ,  H01L33/48 ,  H01L33/60 ,  H01S5/02326 ,  G02B27/14

摘要： A light-emitting device includes: a first light-emitting element including a first light-emission surface through which first light is emitted along a first optical axis; a second light-emitting element disposed apart from the first light-emitting element in a first direction that is perpendicular to the first optical axis, the second light-emitting element including a second light-emission surface through which second light is emitted along a second optical axis that is inclined with respect to the first optical axis in a second direction opposite to the first direction; and a third light-emitting element disposed apart from the first light-emitting element in the second direction, wherein the third light-emitting element includes a third light-emission surface through which third light is emitted along a third optical axis that is inclined with respect to the first optical axis in the first direction.

公开(公告)号：US11444433B2

公开(公告)日：2022-09-13

申请号：US17446606

申请日：2021-08-31

申请人： Silanna Asia Pte Ltd

发明人： Joseph H. Colles ,  Steven E. Rosenbaum ,  Stuart B. Molin

IPC分类号： H01S5/026 ,  H01S5/042 ,  H01S5/0233 ,  H03K17/687 ,  H01S5/42 ,  H01S5/40

摘要： A laser diode driver includes a clock terminal to receive a clock signal, configuration terminals to receive configuration data, drive terminals, and charging terminals. A first charging terminal is operable to charge a source capacitor of a resonant circuit that includes the source capacitor, an inductor, and a bypass capacitor. Each drive terminal is operable to be directly electrically connected to an anode or cathode of a laser diode or to ground. A mode, output selection, and grouping of drive signals that are delivered to the laser diodes are configured based on the configuration data. The laser diode driver is operable to control a current flow through the resonant circuit to produce high-current pulses through the laser diodes, the high-current pulses corresponding to a peak current of a resonant waveform developed at respective anodes of the laser diodes, a timing of the high-current pulses being synchronized using the clock signal.

公开(公告)号：US20220231479A1

公开(公告)日：2022-07-21

申请号：US17702454

申请日：2022-03-23

申请人： KYOCERA SLD Laser, Inc

发明人： James W. Raring ,  Paul Rudy ,  Eric Goutain ,  Troy Trottier ,  Melvin McLaurin ,  James Harrison

IPC分类号： H01S5/024 ,  H01S5/323 ,  H01S5/22 ,  H01S5/40 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235

摘要： The embodiments described herein provide a device and method for an integrated white colored electromagnetic radiation source using a combination of laser diode excitation sources based on gallium and nitrogen containing materials and light emitting source based on phosphor materials. A violet, blue, or other wavelength laser diode source based on gallium and nitrogen materials may be closely integrated with phosphor materials, such as yellow phosphors, to form a compact, high-brightness, and highly-efficient, white light source.

公开(公告)号：US11336077B2

公开(公告)日：2022-05-17

申请号：US15979694

申请日：2018-05-15

申请人： Vixar Inc.

发明人： William Hogan ,  Mary Brenner

IPC分类号： H01S5/183 ,  H01S5/42 ,  H01S5/0225 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/02253 ,  H01S5/02325 ,  H01L33/48 ,  H01S5/00 ,  H01S5/02208 ,  H01S5/0237 ,  H01S5/02257 ,  H01S5/02326

摘要： An optical package having a patterned submount, an optoelectronic device mounted to the patterned submount, a spacer affixed on one side to the patterned submount, the spacer having a bore hole therethrough wherein the optoelectronic device is positioned, and an optical element affixed to the spacer on a side opposite the patterned submount and covering the spacer bore hole. The patterned submount may be a circuit board. The optoelectronic device may be a VCSEL. The spacer may be affixed to the circuit board, for example, using an epoxy preform or an adhesive laminate. The spacer may, for example, be manufactured from a sheet of stainless steel or from a circuit board. The optical element may be, for example, a diffuser, a concave lens, a convex lens, a holographic element, polarizers, or diffraction gratings. The optical element may be affixed to the spacer using an epoxy preform or an adhesive laminate.

公开(公告)号：US20220021180A1

公开(公告)日：2022-01-20

申请号：US17357844

申请日：2021-06-24

申请人： Xiamen Chaoxuan Photoelectric Technology Co., Ltd.

发明人： Siyang CHENG ,  Jiansheng WU ,  Peijin WANG ,  Zirong ZENG

IPC分类号： H01S5/024 ,  H01S5/40 ,  H01S5/02253 ,  H01S5/023 ,  H05K7/20 ,  H01S5/0233

摘要： The present disclosure describes a diode laser array module that includes a plurality of diode lasers, a cooling module, and a pin connector module. The cooling module includes a heat sink that has structural features configured to allow pins of the diode lasers to be connected to a first conductive portion of the pin connector module within a recessed area in the bottom surface of the cooling module, where a second conductive portion of the pin connector module moves beyond the recessed area and is configured to be connected to a driving circuit module at a location outside of the recessed area in the bottom surface of the cooling module. Similarly principles are u to construct a diode laser array module comprising bank packaged diode laser modules, pin connector modules for the bank packaged diode laser modules, and a cooling module.