公开(公告)号：US20210366903A1

公开(公告)日：2021-11-25

申请号：US16878635

申请日：2020-05-20

申请人： TSLC Corporation

发明人： Po-Wei LEE

IPC分类号： H01L27/06 ,  H01L33/58 ,  H01L27/146 ,  H01L27/15 ,  H01L33/00

摘要： A three-dimensional optoelectronic device package is disclosed. The three-dimensional optoelectronic device package comprises a first board having at least one surface on which a plurality of optoelectronic devices is disposed, and a second board having at least one surface on which a plurality of optoelectronic devices is disposed. A side of the second board is attached to the surface of the first board on which a plurality of optoelectronic devices is disposed to form an angle between the surface of the first board on which a plurality of optoelectronic devices is disposed and the surface of the second board on which a plurality of optoelectronic devices is disposed. A method for manufacturing a three-dimensional optoelectronic device package is also disclosed.

公开(公告)号：US20230091760A1

公开(公告)日：2023-03-23

申请号：US17993897

申请日：2022-11-24

申请人： TSLC Corporation

发明人： Po-Wei LEE

IPC分类号： H01S5/0233 ,  H01S5/02315 ,  H01S5/02253 ,  H01S5/024 ,  H01S5/02355

摘要： A three-dimensional optoelectronic device package is disclosed. The three-dimensional optoelectronic device package comprises a first board having at least one surface on which one or more optoelectronic devices is disposed, and a second board having at least one surface on which a plurality of optoelectronic devices is disposed. A side of the second board is attached to the surface of the first board on which one or more optoelectronic devices is disposed to form an angle between the surface of the first board on which one or more optoelectronic devices is disposed and the surface of the second board on which one or more optoelectronic devices is disposed. A method for manufacturing a three-dimensional optoelectronic device package is also disclosed.