公开(公告)号：US20230058904A1

公开(公告)日：2023-02-23

申请号：US17785763

申请日：2020-12-18

申请人： ams Sensors Singapore Pte. Ltd.

发明人： Edgar FLORES PARRA

IPC分类号： H01S5/0239 ,  G02B6/42 ,  H01S5/0232 ,  H01S5/0233 ,  H01S5/183

摘要： An optical assembly comprising an interdigital capacitor, one or more electrical contacts in electrical connection with the interdigital capacitor and an insulating layer covering at least a portion of the interdigital capacitor. The one or more electrical contacts and a portion of the insulating layer are configured to receive conductive adhesive. The optical assembly further comprises a metallic layer positioned between the interdigital capacitor and the portion of the insulating layer configured to receive the conductive adhesive.