公开(公告)号：US12041747B2

公开(公告)日：2024-07-16

申请号：US17575184

申请日：2022-01-13

Applicant: Core Scientific, Inc.

Inventor： Harsh Patel ,  Devon Baldwin ,  Thomas Middleton Rutledge Fuller

IPC: H05K7/20 ,  H05K7/18

CPC classification number: H05K7/18 ,  H05K7/20172 ,  H05K7/20718

Abstract: A rack and system for cooling computing devices such as in a data center is disclosed. In one embodiment, the rack supports a plurality of computing devices and comprises a plurality of planar annular sector or trapezoidal shelves, each having one or more positions for holding computing devices. A number of vertical supports may hold the shelves in a vertically spaced arrangement, and an air barrier may be affixed to the rack. The air barrier may have openings for the computing devices to permit exhaust air to flow through the air barrier into a hot aisle. The rack maybe configured to be connected to other similar racks to form a vertical annular hyperboloid or a vertical hyperbolic annular paraboloid, and the computing devices may be installed to discharge exhaust at an angle relative to a centerline of the vertical annular hyperboloid or a vertical hyperbolic annular paraboloid to improve airflow.

公开(公告)号：US20240237299A9

公开(公告)日：2024-07-11

申请号：US17971348

申请日：2022-10-21

Applicant: Dell Products L.P.

Inventor： Tyler Baxter Duncan ,  Anthony Middleton

IPC: H05K7/20

CPC classification number: H05K7/20763 ,  H05K7/20272 ,  H05K7/20718

Abstract: Multiple systems for providing liquid and air cooling for IT components is disclosed. The modular system for cooling Information Technology (IT) includes a first module with at least one dry cooler that supplies liquid cooling to at least one liquid heat exchange device, and a second module with at least one liquid heat exchange device that provides liquid cooling to a facility with one or more IT units. The modular system may also provide cooling liquid to an air to liquid heat exchange device of the facility.

公开(公告)号：US20240196573A1

公开(公告)日：2024-06-13

申请号：US18335720

申请日：2023-06-15

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Yan-Kuei CHEN ,  Yi-Ta HSU

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/20163 ,  H05K7/20718

Abstract: An example method for providing cooling capacity and reducing power consumption of a server assembly is disclosed. The method includes receiving temperature information corresponding to a CPU of an electrical component in the server assembly, which further includes an equipment room, and a cabinet fan module positioned adjacent to a side of the equipment room. The cabinet fan module includes electric fans therein, and the electrical component is implemented in the equipment room. The method includes determining a current power level of the CPU, and determining, using the temperature information and the current power level, a first operating speed for the electric fans. Furthermore, the method includes combining the first operating speed with a second operating speed received from a proportional-integral-derivative controller to determine a combined operating speed. The method still further includes instructing the electric fans to operate at the combined operating speed.

公开(公告)号：US11920867B2

公开(公告)日：2024-03-05

申请号：US17003488

申请日：2020-08-26

Applicant: Baidu USA LLC

Inventor： Tianyi Gao

IPC: F28B7/00 ,  F28B1/06 ,  F28F25/10 ,  F28F27/00 ,  H05K7/20

CPC classification number: F28B7/00 ,  F28B1/06 ,  F28F25/10 ,  F28F27/003 ,  H05K7/20145 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20345 ,  H05K7/20718 ,  H05K7/208

Abstract: A modular cooling system for data center. An airflow section forms a duct for air flow and a plurality of core units are serially attached to each other and to the airflow section. A blower unit is attached to each of the core units. A plurality of motorized dampers are provided: between each of the core units and the airflow unit, in between each two core units, and between each core unit and its corresponding blower unit. A plurality of fluid ports are attached to each of the core units. At least one of the core units is loaded with one or more equipment selected from: air filter, humidifier, dehumidifier, heat exchanger, evaporator, condenser, chiller, computer room air conditioner (CRAC), dry cooler, a cooling tower or other types of cooling equipment. A combination operation of the components on the compartment and the cooling units enables fast deployment and operation.

公开(公告)号：US20240057299A1

公开(公告)日：2024-02-15

申请号：US17885376

申请日：2022-08-10

Applicant: Seagate Technology LLC

Inventor： Deepak Nayak ,  Hemant Mohan

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/20172 ,  H05K7/20718

Abstract: A data storage system includes an enclosure, a printed circuit board positioned in the enclosure, an integrated circuit mechanically and electrically coupled to the printed circuit board, temperature sensors configured to generate temperature signals in response to measured temperatures, an air mover coupled to the enclosure and including a motor rotatable in a clockwise direction and a counterclockwise direction, and a controller configured to cause rotation of the motor in either the clockwise direction or the counterclockwise direction depending on the temperature signals.

公开(公告)号：US20240014416A1

公开(公告)日：2024-01-11

申请号：US18190950

申请日：2023-03-27

Applicant: Xi'an Jiaotong University

Inventor： Wenquan TAO ,  Zixing WANG ,  Nan LI ,  Pu HE ,  Li CHEN

IPC: H01M8/04029 ,  H01M8/0662 ,  H01M8/04537 ,  H01M8/04858 ,  H01M8/0444 ,  H01M16/00 ,  H02B1/30 ,  H05K7/14 ,  H05K7/20

CPC classification number: H01M8/04029 ,  H01M8/0662 ,  H01M8/04604 ,  H01M8/04925 ,  H01M8/04462 ,  H01M16/006 ,  H02B1/30 ,  H05K7/1492 ,  H05K7/20718 ,  H01M2250/10

Abstract: Disclosed is a fuel cell power supply cabinet, comprising a modified cabinet integrated with a fuel cell system, and a coupled thermal management system of a fuel cell and a data center. The fuel cell system is integrated in the cabinet, and a server group and cooling equipment thereof are integrated in the upper part of the cabinet. The fuel cell system comprises a fuel cell stack, a plate heat exchanger, and a fuel cell control module. The fuel cell control module comprises a hydrogen module, an air module, a cooling module, an exhaust module, and a power source module. A standard server group, a liquid-air heat exchanger and a fan matrix are arranged at the upper part of the cabinet. The coupled thermal management system of the fuel cell and the data center comprises coupled management of server thermal management, fuel cell thermal management and computer room thermal management.

公开(公告)号：US11856730B2

公开(公告)日：2023-12-26

申请号：US17467284

申请日：2021-09-06

Applicant: CMOTION TECHNOLOGIES LIMITED

Inventor： Changjiang Ge ,  Minghui Sun ,  Hao Peng ,  Bin Yang ,  Zhenhui Li

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20254 ,  H05K7/20718 ,  H05K7/20781

Abstract: The present invention provides a liquid-cooled integrated cabinet, which belongs to the technical field of servers, and comprises a main body. A power distribution module is provided at the upper end of the main body, and multiple computing power modules which constitute a computing power center are parallelly provided on one side of the lower end of the main body; cooling fans stacked on top and bottom in multiple layers are arranged on the other side thereof; the computing power module is cooled by a liquid-cooled module, and the liquid-cooled module is a front and rear drawing structure relative to the main body. The cooling fan bears 8%-12% of the heat dissipation capacity. A cold plate shell in the liquid-cooled module contacts and conducts heat with a chip in the computing power module. The front end of the main body is provided with a hose for cooling medium to circulate; a liquid-cooled module corresponds to a hose; cooling medium flows through the hose and the liquid-cooled module, and then cools down the computing power module. The liquid-cooled integrated cabinet of the present invention is high in heat dissipation efficiency and compact in structure.

公开(公告)号：US11781780B1

公开(公告)日：2023-10-10

申请号：US17111349

申请日：2020-12-03

Applicant: Amazon Technologies, Inc.

Inventor： Alan Joseph Lachapelle

IPC: F24F13/10 ,  F24F7/10 ,  H05K7/20

CPC classification number: F24F13/10 ,  F24F7/10 ,  H05K7/20718 ,  H05K7/20836

Abstract: An air handling unit can include a first airflow passage and a second airflow passage having separate entrances. A cooling module can be arranged in the second airflow passage for cooling air passing there through. A cover, blocker, or other barrier can move between a position at least partially blocking the first entrance to the first airflow passage and at least partially blocking the second entrance to the second airflow passage. In various aspects, the barrier can be moved to intermediate positions to affect a ratio of air flowing through each of the passages and to thus control an overall amount of cooling provided to discharged air that corresponds to a mixture of the air directed through the cooling module and the air directed around the cooling module, which may be mixed together upon exiting the separate passages.

公开(公告)号：US11659691B2

公开(公告)日：2023-05-23

申请号：US17474129

申请日：2021-09-14

Applicant: Inventec (Pudong) Technology Corporation ,  INVENTEC CORPORATION

Inventor： Chun-Ming Chang ,  Tai-Jung Sung

IPC: H05K7/20 ,  H05K5/03

CPC classification number: H05K7/20718 ,  H05K5/03 ,  H05K7/20136 ,  H05K7/20254 ,  H05K7/20409 ,  H05K7/20763

Abstract: A server device includes a casing, an electronic assembly, a cover, and a heat dissipation device. The electronic assembly includes a circuit board and at least one heat source. The circuit board is disposed on the casing, and the heat source is disposed on the circuit board. The cover is slidably disposed on the casing. The heat dissipation device includes at least one air cooling heat exchanger and at least one liquid cooling heat exchanger. The air cooling heat exchanger is fixed on and thermally coupled with the heat source. The liquid cooling heat exchanger is fixed on the cover and thermally coupled with the air cooling heat exchanger.

公开(公告)号：US20180070475A1

公开(公告)日：2018-03-08

申请号：US15811587

申请日：2017-11-13

Applicant: Amazon Technologies, Inc.

Inventor： PETER GEORGE ROSS

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20718 ,  G06F1/20 ,  H05K7/20727 ,  H05K7/20836

Abstract: A computer system includes a chassis, one or more hard disk drives coupled to the chassis, and one or more air passages under at least one of the hard disk drives. The air passages include one or more air inlets and one or more air outlets. The inlets direct at least a portion of the air downwardly into the passages. The passages allow air to move from the air inlets to the air outlets.