Invention Grant
- Patent Title: Highly modularized cooling system design
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Application No.: US17003488Application Date: 2020-08-26
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Publication No.: US11920867B2Publication Date: 2024-03-05
- Inventor: Tianyi Gao
- Applicant: Baidu USA LLC
- Applicant Address: US CA Sunnyvale
- Assignee: BAIDU USA LLC
- Current Assignee: BAIDU USA LLC
- Current Assignee Address: US CA Sunnyvale
- Agency: WOMBLE BOND DICKINSON (US) LLP
- Main IPC: F28B7/00
- IPC: F28B7/00 ; F28B1/06 ; F28F25/10 ; F28F27/00 ; H05K7/20

Abstract:
A modular cooling system for data center. An airflow section forms a duct for air flow and a plurality of core units are serially attached to each other and to the airflow section. A blower unit is attached to each of the core units. A plurality of motorized dampers are provided: between each of the core units and the airflow unit, in between each two core units, and between each core unit and its corresponding blower unit. A plurality of fluid ports are attached to each of the core units. At least one of the core units is loaded with one or more equipment selected from: air filter, humidifier, dehumidifier, heat exchanger, evaporator, condenser, chiller, computer room air conditioner (CRAC), dry cooler, a cooling tower or other types of cooling equipment. A combination operation of the components on the compartment and the cooling units enables fast deployment and operation.
Public/Granted literature
- US20220065537A1 HIGHLY MODULARIZED COOLING SYSTEM DESIGN Public/Granted day:2022-03-03
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