Micro-opto-electro-mechanical system (MOEMS)
    1.
    发明申请
    Micro-opto-electro-mechanical system (MOEMS) 失效
    微光电机械系统(MOEMS)

    公开(公告)号:US20020168144A1

    公开(公告)日:2002-11-14

    申请号:US09844574

    申请日:2001-04-30

    Abstract: A MEMS-based adjustable mirror module allows faster, lower cost, and easier alignment of optical fibers in substrates. Movable mirrors formed on the substrate allow adjustment of the light path after the optical fiber is attached, after which the mirrors are affixed in place to prevent misalignment.

    Abstract translation: 基于MEMS的可调镜组件可以更快,更低成本,更容易地将光纤对准衬底。 形成在基板上的移动镜允许在安装光纤后调整光路,之后将镜子固定到位以防止未对准。

    MICRO-FABRICATED SHIELDED CONDUCTORS
    2.
    发明申请
    MICRO-FABRICATED SHIELDED CONDUCTORS 有权
    微型屏蔽导体

    公开(公告)号:US20020130916A1

    公开(公告)日:2002-09-19

    申请号:US09812498

    申请日:2001-03-19

    Abstract: A microstructure that may be used as an electrical connection in a microfabricated electro-mechanical system (MEMS) apparatus. The microstructure may have one or more isolatable electrical connections for signal transmission. The microstructure allows a MEMS apparatus to shield signal transmissions from the effects of electromagnetic interference or conductive fluids.

    Abstract translation: 微结构可用作微加工机电系统(MEMS)装置中的电连接。 微结构可以具有用于信号传输的一个或多个可分离的电连接。 微结构允许MEMS装置屏蔽信号传输免受电磁干扰或导电流体的影响。

    Method of fabricating a micro-electro-mechanical fluid ejector
    4.
    发明申请
    Method of fabricating a micro-electro-mechanical fluid ejector 失效
    微机电液体喷射器的制造方法

    公开(公告)号:US20010023523A1

    公开(公告)日:2001-09-27

    申请号:US09863637

    申请日:2001-05-23

    Abstract: A micro-electromechanical fluid ejector that is easily fabricated in a standard polysilicon surface micromachining process is disclosed, which can be batch fabricated at low cost using existing external foundry capabilities. In addition, the surface micromachining process has proven to be compatible with integrated microelectronics, allowing for the monolithic integration of the actuator with addressing electronics. A voltage drive mode and a charge drive mode for the power source actuating a deformable membrane is also disclosed.

    Abstract translation: 公开了容易在标准多晶硅表面微加工工艺中制造的微机电流体喷射器,其可以使用现有的外部铸造能力以低成本批量制造。 此外,表面微加工工艺已被证明与集成的微电子学兼容,允许致动器与寻址电子器件的单片集成。 还公开了用于致动可变形膜的电源的电压驱动模式和充电驱动模式。

    Monolithic reconfigurable optical multiplexer systems and methods
    5.
    发明申请
    Monolithic reconfigurable optical multiplexer systems and methods 失效
    单片可重构光复用器系统和方法

    公开(公告)号:US20040114856A1

    公开(公告)日:2004-06-17

    申请号:US10721849

    申请日:2003-11-25

    Abstract: A silicon demultiplexer, a plurality of silicon switches and a silicon multiplexer are monolithicaily integrated on a single silicon chip. In embodiments, the silicon demultiplexer and the silicon multiplexer each comprise a diffraction grating. In other embodiments, the silicon demultiplexer and the silicon multiplexer each comprise an arrayed waveguide grating. In various exemplary embodiments, the silicon optical switches comprise optical switches, micromachined torsion mirrors, electrostatic micromirrors, and/or tilting micromirrors. In use, an optical signal comprising a multiplexed data stream is input into the monolithic reconfigurable optical multiplexer. An optical signal that comprises a modified multiplexed data stream may be output. In an optical communications system, the silicon demultiplexer communicates with an input optical fiber, the plurality of silicon optical switches communicate between the silicon demultiplexer and the silicon multiplexer, and the silicon multiplexer communicates with an output optical fiber. In various embodiments, the optical switches are fabricated to be self-aligned.

    Abstract translation: 硅解复用器,多个硅开关和硅复用器整体地集成在单个硅芯片上。 在实施例中,硅解复用器和硅多路复用器各自包括衍射光栅。 在其他实施例中,硅解复用器和硅多路复用器均包括阵列波导光栅。 在各种示例性实施例中,硅光开关包括光开关,微机械扭转镜,静电微镜和/或倾斜微镜。 在使用中,包括复用数据流的光信号被输入到单片可重构光复用器。 可以输出包括修改的多路复用数据流的光信号。 在光通信系统中,硅解复用器与输入光纤通信,多个硅光开关在硅解复用器和硅多路复用器之间通信,并且硅复用器与输出光纤通信。 在各种实施例中,光开关被制造成自对准。

    Systems and methods for integration of heterogeneous circuit devices
    6.
    发明申请
    Systems and methods for integration of heterogeneous circuit devices 失效
    用于集成异构电路器件的系统和方法

    公开(公告)号:US20040084745A1

    公开(公告)日:2004-05-06

    申请号:US10727692

    申请日:2003-12-04

    Abstract: A heterogeneous device comprises a substrate and a plurality of heterogeneous circuit devices defined in the substrate. In embodiments, a plurality of heterogeneous circuit devices are integrated by successively masking and ion implanting the substrate. The heterogeneous device may further comprise at least one microelectromechanical system-based element and/or at least one photodiode. In embodiments, the heterogeneous circuit devices comprise at least one CMOS transistor and at least one DMOS transistor. In embodiments, the substrate comprises a layer of silicon or a layer of p-type silicon. In other embodiments, the substrate comprises a silicon-on-insulator wafer comprising a single-crystal-silicon layer or a single-crystal-P-silicon layer, a substrate and an insulator layer therebetween.

    Abstract translation: 异质器件包括衬底和限定在衬底中的多个异质电路器件。 在实施例中,通过依次掩蔽和离子注入衬底来整合多个异构电路器件。 异质装置还可以包括至少一个基于微机电系统的元件和/或至少一个光电二极管。 在实施例中,异质电路器件包括至少一个CMOS晶体管和至少一个DMOS晶体管。 在实施例中,衬底包括硅层或p型硅层。 在其它实施例中,衬底包括绝缘体上硅晶片,其包括单晶硅层或单晶P硅层,衬底和绝缘体层之间。

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