公开(公告)号：US10896838B2

公开(公告)日：2021-01-19

申请号：US16248328

申请日：2019-01-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minsung Kim ,  Myoung Soo Park ,  Dougyong Sung ,  Yun-Kwang Jeon

IPC: H01L21/683 ,  H01J37/32 ,  H01L21/67

Abstract: An electrostatic chuck includes a base, a dielectric plate on the base, a chuck electrode in the dielectric plate, and a lower heater section including lower heaters in the dielectric plate between the chuck electrode and the base, and a lower ground electrode between the lower heaters and the base. The chuck further includes an upper heater section including upper heaters between the lower heaters and the chuck electrode, and a upper ground electrode between the upper heaters and the lower heaters, and a plurality of via contact electrodes connecting the upper ground electrode into the lower ground electrode.

公开(公告)号：US10971333B2

公开(公告)日：2021-04-06

申请号：US15723837

申请日：2017-10-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong-Hyub Lee ,  Dougyong Sung ,  Je-Hun Woo ,  Bongseong Kim ,  Juho Lee ,  Yun-Kwang Jeon ,  Junghyun Cho

IPC: H01J37/32 ,  H01L21/67

Abstract: Embodiments of the inventive concepts provide antennas, plasma generating circuits, plasma processing apparatus, and methods for manufacturing semiconductor devices using the same. The circuits include radio-frequency power sources generating radio-frequency powers, antennas receiving the radio-frequency powers to generate plasma and having a first mutual inductance, and inductors connecting the antennas to the radio-frequency power sources, respectively. The inductors have a second mutual inductance reducing and/or canceling the first mutual inductance.

公开(公告)号：US10854485B2

公开(公告)日：2020-12-01

申请号：US16703270

申请日：2019-12-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minsung Kim ,  Myoung Soo Park ,  Dongyun Yeo ,  Dougyong Sung ,  Suho Lee ,  Yun-Kwang Jeon

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/3065 ,  H01L21/311 ,  H02N13/00 ,  H01J37/32 ,  H01L21/324 ,  H01L21/3213

Abstract: An electrostatic chuck, a substrate processing apparatus, and a method of manufacturing a semiconductor device are provided. The electrostatic chuck comprises a chuck base, an insulation plate on the chuck base, a first heater comprising a cell heater in the insulation plate, and a heater controller configured to control the cell heater. The heater controller obtains a resistance of the cell heater and compares the resistance with a threshold value to control a heating power provided to the cell heater.

公开(公告)号：US10224228B2

公开(公告)日：2019-03-05

申请号：US15420211

申请日：2017-01-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minsung Kim ,  Myoung Soo Park ,  Dougyong Sung ,  Yun-Kwang Jeon

IPC: H01L21/67 ,  H01J37/32 ,  C23C16/44 ,  H01L21/683

Abstract: A substrate processing apparatus includes an electrostatic chuck which is made up of a base, a dielectric plate on the base, a chuck electrode in the dielectric plate, and a first heater section in the dielectric plate between the chuck electrode and the base. The first heater section includes first heaters that are separated from each other in a first direction, and respective first upper plate electrodes disposed between the first heaters and the base. The first upper plate electrodes are separated from each other in the first direction and respectively connected to the first heaters.

公开(公告)号：US10103043B2

公开(公告)日：2018-10-16

申请号：US15260874

申请日：2016-09-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun Sun Choi ,  Yun-Kwang Jeon ,  Taekyun Kang

IPC: H01L21/67 ,  B01D46/00 ,  B01D46/42 ,  B01D46/44 ,  H01L21/677 ,  H01L21/673

Abstract: The inventive concepts provide apparatuses for transferring a substrate and/or apparatuses for processing a substrate including the same. The substrate transferring apparatus including a chamber, a filter assembly disposed in a chamber to provide external air into the chamber, and an additional assembly including a moisture removing part and a purge gas providing part sequentially stacked on the filter assembly may be provided. The filter assembly may be coupled to the additional assembly.

公开(公告)号：US10861724B2

公开(公告)日：2020-12-08

申请号：US15952317

申请日：2018-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongwoo Sun ,  Hakyoung Kim ,  Yun-Kwang Jeon ,  Wonyoung Jee

IPC: H01L21/67 ,  H01L21/687 ,  H01J37/32

Abstract: Disclosed are a substrate inspection apparatus and a substrate processing system. The substrate inspection apparatus includes a sensor module and a jig associated with the sensor module to transfer the sensor module. The sensor module may include a housing having a first surface and a second surface facing each other and including an insertion hole connecting the first and second surfaces to each other, a sensor inserted into the insertion hole to measure a state of the substrate, and a tilting member on the housing to adjust tilt of the housing.

公开(公告)号：US10566221B2

公开(公告)日：2020-02-18

申请号：US16142916

申请日：2018-09-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun Sun Choi ,  Yun-Kwang Jeon ,  Taekyun Kang

IPC: B01D50/00 ,  H01L21/67 ,  H01L21/673 ,  H01L21/677 ,  B01D46/00 ,  B01D46/42 ,  B01D46/44

Abstract: The inventive concepts provide apparatuses for transferring a substrate and/or apparatuses for processing a substrate including the same. The substrate transferring apparatus including a chamber, a filter assembly disposed in a chamber to provide external air into the chamber, and an additional assembly including a moisture removing part and a purge gas providing part sequentially stacked on the filter assembly may be provided. The filter assembly may be coupled to the additional assembly.

公开(公告)号：US10522374B2

公开(公告)日：2019-12-31

申请号：US15857047

申请日：2017-12-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minsung Kim ,  Myoung Soo Park ,  Dongyun Yeo ,  Dougyong Sung ,  Suho Lee ,  Yun-Kwang Jeon

IPC: H01L21/67 ,  H01L21/683 ,  H01J37/32 ,  H02N13/00 ,  H01L21/3065 ,  H01L21/324 ,  H01L21/311 ,  H01L21/3213

Abstract: An electrostatic chuck, a substrate processing apparatus, and a method of manufacturing a semiconductor device are provided. The electrostatic chuck comprises a chuck base, an insulation plate on the chuck base, a first heater comprising a cell heater in the insulation plate, and a heater controller configured to control the cell heater. The heater controller obtains a resistance of the cell heater and compares the resistance with a threshold value to control a heating power provided to the cell heater.

公开(公告)号：US20190067054A1

公开(公告)日：2019-02-28

申请号：US16142916

申请日：2018-09-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun Sun Choi ,  Yun-Kwang Jeon ,  Taekyun Kang

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/673 ,  B01D46/00 ,  B01D46/44 ,  B01D46/42

CPC classification number: H01L21/67196 ,  B01D46/0045 ,  B01D46/4263 ,  B01D46/448 ,  B01D2279/45 ,  H01L21/67017 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67201 ,  H01L21/67248 ,  H01L21/67389 ,  H01L21/67742 ,  H01L21/67778

Abstract: The inventive concepts provide apparatuses for transferring a substrate and/or apparatuses for processing a substrate including the same. The substrate transferring apparatus including a chamber, a filter assembly disposed in a chamber to provide external air into the chamber, and an additional assembly including a moisture removing part and a purge gas providing part sequentially stacked on the filter assembly may be provided. The filter assembly may be coupled to the additional assembly.

公开(公告)号：US20190013222A1

公开(公告)日：2019-01-10

申请号：US15857047

申请日：2017-12-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minsung Kim ,  Myoung Soo Park ,  Dongyun Yeo ,  Dougyong Sung ,  Suho Lee ,  Yun-Kwang Jeon

IPC: H01L21/67 ,  H02N13/00 ,  H01L21/683 ,  H01L21/324 ,  H01L21/3065 ,  H01J37/32

CPC classification number: H01L21/67248 ,  H01J37/321 ,  H01J37/32724 ,  H01J37/32733 ,  H01J2237/334 ,  H01L21/3065 ,  H01L21/31116 ,  H01L21/32137 ,  H01L21/324 ,  H01L21/67069 ,  H01L21/67103 ,  H01L21/6831 ,  H01L21/6833 ,  H02N13/00

Abstract: An electrostatic chuck, a substrate processing apparatus, and a method of manufacturing a semiconductor device are provided. The electrostatic chuck comprises a chuck base, an insulation plate on the chuck base, a first heater comprising a cell heater in the insulation plate, and a heater controller configured to control the cell heater. The heater controller obtains a resistance of the cell heater and compares the resistance with a threshold value to control a heating power provided to the cell heater.