公开(公告)号：US20220077152A1

公开(公告)日：2022-03-10

申请号：US17199740

申请日：2021-03-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongkyun Lim ,  Youngsin Kim ,  Kijin Park ,  Hoju Song ,  Dongkwan Yang ,  Sangho Yun ,  Gyuhyun Lee ,  Jieun Lee ,  Seunguk Han ,  Yoongi Hong

IPC: H01L27/108 ,  H01L29/49 ,  H01L29/78

Abstract: A semiconductor device includes a gate structure on a substrate, first and second spacer structures on first and second sidewalls, respectively, opposite to each other of the gate structure, and first and second source/drain layers at upper portions of the substrate adjacent to the first and second sidewalls, respectively, of the gate structure. An upper surface of the gate structure has a height with reference to an upper surface of the substrate being a base level decreasing from a central portion to the first sidewall and substantially constant from the central portion to the second sidewall.

公开(公告)号：US20240357800A1

公开(公告)日：2024-10-24

申请号：US18528854

申请日：2023-12-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： SANGHO LEE ,  Moonyoung Jeong ,  Sihyun Kim ,  Yoongi Hong

IPC: H10B12/00

CPC classification number: H10B12/482 ,  H10B12/485 ,  H10B12/488

Abstract: A semiconductor device includes a first bit line extending in a first direction, a first semiconductor pattern extending in a second direction and including first and second ends opposite to each other, the first end of the first semiconductor pattern being in contact with the first bit line, a first word line on the first semiconductor pattern and extending in a third direction, a selection line adjacent to the second end of the first semiconductor pattern and parallel to the third direction, a second semiconductor pattern interposed between the selection line and the first semiconductor pattern and having first end and second ends opposite to each other, a second bit line extending in the first direction and in contact with the first end of the second semiconductor pattern, and a source line extending in the first direction and in contact with the second end of the second semiconductor pattern.

公开(公告)号：US11690213B2

公开(公告)日：2023-06-27

申请号：US17199740

申请日：2021-03-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongkyun Lim ,  Youngsin Kim ,  Kijin Park ,  Hoju Song ,  Dongkwan Yang ,  Sangho Yun ,  Gyuhyun Lee ,  Jieun Lee ,  Seunguk Han ,  Yoongi Hong

IPC: H10B12/00 ,  H01L29/78 ,  H01L29/49 ,  H01L29/66

CPC classification number: H10B12/315 ,  H01L29/4941 ,  H01L29/66484 ,  H01L29/7831 ,  H01L29/7833

Abstract: A semiconductor device includes a gate structure on a substrate, first and second spacer structures on first and second sidewalls, respectively, opposite to each other of the gate structure, and first and second source/drain layers at upper portions of the substrate adjacent to the first and second sidewalls, respectively, of the gate structure. An upper surface of the gate structure has a height with reference to an upper surface of the substrate being a base level decreasing from a central portion to the first sidewall and substantially constant from the central portion to the second sidewall.