Abstract:
A resistive memory device includes memory cell array blocks, a reference cell array block, two first and second sink transistors, and a word line. Each of the memory cell array blocks includes a row line, and the reference cell array block includes a reference row line. One of the first sink transistors is disposed between one end of the row line and a ground and the other of the first sink transistors is disposed between an opposite end of the row line and the ground. One of the second sink transistors is disposed between one end of the reference row line and the ground and the other of the second sink transistors is disposed between an opposite end of the reference row line and the ground. The word line is coupled to gates of the first and second sink transistors.
Abstract:
A nonvolatile memory device is provided which includes a main area including main cells connected to word lines and main bit lines; a reference area including reference cells connected to the word lines and reference bit lines and programmed using the same write condition as that of the main area; a reference sense amplifier circuit configured to read data written at the reference area through the reference bit lines at a read operation; and control logic configured to control the reference sense amplifier circuit such that data written at the reference area is shifted with a weight scheme and then read, the data written at the reference area being used as a read reference value of the main area at a read operation.
Abstract:
An electronic device provided. The electronic device includes a first body part including a first connection member and a second body part including a second connection member. At least one of the first connection member and the second connection member includes and a portion having a first flat area and a second area. The second area having a generally curved configuration and extending from the first flat area for magnetically coupling the first body part and the second body part to each other.
Abstract:
A resistive memory device includes memory cell array blocks, a reference cell array block, two first and second sink transistors, and a word line. Each of the memory cell array blocks includes a row line, and the reference cell array block includes a reference row line. One of the first sink transistors is disposed between one end of the row line and a ground and the other of the first sink transistors is disposed between an opposite end of the row line and the ground. One of the second sink transistors is disposed between one end of the reference row line and the ground and the other of the second sink transistors is disposed between an opposite end of the reference row line and the ground. The word line is coupled to gates of the first and second sink transistors.