INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20240105791A1

    公开(公告)日:2024-03-28

    申请号:US18371869

    申请日:2023-09-22

    CPC classification number: H01L29/4236 H10B12/315 H10B12/482 H10B12/488

    Abstract: An integrated circuit device includes a substrate including a plurality of active regions; a plurality of device isolation layers provided in the substrate and defining the plurality of active regions; a plurality of bitlines spaced apart from each other in a first horizontal direction on the substrate and extending in a second horizontal direction crossing the first horizontal direction; a plurality of insulating fences spaced apart from each other in the second horizontal direction and provided between adjacent bitlines of the plurality of bitlines; a plurality of buried contacts connected to the plurality of active regions and provided between adjacent bitlines of the plurality of bitlines and between the plurality of insulating fences; and a plurality of vertical insulating layers vertically positioned between the plurality of insulating fences and the plurality of buried contacts.

    SEMICONDUCTOR MEMORY DEVICE AND A METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20230209805A1

    公开(公告)日:2023-06-29

    申请号:US18116883

    申请日:2023-03-03

    Abstract: A semiconductor memory device includes a device isolation pattern on a substrate to define an active region, a word line in the substrate, to intersect the active region, a first dopant region in the active region as at a first side of the word line, a second dopant region in the active region at a second side of the word line, a bit line connected to the first dopant region and intersecting the word line, a bit line contact connecting the bit line to the first dopant region, a landing pad on the second dopant region, and a storage node contact connecting the landing pad to the second dopant region, the storage node contact including a first portion in contact with the second dopant region, the first portion including a single-crystal silicon, and a second portion on the first portion and including a poly-silicon.

    SEMICONDUCTOR DEVICES
    4.
    发明申请

    公开(公告)号:US20220115377A1

    公开(公告)日:2022-04-14

    申请号:US17331725

    申请日:2021-05-27

    Abstract: A semiconductor device includes a substrate including an isolation layer pattern and an active pattern, a buffer insulation layer pattern on the substrate, a polysilicon structure on the active pattern and the buffer insulation layer pattern, the polysilicon structure contacting a portion of the active pattern, and the polysilicon structure extending in a direction parallel to an upper surface of the substrate, a first diffusion barrier layer pattern on an upper surface of the polysilicon structure, the first diffusion barrier layer pattern including polysilicon doped with at least carbon, a second diffusion barrier layer pattern on the first diffusion barrier layer pattern, the second diffusion barrier layer pattern including at least a metal, and a first metal pattern and a first capping layer pattern stacked on the second diffusion barrier layer pattern.

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