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    SEMICONDUCTOR HAVING A HIGH ASPECT RATIO VIA
    2.
    发明申请
    SEMICONDUCTOR HAVING A HIGH ASPECT RATIO VIA 有权
    具有高宽比的半导体

    公开(公告)号：US20120080761A1

    公开(公告)日：2012-04-05

    申请号：US12898408

    申请日：2010-10-05

    Applicant: Yuan-Chih Hsieh ,  Richard Chu ,  Ming-Tung Wu ,  Martin Liu ,  Lan-Lin Chao ,  Chia-Shiung Tsai

    Inventor： Yuan-Chih Hsieh ,  Richard Chu ,  Ming-Tung Wu ,  Martin Liu ,  Lan-Lin Chao ,  Chia-Shiung Tsai

    IPC: H01L29/84 ,  H01L21/768 ,  H01L21/50 ,  H01L23/48

    CPC classification number: H01L23/5384 ,  H01L21/76802 ,  H01L21/76831 ,  H01L21/7684 ,  H01L21/7685 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A semiconductor device includes a substrate wafer, a dielectric layer overlying the substrate wafer, a patterned conductor layer in the dielectric layer, and a first barrier layer overlying the conductor layer. A silicon top wafer is bonded to the dielectric layer. A via is formed through the top wafer and a portion of the dielectric layer to the first barrier layer. A sidewall dielectric layer is formed along inner walls of the via, adjacent the top wafer to a distance below an upper surface of the top wafer, forming a sidewall dielectric layer shoulder. A sidewall barrier layer is formed inward of the sidewall dielectric layer, lining the via from the first barrier layer to the upper surface of the top wafer. A conductive layer fills the via and a top barrier layer is formed on the conductive layer, the sidewall barrier layer, and the top wafer.

    Abstract translation: 半导体器件包括衬底晶片，覆盖衬底晶片的电介质层，电介质层中的图案化导体层和覆盖导体层的第一势垒层。 硅顶片结合到电介质层。 通孔通过顶部晶片和介电层的一部分形成到第一阻挡层。 侧壁电介质层沿通孔的内壁形成，与顶部晶片相邻，距离顶部晶片的上表面一定距离，形成侧壁电介质层的肩部。 在侧壁电介质层的内侧形成侧壁阻挡层，将通孔从第一阻挡层衬套到顶部晶片的上表面。 导电层填充通孔，并且在导电层，侧壁阻挡层和顶部晶片上形成顶部阻挡层。

    Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled
    4.
    发明申请
    Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled 有权
    冷却装置和方法采用分散的冷板，其顺应地耦合在待冷却的组件的公共歧管和电子部件之间

    公开(公告)号：US20070091570A1

    公开(公告)日：2007-04-26

    申请号：US11258316

    申请日：2005-10-25

    Applicant: Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

    Inventor： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

    IPC: H05K7/20

    CPC classification number: G06F1/20 ,  G06F2200/201 ,  H05K7/2079

    Abstract: Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface.

    Abstract translation: 提供冷却装置和方法用于冷却包括支撑多个电子部件的平面支撑结构的组件。 冷却装置包括：多个分立的冷板，每个分别具有冷却剂入口，冷却剂出口和设置在其间的至少一个冷却剂承载通道; 以及用于将冷却剂分配到冷板并从冷板排出冷却剂的歧管。 冷却装置还包括将冷板的冷却剂入口连接到歧管的多个柔性软管以及到歧管的冷却剂出口，每个软管段设置在相应的冷板和歧管之间。 偏置机构将冷板偏离歧管并朝向电子部件，并且至少一个紧固件将歧管固定到支撑结构，压缩偏置机构，从而迫使并联的冷板朝向它们各自的电子部件以确保 良好的热界面。

    Apparatus and method for facilitating cooling of an electronics rack employing a closed loop heat exchange system
    5.
    发明申请
    Apparatus and method for facilitating cooling of an electronics rack employing a closed loop heat exchange system 有权
    用于使用闭环热交换系统的电子机架的冷却的装置和方法

    公开(公告)号：US20060250770A1

    公开(公告)日：2006-11-09

    申请号：US11124525

    申请日：2005-05-06

    Applicant: Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

    Inventor： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

    IPC: H05K7/20

    CPC classification number: H05K7/20745

    Abstract: Apparatus and method are provided for facilitating cooling of an electronics rack employing a closed loop heat exchange system. The closed loop heat exchange system includes a first heat exchanger, a second heat exchanger, and a coolant distribution loop connecting the first heat exchanger and the second heat exchanger. When operational, the coolant distribution loop allows coolant to circulate between the first heat exchanger and the second heat exchanger. The closed loop heat exchange system couples to the electronics rack with the first heat exchanger disposed at an air inlet side of the electronics rack, and the first heat exchanger and the second heat exchanger disposed in different inlet-to-outlet air flow paths through the electronics rack to reduce an imbalance in air flow temperature of the different inlet-to-outlet air flow paths through the electronics rack.

    Abstract translation: 提供了设备和方法，以便于采用闭环热交换系统的电子机架的冷却。 闭环热交换系统包括第一热交换器，第二热交换器和连接第一热交换器和第二热交换器的冷却剂分配回路。 当操作时，冷却剂分配回路允许冷却剂在第一热交换器和第二热交换器之间循环。 闭环热交换系统与设置在电子机架的空气入口侧的第一热交换器耦合到电子机架，并且第一热交换器和第二热交换器设置在不同的入口到出口的气流通道中 电子机架，以减少通过电子机架的不同入口到出口气流路径的空气流温度不平衡。

    ISOLATION VALVE AND COOLANT CONNECT/DISCONNECT ASSEMBLIES AND METHODS OF FABRICATION FOR INTERFACING A LIQUID COOLED ELECTRONICS SUBSYSTEM AND AN ELECTRONICS HOUSING
    8.
    发明申请
    ISOLATION VALVE AND COOLANT CONNECT/DISCONNECT ASSEMBLIES AND METHODS OF FABRICATION FOR INTERFACING A LIQUID COOLED ELECTRONICS SUBSYSTEM AND AN ELECTRONICS HOUSING 失效
    隔离阀和冷却器连接/断开组装和接口液体冷却电子系统和电子设备的制造方法

    公开(公告)号：US20080060373A1

    公开(公告)日：2008-03-13

    申请号：US11940471

    申请日：2007-11-15

    Applicant: Levi Campbell ,  Richard Chu ,  Michael Ellsworth Jr. ,  Madhusudan Iyengar ,  Donald Porter ,  Roger Schmidt ,  Robert Simons

    Inventor： Levi Campbell ,  Richard Chu ,  Michael Ellsworth Jr. ,  Madhusudan Iyengar ,  Donald Porter ,  Roger Schmidt ,  Robert Simons

    IPC: F25D23/12 ,  F16K31/00

    CPC classification number: H05K7/20772

    Abstract: An isolation valve assembly, a coolant connect/disconnect assembly, a cooled multi-blade electronics center, and methods of fabrication thereof are provided employing an isolation valve and actuation mechanism. The isolation valve is disposed within at least one of a coolant supply or return line providing liquid coolant to the electronics subsystem. The actuation member is coupled to the isolation valve to automatically translate a linear motion, resulting from insertion of the electronics subsystem into the operational position within the electronics housing, into a rotational motion to open the isolation valve and allow coolant to pass. The actuation mechanism, which operates to automatically close the isolation valve when the liquid cooled electronics subsystem is withdrawn from the operational position, can be employed in combination with a compression valve coupling, with one fitting of the compression valve coupling being disposed serially in fluid communication with the isolation valve.

    Abstract translation: 使用隔离阀和致动机构来提供隔离阀组件，冷却剂连接/断开组件，冷却的多叶片电子设备中心及其制造方法。 隔离阀设置在向电子子系统提供液体冷却剂的冷却剂供应或返回管线中的至少一个中。 致动构件联接到隔离阀以自动地将由电子系统子系统插入电子设备外壳内的操作位置而产生的直线运动转换成旋转运动，以打开隔离阀并允许冷却剂通过。 当液体冷却的电子子系统从操作位置退出时，操作以自动关闭隔离阀的致动机构可以与压缩阀联接一起使用，压缩阀联接器的一个配件串联设置为流体连通 与隔离阀。

    Thermally conductive composite interface and methods of fabrication thereof for an electronic assembly
    9.
    发明申请
    Thermally conductive composite interface and methods of fabrication thereof for an electronic assembly 审中-公开
    导热复合材料界面及其制造方法

    公开(公告)号：US20050286234A1

    公开(公告)日：2005-12-29

    申请号：US10880398

    申请日：2004-06-29

    Applicant: Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

    Inventor： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

    IPC: H01L23/42 ,  H01L23/433 ,  H05K7/20

    CPC classification number: H01L23/42 ,  H01L23/433 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/01322

    Abstract: A thermally conductive composite interface and methods of fabrication are provided for coupling a cooling assembly and at least one electronic device. The interface includes a plurality of thermally conductive contacts for mechanically coupling the cooling assembly and electronic device, and an adhesive material at least partially surrounding the thermally conductive contacts. The thermally conductive contacts are made of a first material, which has a first thermal conductivity, and the adhesive material is a second material, which has a second thermal conductivity, with the first thermal conductivity being greater than the second thermal conductivity. The adhesive material rigidly bonds the cooling assembly and the at least one electronic device together, thereby relieving strain on the plurality of thermally conductive contacts resulting from a coefficient of thermal expansion mismatch between the cooling assembly and the at least one electronic device.

    Abstract translation: 提供导热复合界面和制造方法用于联接冷却组件和至少一个电子设备。 接口包括用于机械地联接冷却组件和电子设备的多个导热触头，以及至少部分地围绕导热触头的粘合材料。 导热触头由具有第一导热性的第一材料制成，并且粘合材料是具有第二导热性的第二材料，第一导热率大于第二导热率。 粘合剂材料将冷却组件和至少一个电子设备刚性地结合在一起，从而减轻由冷却组件和至少一个电子设备之间的热膨胀失配系数导致的多个导热触头的应变。

    Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins
    10.
    发明申请
    Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins 失效
    电子设备冷却组件和使用保持多个导热销的弹性支撑材料的方法

    公开(公告)号：US20050280993A1

    公开(公告)日：2005-12-22

    申请号：US10873432

    申请日：2004-06-22

    Applicant: Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Robert Simons ,  Roger Schmidt

    Inventor： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Robert Simons ,  Roger Schmidt

    IPC: H01L23/433 ,  H05K7/20

    CPC classification number: H01L23/4336 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

    Abstract: An electronic device cooling assembly and fabrication method are provided which include a manifold with an orifice for injecting a cooling liquid onto a surface to be cooled, and an elastic pin support material with an opening aligned to the orifice of the manifold. Multiple thermally conductive pins are mounted within the support material, extending therefrom, and are sized to physically contact the surface to be cooled. The support material has a thickness and compliance which facilitates thermal interfacing of the pins to the surface by allowing second ends thereof to move vertically and tilt. The second end of each pin has a planar surface which is normal to an axis of the pin, and the support material facilitates the planar surfaces of the second pin ends establishing planar contact with the surface to be cooled, notwithstanding that the surface may be other than planar.

    Abstract translation: 提供了一种电子设备冷却组件和制造方法，其包括具有用于将冷却液体喷射到待冷却表面上的孔口的歧管以及具有与歧管孔口对准的开口的弹性销支撑材料。 多个导热销安装在支撑材料内，从其延伸，并且其尺寸设计成物理接触要冷却的表面。 支撑材料具有厚度和顺从性，其通过允许其第二端垂直移动和倾斜来促进销与表面的热接合。 每个销的第二端具有垂直于销的轴线的平坦表面，并且支撑材料有助于第二销端的平面表面与待冷却的表面建立平面接触，尽管表面可以是其他 比平面。

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