公开(公告)号：US20080030953A1

公开(公告)日：2008-02-07

申请号：US11871334

申请日：2007-10-12

Applicant: Levi CAMPBELL ,  Richard CHU ,  Michael ELLSWORTH ,  Madhusudan IYENGAR ,  Roger SCHMIDT ,  Robert SIMONS

Inventor： Levi CAMPBELL ,  Richard CHU ,  Michael ELLSWORTH ,  Madhusudan IYENGAR ,  Roger SCHMIDT ,  Robert SIMONS

IPC: H05K7/20

CPC classification number: H01L23/4338 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coolant chamber disposed therebetween; and multiple coolant-carrying tubes, each tube extending from a respective cold plate and being in fluid communication with the coolant inlet or outlet of the cold plate. An enclosure is provided having a perimeter region which engages the substrate to form a cavity with the electronics components and cold plates being disposed within the cavity. The enclosure is configured with multiple bores, each bore being sized and located to receive a respective coolant-carrying tube of the tubes extending from the cold plates. Further, the enclosure is configured with a manifold in fluid communication with the tubes for distributing coolant in parallel to the cold plates.

Abstract translation: 提供冷却装置和方法用于冷却包括支撑多个电子部件的基板的组件。 冷却装置包括：多个分立的冷板，每个分别具有冷却剂入口，冷却剂出口和设置在其间的至少一个冷却剂室; 和多个冷却剂输送管，每个管从相应的冷板延伸并与冷板的冷却剂入口或出口流体连通。 提供了一个外壳，其周边区域与基板接合以形成空腔，电子部件和冷板设置在空腔内。 外壳被配置有多个孔，每个孔的尺寸和位置被定位成接收从冷板延伸的管的相应的冷却剂承载管。 此外，外壳配置有与管流体连通的歧管，用于与冷板平行地分配冷却剂。

公开(公告)号：US20070121299A1

公开(公告)日：2007-05-31

申请号：US11290756

申请日：2005-11-30

Applicant: Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

Inventor： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

IPC: H05K7/20

CPC classification number: H01L23/3677 ,  H01L23/473 ,  H01L23/4735 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/10253 ,  H01L2924/00

Abstract: A heat transfer apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The heat transfer apparatus includes a thermally conductive base having a main surface, and a plurality of thermally conductive fins extending from the main surface. The thermally conductive fins are disposed to facilitate transfer of heat from the thermally conductive base, which can be a portion of the electronic device or a separate structure coupled to the electronic device. At least some conductive fins are composite structures, each including a first material coated with a second material, wherein the first material has a first thermal conductivity and the second material a second thermal conductivity. In one implementation, the thermally conductive fins are wire-bonded pin-fins, each being a discrete, looped pin-fin separately wire-bonded to the main surface and spaced less than 300 micrometers apart in an array.

Abstract translation: 提供了一种传热装置和制造方法，用于便于从发热电子装置中除去热量。 传热装置包括具有主表面的导热基底和从主表面延伸的多个导热翅片。 导热翅片设置成有助于传导热量，该热传导基底可以是电子设备的一部分或耦合到电子设备的单独结构。 至少一些导电翅片是复合结构，每个包括涂覆有第二材料的第一材料，其中第一材料具有第一导热性，第二材料具有第二导热性。 在一个实施方案中，导热翅片是引线接合的销翅片，每个是分开的环形销翅片，其分开地引线键合到主表面上，并且间隔小于300微米。

公开(公告)号：US20060126308A1

公开(公告)日：2006-06-15

申请号：US11009935

申请日：2004-12-10

Applicant: Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons ,  Prabjit Singh

Inventor： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons ,  Prabjit Singh

IPC: H05K7/20

CPC classification number: H01L23/3677 ,  F28F3/022 ,  H01L23/433 ,  H01L23/473 ,  H01L2224/78301 ,  H01L2924/10253 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a thermally conductive base having a substantially planar main surface, and a plurality of thermally conductive pin fins wire-bonded to the main surface of the thermally conductive base and disposed to facilitate the transfer of heat from the thermally conductive base. The thermally conductive base can be a portion of the electronic device to be cooled or a separate structure coupled to the electronic device to be cooled. If a separate structure, the thermally conductive base has a coefficient of thermal expansion within a defined range of a coefficient of thermal expansion of the electronic device. In one implementation, the wire-bonded pin fins are discrete, looped pin fins separately wire-bonded to the main surface and spaced less than 300 micrometers apart in an array.

Abstract translation: 提供冷却装置和制造方法以便于从发热电子装置中除去热量。 冷却装置包括具有基本上平面的主表面的导热基体和与导热基体的主表面引线接合并设置成有助于从导热基底转移热量的多个导热销散热片。 导热基座可以是要冷却的电子设备的一部分或者耦合到要冷却的电子设备的单独的结构。 如果是单独的结构，导热基座的热膨胀系数在电子设备的热膨胀系数的规定范围内。 在一个实施方式中，引线接合销散热片是离散的环形销散热片，其分开地引线键合到主表面，并且间隔小于300微米。

公开(公告)号：US20060126293A1

公开(公告)日：2006-06-15

申请号：US11008732

申请日：2004-12-09

Applicant: Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

Inventor： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

IPC: H05K7/20

CPC classification number: H05K7/2079

Abstract: A coolant flow drive apparatus is provided for facilitating removal of heat from a cooling structure coupled to a heat generating electronics component. The coolant flow drive apparatus includes a turbine in fluid communication with a primary coolant flowing within a primary coolant flow loop, and a pump in fluid communication with a secondary coolant within a secondary coolant flow path. The secondary fluid flow path is separate from the primary coolant flow path. The flow drive apparatus further includes a magnetic coupling between the turbine and the pump, wherein the turbine drives the pump through the magnetic coupling to pump secondary coolant through the secondary coolant flow path.

Abstract translation: 提供冷却剂流动驱动装置，用于便于从耦合到发热电子部件的冷却结构移除热量。 冷却剂流动驱动装置包括与在主冷却剂流动回路内流动的主要冷却剂流体连通的涡轮机，以及与次级冷却剂流动路径内的二级冷却剂流体连通的泵。 次级流体流动路径与主冷却剂流动路径分离。 流动驱动装置还包括在涡轮机和泵之间的磁耦合，其中涡轮机通过磁耦合驱动泵以将二级冷却剂泵送通过次级冷却剂流动路径。

公开(公告)号：US20050248922A1

公开(公告)日：2005-11-10

申请号：US10841748

申请日：2004-05-07

Applicant: Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons

Inventor： Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons

IPC: H05K7/20

CPC classification number: H05K7/20727 ,  H05K7/20809

Abstract: A cooling apparatus for electronic drawers utilizing a passive fluid cooling loop in conjunction with an air cooled drawer cover. The air cooled cover provides an increased surface area from which to transfer heat to cooling air flowing through the drawer. The increased cooling surface uses available space within the drawer, which may be other than immediately adjacent to a high power device within the drawer. The passive fluid cooling loop provides heat transfer from the high power device to the air cooled cover assembly, allowing placement of the air cooled cover assembly other than immediately adjacent to the high power device. The cooling apparatus is easily disengaged from the electronics drawer, providing access to devices within the drawer.

Abstract translation: 一种用于电子抽屉的冷却装置，其利用被动流体冷却回路与空气冷却的抽屉盖结合。 空气冷却盖提供了增加的表面积，从而将热量传递到流过抽屉的冷却空气。 增加的冷却表面使用抽屉内的可用空间，其可以不是紧邻抽屉内的大功率设备。 被动流体冷却回路提供从高功率设备到空气冷却盖组件的热传递，允许空气冷却盖组件的布置而不是紧邻大功率设备。 冷却装置容易从电子抽屉中脱离，提供对抽屉内的装置的通路。

公开(公告)号：US20050217299A1

公开(公告)日：2005-10-06

申请号：US10812732

申请日：2004-03-30

Applicant: Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons

Inventor： Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons

IPC: F24F13/22 ,  F25D21/00 ,  F25D21/14 ,  F25D23/12 ,  F25J3/00 ,  H05K5/02 ,  H05K7/20

CPC classification number: H05K7/20609 ,  F24F13/222 ,  H05K5/0213 ,  H05K7/20736

Abstract: System and method are provided for removing condensate from an air-to-liquid heat exchanger of a combined air/liquid enclosed apparatus for cooling rack-mounted electronic equipment. The condensate removal system includes a condensate collector for collecting liquid condensate from the air-to-liquid heat exchanger, and a vaporizing chamber in fluid communication with the condensate collector for receiving collected liquid therefrom. An actively controlled vaporizer vaporizes collected liquid within the vaporizing chamber and a vapor exhaust is in communication with the vaporizing chamber for venting vapor from the vaporizing chamber outside the cabinet containing the combined air/liquid cooling apparatus and rack-mounted electronic equipment.

Abstract translation: 提供了系统和方法，用于从用于冷却机架安装的电子设备的组合的空气/液体封闭装置的空气 - 液体热交换器中去除冷凝物。 冷凝水去除系统包括用于从空气 - 液体热交换器收集液体冷凝物的冷凝收集器，以及与冷凝水收集器流体连通的蒸发室，用于从其收集收集的液体。 主动控制的蒸发器蒸发蒸发室内的收集液体，并且蒸汽排气与蒸发室连通，用于从包含组合的空气/液体冷却装置和机架安装的电子设备的机柜外部的蒸发室排出蒸气。

公开(公告)号：US20050128705A1

公开(公告)日：2005-06-16

申请号：US10736949

申请日：2003-12-16

Applicant: Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons

Inventor： Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons

IPC: H01L23/473 ,  H05K7/20

CPC classification number: H01L23/473 ,  H01L2224/16 ,  H01L2224/73253

Abstract: A cooling fluid distribution assembly for a plurality of electronic modules, using a composite cold plate structure. One cold plate is associated with each electronic module requiring liquid cooling. Each cold plate includes a high thermal conductivity base sealably fastened to a cover, the cover having at least one fluid inlet and at least one fluid outlet. Cover fluid inlets and outlets are connected via a plurality of flexible, nonmetallic conduits, the conduits being bonded to the cover inlets and outlets. Each cold plate cover is formed of a material that is capable of being bonded to the flexible, nonmetallic conduits, covers are therefore formed of a different material than the material comprising the cold plate base. Cold plate structures preferably include internal fluid distribution structures. The resulting cooling fluid distribution assembly provides reliable fluid connections and is sufficiently flexible to adjust for variances in module height etc.

Abstract translation: 一种用于多个电子模块的冷却流体分配组件，其使用复合冷板结构。 一个冷板与需要液体冷却的每个电子模块相关联。 每个冷板包括可密封地紧固到盖的高导热性基座，所述盖具有至少一个流体入口和至少一个流体出口。 覆盖流体入口和出口通过多个柔性非金属导管连接，导管结合到盖入口和出口。 每个冷板盖由能够结合到柔性非金属导管的材料形成，因此盖子由与冷板底座的材料不同的材料形成。 冷板结构优选地包括内部流体分配结构。 所得到的冷却流体分配组件提供可靠的流体连接，并且具有足够的灵活性以适应模块高度等的变化。

公开(公告)号：US20050126276A1

公开(公告)日：2005-06-16

申请号：US10736947

申请日：2003-12-16

Applicant: Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons ,  Randy Zoodsma

Inventor： Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons ,  Randy Zoodsma

IPC: G01F1/00 ,  G01F23/18 ,  G01F23/74 ,  G06F1/20 ,  G01F17/00

CPC classification number: H05K7/2079 ,  G01F1/007 ,  G01F23/18 ,  G01F23/74 ,  G06F1/20 ,  G06F1/206 ,  G06F2200/201

Abstract: Method, system and program product are provided for monitoring coolant within a cooling system designed to provide system coolant to one or more electronics subsystems. The monitoring technique includes employing at least one pressure transducer to obtain multiple pressure measurements related to an amount of coolant within an expansion tank of the cooling system, and determining a rate of volume change of coolant within the expansion tank employing the multiple pressure measurements. Successive pressure measurements can be taken at a known time interval to determine the rate of volume change of coolant within the expansion tank. An automatic determination can also be made on the immediacy of action to be taken for service of the cooling system based on the rate of volume change of coolant within the expansion tank.

Abstract translation: 提供了方法，系统和程序产品，用于在冷却系统内监测冷却系统，该冷却系统被设计成向一个或多个电子子系统提供系统冷却剂。 监测技术包括采用至少一个压力传感器以获得与冷却系统的膨胀箱内的冷却剂量相关的多个压力测量，以及使用多个压力测量来确定膨胀罐内的冷却剂的体积变化率。 可以在已知的时间间隔进行连续压力测量，以确定膨胀罐内冷却剂的体积变化率。 还可以基于膨胀箱内的冷却剂的体积变化率，对冷却系统的服务的即时性进行自动确定。

公开(公告)号：US20050122685A1

公开(公告)日：2005-06-09

申请号：US10726347

申请日：2003-12-03

Applicant: Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons ,  Randy Zoodsma

Inventor： Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons ,  Randy Zoodsma

IPC: G06F1/20 ,  H01L23/473 ,  H05K7/20

CPC classification number: H05K7/2079

Abstract: A cooling system is provided employing multiple coolant conditioning units (CCUs). Each CCU, which is coupled to a different, associated electronics rack of multiple electronics racks to be cooled, includes a heat exchanger, a first cooling loop with a control valve, and a second cooling loop. The first cooling loop receives chilled facility coolant from a source and passes at least a portion thereof via the control valve through the heat exchanger. The second cooling loop provides cooled system coolant to the associated electronics rack, and expels heat in the heat exchanger from the electronics rack to the chilled facility coolant in the first cooling loop. The control valve allows regulation of the facility coolant flow through the heat exchanger, thereby allowing independent control of temperature of the system coolant in the second cooling loop. Various CCU and associated component redundancies of the cooling system are also provided.

Abstract translation: 提供采用多个冷却剂调节单元（CCU）的冷却系统。 耦合到要冷却的多个电子机架的不同相关电子机架的每个CCU包括热交换器，具有控制阀的第一冷却回路和第二冷却回路。 第一冷却回路从源接收冷却设备冷却剂，并且经由控制阀将其至少一部分通过热交换器。 第二冷却回路将冷却的系统冷却剂提供给相关联的电子机架，并将热交换器中的热量从电子机架排出到第一冷却回路中的冷却设备冷却剂。 控制阀允许调节通过热交换器的设备冷却剂流，从而允许独立地控制第二冷却回路中的系统冷却剂的温度。 还提供了冷却系统的各种CCU和相关部件冗余。

公开(公告)号：US4510685A

公开(公告)日：1985-04-16

申请号：US563328

申请日：1983-12-19

Applicant: Richard Chu

Inventor： Richard Chu

IPC: H05K3/30 ,  H05K13/04

CPC classification number: H05K13/04 ,  H05K3/306 ,  H05K2201/10303 ,  H05K2203/0173 ,  H05K2203/0186 ,  H05K2203/104 ,  Y10T29/49139 ,  Y10T29/49826 ,  Y10T29/53196

Abstract: Magnetic pins preswaged at an off-center point along their length are assembled into a printed circuit board by energizing a pair of electromagnets, disposed one above and the other beneath the circuit board, to cause the pins scattered over a template to become erect. This results in some of the pins being disposed with their shanks protruding through the holes in a magnetic plate disposed below the circuit board while others of the pins pass through the circuit board but do not protrude below the magnetic plate. Increasing the energization of the upper magnet causes the non-protruding pins to be ejected from the circuit board. Subsequent deenergization of the upper magnet results in further pins becoming disposed with their shanks protruding through the magnetic plate. The energization cycle of the magnets is repeated until the circuit board contains a pattern of pins defined by the template with all the pins oriented so that they protrude through the magnetic plate.

Abstract translation: 通过在电路板下方一个上下配置的一对电磁体来激励在其长度偏离中心点处预处理的磁性销被组装成印刷电路板，以使分散在模板上的销变得直立。 这导致一些引脚被布置成它们的柄突出穿过设置在电路板下方的磁板中的孔，而其他引脚穿过电路板，但不突出在磁性板下方。 增加上磁体的通电使得非突出的销从电路板喷出。 上磁体的随后的断电导致进一步的销变得布置成使得它们的杆突出穿过磁板。 重复磁体的通电周期，直到电路板包含由模板限定的销的图案，其中所有引脚定向成使得它们突出穿过磁性板。