公开(公告)号：US20080002363A1

公开(公告)日：2008-01-03

申请号：US11427380

申请日：2006-06-29

Applicant: Levi Campbell ,  Rehan Choudhary ,  Michael Ellsworth ,  Kenneth Marston ,  Hilton Toy

Inventor： Levi Campbell ,  Rehan Choudhary ,  Michael Ellsworth ,  Kenneth Marston ,  Hilton Toy

IPC: H05K7/20

CPC classification number: H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A direct liquid jet impingement module and associated method of providing such used in cooling of electronic components housed in an electronic package is provided. The module comprises a frame having an orifice to be placed over to-be-cooled components. A manifold is then disposed over the frame, such that the manifold opening is aligned with the frame orifice to ultimately enable fluid impingement on the to-be-cooled components. The manifold is formed to receive an inlet for the flow of coolants and an outlet fitting for removal of dissipated heat. A jet orifice plate is also provided inside the manifold opening, aligned with the frame orifice for directing fluid coolant flow over to-be-cooled components.

Abstract translation: 提供了一种直接液体喷射冲击模块和提供这种用于冷却容纳在电子封装中的电子部件的相关方法。 模块包括具有孔的框架，该孔被放置在待冷却的部件上。 然后将歧管设置在框架上方，使得歧管开口与框架孔对准，以最终使流体冲击待冷却的部件。 歧管形成为接收用于冷却剂流动的入口和用于消除散热的出口接头。 歧管开口内还设有喷射孔板，与框架孔对准，用于将流体冷却剂流体流过待冷却的部件。

公开(公告)号：US20070242432A1

公开(公告)日：2007-10-18

申请号：US11767683

申请日：2007-06-25

Applicant: Levi CAMPBELL ,  Richard CHU ,  Michael ELLSWORTH ,  Madhusudan IYENGAR ,  Roger SCHMIDT ,  Robert SIMONS

Inventor： Levi CAMPBELL ,  Richard CHU ,  Michael ELLSWORTH ,  Madhusudan IYENGAR ,  Roger SCHMIDT ,  Robert SIMONS

IPC: H05K7/20

CPC classification number: H05K7/20745 ,  F24F13/04 ,  H05K7/20736

Abstract: Apparatus and method are provided for facilitating cooling of an electronics rack employing an air delivery structure coupled to the electronics rack. The air delivery structure delivers air flow at a location external to the electronics rack and in a direction to facilitate mixing thereof with re-circulating exhausted inlet-to-outlet air flow from the air outlet side of the electronics rack to the air inlet side thereof. The delivered air flow is cooler than the re-circulating exhausted inlet-to-outlet air flow and when mixed with the re-circulating air flow facilitates lowering air inlet temperature at a portion of the air inlet side of the electronics rack, thereby enhancing cooling of the electronics rack.

Abstract translation: 提供了一种装置和方法，用于促进使用联接到电子机架的空气输送结构的电子机架的冷却。 空气输送结构在电子机架外部的位置处和在促进其混合的方向上传送空气流，并且从电子机架的空气出口侧到其进气侧再循环排出的入口到出口空气流 。 输送的空气流比再循环排出的入口到出口空气流更冷，并且当与再循环空气流混合时，有助于降低电子机架的空气入口侧的一部分处的进气温度，从而增强冷却 的电子机架。

公开(公告)号：US20070091569A1

公开(公告)日：2007-04-26

申请号：US11258314

申请日：2005-10-25

Applicant: Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

Inventor： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

IPC: H05K7/20

CPC classification number: H01L23/4338 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coolant chamber disposed therebetween; and multiple coolant-carrying tubes, each tube extending from a respective cold plate and being in fluid communication with the coolant inlet or outlet of the cold plate. An enclosure is provided having a perimeter region which engages the substrate to form a cavity with the electronics components and cold plates being disposed within the cavity. The enclosure is configured with multiple bores, each bore being sized and located to receive a respective coolant-carrying tube of the tubes extending from the cold plates. Further, the enclosure is configured with a manifold in fluid communication with the tubes for distributing coolant in parallel to the cold plates.

Abstract translation: 提供冷却装置和方法用于冷却包括支撑多个电子部件的基板的组件。 冷却装置包括：多个分立的冷板，每个分别具有冷却剂入口，冷却剂出口和设置在其间的至少一个冷却剂室; 和多个冷却剂输送管，每个管从相应的冷板延伸并与冷板的冷却剂入口或出口流体连通。 提供了一个外壳，其周边区域与基板接合以形成空腔，电子部件和冷板设置在空腔内。 外壳被配置有多个孔，每个孔的尺寸和位置被定位成接收从冷板延伸的管的相应的冷却剂承载管。 此外，外壳配置有与管流体连通的歧管，用于与冷板平行地分配冷却剂。

公开(公告)号：US20070019380A1

公开(公告)日：2007-01-25

申请号：US11184524

申请日：2005-07-19

Applicant: Levi Campbell ,  Richard Chu ,  Michael Ellsworth, ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

Inventor： Levi Campbell ,  Richard Chu ,  Michael Ellsworth, ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

IPC: H05K7/20

CPC classification number: H05K7/20745 ,  F24F13/04 ,  H05K7/20736

Abstract: Apparatus and method are provided for facilitating cooling of an electronics rack employing an air delivery structure coupled to the electronics rack. The air delivery structure delivers air flow at a location external to the electronics rack and in a direction to facilitate mixing thereof with re-circulating exhausted inlet-to-outlet air flow from the air outlet side of the electronics rack to the air inlet side thereof. The delivered air flow is cooler than the re-circulating exhausted inlet-to-outlet air flow and when mixed with the re-circulating air flow facilitates lowering air inlet temperature at a portion of the air inlet side of the electronics rack, thereby enhancing cooling of the electronics rack.

公开(公告)号：US20060250773A1

公开(公告)日：2006-11-09

申请号：US11124064

申请日：2005-05-06

Applicant: Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

Inventor： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

IPC: H05K7/20

CPC classification number: H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a plurality of thermally conductive fins coupled to and projecting away from a surface to be cooled. The fins facilitate transfer of heat from the surface to be cooled. The apparatus further includes an integrated manifold having a plurality of inlet orifices for injecting coolant onto the surface to be cooled, and a plurality of outlet openings for exhausting coolant after impinging on the surface to be cooled. The inlet orifices and the outlet openings are interspersed in a common surface of the integrated manifold. Further, the integrated manifold and the surface to be cooled are disposed with the common surface of the manifold and the surface to be cooled in spaced, opposing relation, and with the plurality of thermally conductive fins disposed therebetween.

Abstract translation: 提供冷却装置和制造方法以便于从发热电子装置中除去热量。 冷却装置包括耦合到待冷却表面并远离待冷却表面的多个导热翅片。 散热片有助于从要冷却的表面传递热量。 该装置还包括具有多个用于将冷却剂喷射到待冷却表面上的入口孔的集成歧管，以及用于在撞击待冷却表面之后排出冷却剂的多个出口开口。 入口孔和出口开口散布在集成歧管的共同表面中。 此外，集成歧管和要冷却的表面与歧管的共同表面和待冷却的表面以间隔相对的关系设置，并且多个导热翅片设置在它们之间。

公开(公告)号：US20050281000A1

公开(公告)日：2005-12-22

申请号：US10872879

申请日：2004-06-21

Applicant: Richard Chu ,  Michael Ellsworth ,  Egidio Marotta ,  Prabjit Singh

Inventor： Richard Chu ,  Michael Ellsworth ,  Egidio Marotta ,  Prabjit Singh

IPC: F28F3/02 ,  H01L23/367 ,  H05K7/20

CPC classification number: F28F3/02 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thermal dissipation structure and method are provided which include a heat sink having a surface configured to couple to a surface of an electronic component for facilitating removal of heat from the component. The heat sink surface and the electronic component surface comprise dissimilar materials with different coefficients of thermal expansion. The heat sink surface has a pattern of channels therein which define multiple heat sink substructures. Each heat sink substructure includes a portion of the heat sink surface. The portions of the heat sink surface are coplanar and provide a reduced distance to neutral point across the heat sink surface. When the portions of the heat sink surface are bonded to the electronic component surface, shear stress within the bond is reduced.

Abstract translation: 提供了一种散热结构和方法，其包括具有被配置为耦合到电子部件的表面的表面的散热器，以便于从部件移除热量。 散热器表面和电子部件表面包括具有不同热膨胀系数的不同材料。 散热器表面具有限定多个散热器子结构的通道图案。 每个散热器子结构包括散热器表面的一部分。 散热器表面的部分是共面的，并且通过散热器表面提供与中性点的距离减小。 当散热器表面的部分结合到电子部件表面时，键内的剪切应力降低。

公开(公告)号：US20050237716A1

公开(公告)日：2005-10-27

申请号：US10828767

申请日：2004-04-21

Applicant: Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons

Inventor： Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons

IPC: H05K7/20

CPC classification number: H05K7/20736 ,  H05K7/20745

Abstract: An air flow system and method are provided which include a duct configured to mount either as an inlet or outlet duct to an electronics rack. When mounted to cover an air-intake side of the electronics rack, a supply air flow plenum is defined for directing conditioned air to the air-intake side. The duct includes a first air inlet at a first end for receiving the conditioned air, and is tapered from the first end to a second end thereof, with the supply plenum having a varying air flow cross-section. The duct further includes a second air inlet for providing supplemental room air to the plenum. The second inlet is disposed adjacent to the first inlet, thereby facilitating mixing of conditioned air with room air within the supply air flow plenum prior to delivery thereof to the air-intake side of the electronics rack.

Abstract translation: 提供了一种气流系统和方法，其包括被配置为作为入口或出口管道安装到电子机架的管道。 当安装以覆盖电子机架的进气侧时，限定用于将经调节的空气引导到进气侧的供应气流增压室。 管道包括在第一端处用于接收经调节的空气的第一空气入口，并且从第一端至第二端逐渐变细，供气室具有变化的空气流横截面。 导管还包括用于向集气室提供补充室内空气的第二空气入口。 第二入口与第一入口相邻地设置，从而便于将调节后的空气与供给空气流通气室内的室内空气混合，然后将其输送到电子机架的进气侧。

公开(公告)号：US20050205240A1

公开(公告)日：2005-09-22

申请号：US11130755

申请日：2005-05-17

Applicant: Michael Ellsworth ,  Egidio Marotta ,  Prabjit Singh

Inventor： Michael Ellsworth ,  Egidio Marotta ,  Prabjit Singh

IPC: H05K7/20 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  F28F7/00

CPC classification number: H01L23/3737 ,  H01L23/367 ,  H01L23/3672 ,  H01L2924/0002 ,  Y10S165/905 ,  Y10T29/4935 ,  Y10T29/49366 ,  H01L2924/00

Abstract: A finned heat sink including a plurality of heat sink fins, wherein each of the plurality of heat sink fins includes a fin cover and a fin core, wherein the fin core is constructed of a conductive structural graphite-epoxy material and wherein the fin cover is constructed of a foil material and is disposed relative to the fin core so as to envelope the fin core and a heat sink base, wherein the heat sink base is disposed so as to be in thermal communication with the plurality of heat sink fins.

公开(公告)号：US20050078453A1

公开(公告)日：2005-04-14

申请号：US10953991

申请日：2004-09-29

Applicant: Richard Chu ,  Michael Ellsworth ,  Robert Simons

Inventor： Richard Chu ,  Michael Ellsworth ,  Robert Simons

IPC: H01L23/373 ,  H01L23/433 ,  B32B9/00

CPC classification number: H01L23/373 ,  H01L23/433 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/15312 ,  Y10T29/4935 ,  Y10T29/49368 ,  Y10T428/30 ,  Y10T442/2738

Abstract: A thermal spreading device disposable between electronic circuitry and a heat sink includes a substrate having parallel first and second faces and conduits extending through the substrate between the faces. The substrate material has a first thermal conductivity value in a direction parallel to the faces and a second thermal conductivity value in a direction normal to the faces, with the second thermal conductivity value being less than the first thermal conductivity value. The conduit material has a thermal conductivity value associated with it, with the thermal conductivity value being greater than the second thermal conductivity value of the substrate. One method of fabricating the thermal spreading device includes disposing a molding material radially about the rods and hardening the material. Other methods include press fitting and shrink fitting the rods into a substrate material.

Abstract translation: 在电子电路和散热器之间一次使用的散热装置包括具有平行的第一和第二表面的基板以及在表面之间延伸通过基板的导管。 衬底材料在平行于面的方向上具有第一热导率值，并且在垂直于面的方向上具有第二热导率值，第二热导率值小于第一热导率值。 导管材料具有与其相关联的热导率值，其热导率值大于衬底的第二热导率值。 一种制造热扩散装置的方法包括：围绕棒径向地设置模制材料并硬化材料。 其他方法包括压配合并将棒收缩配合到基底材料中。

公开(公告)号：US20050068728A1

公开(公告)日：2005-03-31

申请号：US10675628

申请日：2003-09-30

Applicant: Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons

Inventor： Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons

IPC: G06F1/20 ,  H05K7/20

CPC classification number: H05K7/20772 ,  G06F1/20 ,  G06F2200/201

Abstract: A thermal dissipation assembly and method, and a cooled multi-drawer electronics rack are provided having a first cooling loop and a second cooling loop. The first cooling loop is disposed substantially within an electronics drawer and positioned to extract heat from an electronics module within the drawer. The first cooling loop further includes a first planar heat transfer surface. The second cooling loop is disposed substantially external to the electronics drawer and includes a second planar heat transfer surface. A biasing mechanism mechanically forces the first planar heat transfer surface and the second heat transfer surface coplanar when the electronics drawer is in a docked position in the electronics rack to facilitate the transfer of heat from the first cooling loop to the second cooling loop.

Abstract translation: 提供散热组件和方法以及冷却的多抽屉电子机架，其具有第一冷却回路和第二冷却回路。 第一冷却回路基本上设置在电子抽屉内并且定位成从抽屉内的电子模块提取热量。 第一冷却回路还包括第一平面传热表面。 第二冷却回路基本上设置在电子抽屉的外部，并且包括第二平面传热表面。 当电子抽屉处于电子机架中的对接位置时，偏置机构将第一平面传热表面和第二传热表面机械地迫使第二传热表面共面，以便于将热量从第一冷却回路传递到第二冷却回路。