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    SYSTEMS FOR REDUCING MAGNETIC COUPLING IN INTEGRATED CIRCUITS (ICS), AND RELATED COMPONENTS AND METHODS
    3.
    发明申请
    SYSTEMS FOR REDUCING MAGNETIC COUPLING IN INTEGRATED CIRCUITS (ICS), AND RELATED COMPONENTS AND METHODS 有权
    用于减少集成电路（ICS）中的磁耦合的系统及相关组件和方法

    公开(公告)号：US20140354372A1

    公开(公告)日：2014-12-04

    申请号：US14019821

    申请日：2013-09-06

    Applicant: QUALCOMM Incorporated

    Inventor： Chengjie Zuo ,  Jonghae Kim ,  Daeik D. Kim ,  Mario Francisco Velez ,  Changhan Yun ,  Je-Hsiung Lan ,  Robert P. Mikulka ,  Matthew M. Nowak

    IPC: H03H7/46 ,  H03H3/00

    CPC classification number: H03H7/463 ,  H03H3/00 ,  Y10T29/4902

    Abstract: Systems for reducing magnetic coupling in integrated circuits (ICs) are disclosed. Related components and methods are also disclosed. The ICs have a plurality of inductors. Each inductor generates a magnetic flux that has a discernible axis. To reduce magnetic coupling between the inductors, the flux axes are designed so as to be non-parallel. In particular, by making the flux axes of the inductors non-parallel to one another, magnetic coupling between the inductors is reduced relative to the situation where the flux axes are parallel. This arrangement may be particularly well suited for use in diplexers having a low pass and a high pass filter.

    Abstract translation: 公开了用于减小集成电路（IC）中的磁耦合的系统。 还公开了相关的部件和方法。 IC具有多个电感器。 每个电感器产生具有可辨别轴线的磁通量。 为了减小电感器之间的磁耦合，磁通轴被设计成不平行。 特别地，通过使电感器的磁通轴彼此不平行，相对于磁通轴平行的情况，电感器之间的磁耦合减小。 这种布置可以特别适用于具有低通和高通滤波器的双工器。

    THROUGH SILICON OPTICAL INTERCONNECTS
    5.
    发明申请
    THROUGH SILICON OPTICAL INTERCONNECTS 有权
    通过硅光学互连

    公开(公告)号：US20140131549A1

    公开(公告)日：2014-05-15

    申请号：US13771638

    申请日：2013-02-20

    Applicant: QUALCOMM INCORPORATED

    Inventor： Kenneth Kaskoun ,  Shiqun Gu ,  Matthew M. Nowak

    IPC: H01L25/16 ,  H01L25/00

    CPC classification number: H01L25/167 ,  H01L24/73 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H04B10/803 ,  H01L2924/00012

    Abstract: Some implementations provide a semiconductor device that includes a first die and an optical receiver. The first die includes a back side layer having a thickness that is sufficiently thin to allow an optical signal to traverse through the back side layer. The optical receiver is configured to receive several optical signals through the back side layer of the first die. In some implementations, each optical signal originates from a corresponding optical emitter coupled to a second die. In some implementations, the back side layer is a die substrate. In some implementations, the optical signal traverses a substrate portion of the back side layer. The first die further includes an active layer. The optical receiver is part of the active layer. In some implementations, the semiconductor device includes a second die that includes an optical emitter. The second die coupled to the back side of the first die.

    Abstract translation: 一些实施方案提供包括第一管芯和光学接收器的半导体器件。 第一模具包括具有足够薄的厚度以允许光信号穿过背侧层的背面层。 光接收器被配置为通过第一管芯的背侧层接收多个光信号。 在一些实现中，每个光信号源自耦合到第二管芯的对应的光发射器。 在一些实施方式中，背面层是模具基板。 在一些实现中，光信号穿过背侧层的衬底部分。 第一裸片还包括有源层。 光接收器是有源层的一部分。 在一些实施方案中，半导体器件包括包括光发射器的第二裸片。 第二模具耦合到第一模具的背面。

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