知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

18 records (took 0.016 seconds)

    Method, devices and systems for sensor with removable nodes
    1.
    发明授权
    Method, devices and systems for sensor with removable nodes 有权

    公开(公告)号：US09615794B2

    公开(公告)日：2017-04-11

    申请号：US14094860

    申请日：2013-12-03

    Applicant: QUALCOMM Incorporated

    Inventor： Kenneth Kaskoun ,  Brian David Niznik ,  Michael David Atella

    IPC: A61B5/00 ,  A61B5/11

    CPC classification number: A61B5/6833 ,  A61B5/0002 ,  A61B5/11 ,  A61B5/1112 ,  A61B5/684 ,  A61B5/7405 ,  A61B5/742 ,  A61B2560/0443

    Abstract: An integrated adhesive sensor array includes an adhesive a patch, a sensor hub, and a detachable sensor pod packaged as a unit. The patch may include a docking area for the detachable sensor pod. The detachable sensor pod may include at least one sensor and may be configured to be detached from the patch and applied to various locations on a body. The detachable sensor pod may send sensor data to the sensor hub via a wired link when on the patch and via a wireless link when detached from the patch. The sensor hub receives sensor data from the detachable sensor pod and relays the data to a receiver. The sensor hub and detachable sensor pod may include indicators for communicating information. The sensor hub may include a power source for powering the sensor hub and a detachable sensor pod attached to the main sensor unit or patch.

    Methods, devices and systems for self charging sensors
    3.
    发明授权
    Methods, devices and systems for self charging sensors 有权
    自动充电传感器的方法，装置和系统

    公开(公告)号：US09385560B2

    公开(公告)日：2016-07-05

    申请号：US14077665

    申请日：2013-11-12

    Applicant: QUALCOMM Incorporated

    Inventor： Kirk Steven Taylor ,  Kenneth Kaskoun

    IPC: H02J7/32 ,  H02J7/00 ,  H02J7/02 ,  H02J17/00 ,  G01D11/00

    CPC classification number: H02J50/00 ,  G01D11/00 ,  H02J17/00 ,  H02J50/80

    Abstract: Methods, systems and devices for an energy harvesting sensor are disclosed. A sensor device may include an energy harvesting element configured to harvest energy from a source of energy that is to be measured by the sensor device, and an energy storage element configured to store energy generated by the energy harvesting element. The sensor device may further include a transmitter circuit coupled to the energy storage element and configured to transmit a wireless signal when the energy stored in the energy storage element is sufficient to power a transmission of the wireless signal. The time between transmissions by the transmitter may be used by a receiver of those transmissions to calculate a measure of the quantity being used for energy harvesting.

    Abstract translation: 公开了用于能量收集传感器的方法，系统和装置。 传感器装置可以包括能量收集元件，其被配置为从将由传感器装置测量的能量源收集能量，以及能量存储元件，其被配置为存储由能量收集元件产生的能量。 传感器设备还可以包括耦合到能量存储元件并被配置为当存储在能量存储元件中的能量足以为无线信号的传输供电时发送无线信号的发射机电路。 发射机的传输之间的时间可以由这些传输的接收机使用以计算用于能量采集的量的量度。

    WEARABLE DUAL-EAR MOBILE OTOSCOPE
    5.
    发明申请
    WEARABLE DUAL-EAR MOBILE OTOSCOPE 审中-公开
    耐用的双耳手机

    公开(公告)号：US20170020382A1

    公开(公告)日：2017-01-26

    申请号：US14807700

    申请日：2015-07-23

    Applicant: QUALCOMM Incorporated

    Inventor： Muhammed Ibrahim Sezan ,  Eugene Dantsker ,  Kenneth Kaskoun ,  Brian David Niznik ,  Christopher Talbot ,  Ilene Klein

    IPC: A61B1/227 ,  A61B1/07 ,  A61B1/05 ,  A61B1/00

    CPC classification number: A61B1/227 ,  A61B1/00009 ,  A61B1/00016 ,  A61B1/05 ,  A61B1/07 ,  A61B5/0002 ,  A61B5/01 ,  A61B5/6803 ,  A61B5/6817 ,  A61B5/746 ,  A61B5/7465

    Abstract: A wearable otoscope may be capable of wireless or wired communication with a second device, such as a smart phone. Some dual-ear otoscope implementations may be provided in a headphone-like configuration, which may include a headband attachable to earbuds of the dual-ear otoscope. However, some alternative implementations do not include a headband. At least a portion of the dual-ear otoscope may be a disposable component in some examples. In some implementations, functionality of the dual-ear otoscope (such as an illumination angle of light, imaging functionality, etc.) may be controlled according to commands received from the second device. Some examples may include one or more additional sensors, such as temperature sensors.

    Abstract translation: 佩戴式耳镜可能能够与诸如智能电话的第二装置进行无线或有线通信。 一些双耳耳镜实现可以以类似耳机的配置来提供，其可以包括可附接到双耳耳罩的耳塞的头带。 然而，一些替代实施方式不包括头带。 在一些示例中，双耳耳镜的至少一部分可以是一次性部件。 在一些实施方式中，可以根据从第二设备接收的命令来控制双耳式耳镜的功能（诸如照明角度，成像功能等）。 一些示例可以包括一个或多个附加传感器，例如温度传感器。

    Devices, systems and methods using through silicon optical interconnects
    6.
    发明授权
    Devices, systems and methods using through silicon optical interconnects 有权
    使用硅光学互连的器件，系统和方法

    公开(公告)号：US09478528B2

    公开(公告)日：2016-10-25

    申请号：US13771638

    申请日：2013-02-20

    Applicant: Qualcomm Incorporated

    Inventor： Kenneth Kaskoun ,  Shiqun Gu ,  Matthew M. Nowak

    IPC: H01L25/16 ,  H01L25/00 ,  H04B10/80 ,  H01L23/00

    CPC classification number: H01L25/167 ,  H01L24/73 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H04B10/803 ,  H01L2924/00012

    Abstract: Some implementations provide a semiconductor device that includes a first die and an optical receiver. The first die includes a back side layer having a thickness that is sufficiently thin to allow an optical signal to traverse through the back side layer. The optical receiver is configured to receive several optical signals through the back side layer of the first die. In some implementations, each optical signal originates from a corresponding optical emitter coupled to a second die. In some implementations, the back side layer is a die substrate. In some implementations, the optical signal traverses a substrate portion of the back side layer. The first die further includes an active layer. The optical receiver is part of the active layer. In some implementations, the semiconductor device includes a second die that includes an optical emitter. The second die coupled to the back side of the first die.

    Abstract translation: 一些实施方案提供包括第一管芯和光学接收器的半导体器件。 第一模具包括具有足够薄的厚度以允许光信号穿过背侧层的背面层。 光接收器被配置为通过第一管芯的背侧层接收多个光信号。 在一些实现中，每个光信号源自耦合到第二管芯的对应的光发射器。 在一些实施方式中，背面层是模具基板。 在一些实现中，光信号穿过背侧层的衬底部分。 第一裸片还包括有源层。 光接收器是有源层的一部分。 在一些实施方案中，半导体器件包括包括光发射器的第二裸片。 第二模具耦合到第一模具的背面。

    Monolithic integrated emitter-detector array in a flexible substrate for biometric sensing
    7.
    发明授权
    Monolithic integrated emitter-detector array in a flexible substrate for biometric sensing 有权

    公开(公告)号：US10271745B2

    公开(公告)日：2019-04-30

    申请号：US15186347

    申请日：2016-06-17

    Applicant: QUALCOMM Incorporated

    Inventor： Shiqun Gu ,  Matthew Michael Nowak ,  Kenneth Kaskoun ,  Eugene Dantsker ,  Russel Allyn Martin

    IPC: A61B5/1455 ,  A61B5/024 ,  A61B5/145 ,  A61B5/00

    Abstract: Examples of monolithic integrated emitter-detector array in a flexible substrate for biometric sensing and associated devices and methods are disclosed. One disclosed example device includes a flexible substrate; a first array of emitters embedded in the flexible substrate, the first array of emitters configured to emit first electromagnetic (EM) signals; a first array of detectors embedded in the flexible substrate, the first array of detectors configured to detect reflections of the first EM signals; a first scanning circuit coupled to the first array of emitters, the first scanning circuit configured to selectively activate individual emitters of the first array of emitters; and a first sensing circuit coupled to individual detectors of the first array of detectors, the first sensing circuit configured to receive a detection signal from at least one of the detectors of the first array of detectors.

    Methods, devices and systems for sensor with removable nodes
    9.
    发明授权
    Methods, devices and systems for sensor with removable nodes 有权

    公开(公告)号：US09974484B2

    公开(公告)日：2018-05-22

    申请号：US15212428

    申请日：2016-07-18

    Applicant: QUALCOMM Incorporated

    Inventor： Kenneth Kaskoun ,  Brian David Niznik ,  Michael David Atella

    IPC: A61B5/00 ,  A61B5/11

    CPC classification number: A61B5/6833 ,  A61B5/0002 ,  A61B5/11 ,  A61B5/1112 ,  A61B5/684 ,  A61B5/7405 ,  A61B5/742 ,  A61B2560/0443

    Abstract: An integrated adhesive sensor array includes an adhesive a patch, a sensor hub, and a detachable sensor pod packaged as a unit. The patch may include a docking area for the detachable sensor pod. The detachable sensor pod may include at least one sensor and may be configured to be detached from the patch and applied to various locations on a body. The detachable sensor pod may send sensor data to the sensor hub via a wired link when on the patch and via a wireless link when detached from the patch. The sensor hub receives sensor data from the various sensors, and relays the data to a receiver. The sensor hub and detachable sensor pod may include indicators for communicating information. The sensor hub may include a power source for powering the sensor hub and a detachable sensor pod attached to the main sensor unit or patch.

Patent Agency Ranking