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公开(公告)号：US20160190103A1
公开(公告)日：2016-06-30
申请号：US15062115
申请日：2016-03-06
Inventor： TATSUYA KABE , HIDEYUKI ARAI
IPC: H01L25/065 , H01L23/00 , H01L25/00
CPC classification number: H01L25/0657 , H01L21/76898 , H01L23/528 , H01L23/53223 , H01L23/53238 , H01L23/53252 , H01L23/5329 , H01L23/562 , H01L23/564 , H01L23/58 , H01L23/585 , H01L24/06 , H01L24/09 , H01L24/14 , H01L24/17 , H01L24/83 , H01L25/065 , H01L25/07 , H01L25/18 , H01L2224/06505 , H01L2224/09505 , H01L2224/14505 , H01L2224/17505 , H01L2224/29186 , H01L2224/2919 , H01L2224/29191 , H01L2224/83895 , H01L2225/06558 , H01L2924/0002 , H01L2924/00
Abstract: A semiconductor devise includes a first substrate and a second substrate which are bonded each other. A first substrate includes an insulating first surface film as an uppermost layer, a first electrode and an insulating second surface film respectively formed inside a plurality of openings in the first surface film, and a first seal ring. A second substrate includes an insulating third surface film as an uppermost layer, and a second electrode, an insulating fourth surface film respectively formed inside a plurality of openings in the third surface film, and a second seal ring. The first electrode and the second electrode are directly bonded together. The first surface film and the third surface film are directly bonded together. The second surface film and the fourth surface film are directly bonded together. A seal ring formed of the first seal ring, the second surface film, the fourth surface film, and the second seal ring is continuous between the first substrate and the second substrate.
Abstract translation: 半导体器件包括彼此接合的第一衬底和第二衬底。 第一基板包括作为最上层的绝缘的第一表面膜，分别形成在第一表面膜中的多个开口内的第一电极和绝缘的第二表面膜，以及第一密封环。 第二基板包括作为最上层的绝缘的第三表面膜，以及分别形成在第三表面膜中的多个开口内的绝缘的第四表面膜和第二密封环的第二电极。 第一电极和第二电极直接接合在一起。 第一表面膜和第三表面膜直接接合在一起。 第二表面膜和第四表面膜直接接合在一起。 由第一密封环，第二表面膜，第四表面膜和第二密封环形成的密封环在第一基板和第二基板之间是连续的。
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公开(公告)号：US20170320457A1
公开(公告)日：2017-11-09
申请号：US15522138
申请日：2015-11-27
Inventor： KATSUMI KAKIMOTO , HIROSHI YAMANAKA , TAKANORI SUGIYAMA , ISAO HATTORI , YUICHI HIGUCHI , HIDEYUKI ARAI , YOSUKE HAGIHARA
CPC classification number: B60R21/01532 , B60H1/00 , B60H1/00878 , B60R16/02 , G01J1/02 , G01V8/12 , H01L35/32
Abstract: A detection device is used with a vehicle including a cabin, a ceiling, pillars, a driver seat, and a passenger seat. The detection device includes a detector disposed on the ceiling or the pillars of the vehicle and detecting an object in the cabin while not contacting the object, and a scanning unit that moves the detector for scan. The detection device can detect a temperature of the object accurately, and control air-conditioning comfortably to the object.
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公开(公告)号：US20210320266A1
公开(公告)日：2021-10-14
申请号：US17265045
申请日：2019-08-07
Inventor： NOBUYUKI MATSUZAWA , HIDEYUKI ARAI , MASARU SASAGO
IPC: H01L51/00 , C07D495/04 , C07D495/22 , C07D493/22 , C07D517/14
Abstract: To provide a fused hetero 5-membered ring molecule having further sufficiently high hole mobility. Disclosed is a fused hetero 5-membered ring molecule having, in one molecule, eight aromatic rings including three or five hetero 5-membered rings, and the eight aromatic rings having one or two naphthalene structures. The three or five hetero 5-membered rings are each independently selected from the group consisting of a thiophene ring, a selenophene ring, and a furan ring.
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公开(公告)号：US20200372317A1
公开(公告)日：2020-11-26
申请号：US16769652
申请日：2019-01-23
Inventor： KOJI OBATA , HIDEYUKI ARAI , JUN'ICHI NAKA
IPC: G06K19/077 , H01L21/822 , H01L29/786
Abstract: A wireless communication semiconductor device includes a circuit board, a semiconductor chip mounted on the circuit board, a thin film transistor provided on the circuit board, and an antenna provided on the circuit board. Even if a different unique ID is assigned to each of the wireless communication semiconductor devices, as compared with silicon-based wireless communication semiconductor devices, a manufacturing cost per device is sufficiently reduced, and the reduction in operation speed and reliability is sufficiently prevented.
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Patent Agency Ranking
公开(公告)号：US20210233232A1
公开(公告)日：2021-07-29
申请号：US17053107
申请日：2019-05-13
Inventor： YUYA SUGASAWA , HIDEYUKI ARAI , HISASHI AIKAWA
Abstract: A learning device includes a camera configured to acquire image data by imaging a sample of a product, a physical property information acquisition unit configured to acquire physical property information of the sample, and a processing unit configured to generate a learning model. The processing unit is configured to identify a category of the sample based on rule information relating the physical property information to the category, to generate teacher data by relating the identified category to the image data, and to generate a learning model by machine learning using the teacher data. The learning model outputs the category of the sample in response to an input of the image data of the sample.
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公开(公告)号：US20200280269A1
公开(公告)日：2020-09-03
申请号：US16645563
申请日：2018-10-26
Inventor： HIDEYUKI ARAI , JUN'ICHI NAKA , TOSHIAKI OZEKI , KOJI OBATA
IPC: H02N2/18 , G01H11/08 , H01L41/04 , H01L41/08 , H01L41/113 , H01L41/193 , F16H19/00 , F16H19/06 , F16H19/04
Abstract: The present disclosure provides a vibration power generation device capable of generating large electric power relative to an amount of displacement of a portion of a specimen. Vibration power generation device according to the present invention includes piezoelectric part and displacement enhancer. In response to displacement of a portion of specimen, displacement enhancer displaces a portion of piezoelectric part by a displacement amount greater than an amount of the displacement of the portion of specimen. When the portion of piezoelectric part is displaced, piezoelectric part generates electric power in accordance with an amount of the displacement of the portion of piezoelectric part.
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公开(公告)号：US20210371428A1
公开(公告)日：2021-12-02
申请号：US17263715
申请日：2019-08-07
Inventor： NOBUYUKI MATSUZAWA , HIDEYUKI ARAI , MASARU SASAGO
IPC: C07D495/14 , H01L51/00 , H01L51/05
Abstract: To provide a fused thiophene molecule having further sufficiently high hole mobility. Disclosed is a fused thiophene molecule that has seven aromatic rings containing three thiophene rings in one molecule and in which the seven aromatic rings have one or two naphthalene structures. And, semiconductor devices including a layer using the fused thiophene molecule are disclosed.
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公开(公告)号：US20200342282A1
公开(公告)日：2020-10-29
申请号：US16955772
申请日：2019-02-04
Inventor： KOJI OBATA , HIDEYUKI ARAI , JUN'ICHI NAKA
IPC: G06K19/077 , H01Q1/22 , H01L29/786
Abstract: Improving safety against peeling-off of a semiconductor device from an article and omitting an adhesion work of the semiconductor device to the article are made possible. Provided is semiconductor device including one or more components selected from a group including semiconductor chip, thin film transistor, antenna, and wiring. The one or more components are directly fixed on a surface of article. Provided is a manufacturing method of semiconductor device including one or more components selected from a group including semiconductor chip, thin film transistor, antenna, and wiring. The manufacturing method includes at least one of following step P1 and step Q1: step P1 of directly mounting the semiconductor chip on a surface of an article; and step Q1 of directly forming one or more components selected from a group including the thin film transistor, the antenna, and the wiring on the surface of the article by a printing method.
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公开(公告)号：US20160181228A1
公开(公告)日：2016-06-23
申请号：US15053868
申请日：2016-02-25
Inventor： YUICHI HIGUCHI , HIDEYUKI ARAI
IPC: H01L25/065 , H01L23/00 , H01L23/48
Abstract: A semiconductor device includes a first laminated body and a second laminated body. The first laminated body includes sequentially a first element, a first wiring layer, and a first connection layer that includes a first junction electrode, on a main surface of a first substrate. The second laminated body includes sequentially a second element, a second wiring layer, and a second connection layer that includes a second junction electrode, on a main surface of a semiconductor substrate. The first laminated body and the second laminated body are bonded by directly bonding the first junction electrode and the second junction electrode with the two junction electrodes facing each other. A space region is formed at a part of a junction interface between the first laminated body and the second laminated body.
Abstract translation: 半导体器件包括第一层叠体和第二层叠体。 第一层叠体在第一基板的主表面上依次包括第一元件，第一布线层和包括第一接合电极的第一连接层。 第二层叠体在半导体衬底的主表面上依次包括第二元件，第二布线层和包括第二接合电极的第二连接层。 第一层叠体和第二层叠体通过将两个接合电极面对的第一接合电极和第二接合电极直接接合而接合。 在第一层叠体和第二层叠体之间的接合界面的一部分处形成有空间区域。
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