公开(公告)号：US20200372317A1

公开(公告)日：2020-11-26

申请号：US16769652

申请日：2019-01-23

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： KOJI OBATA ,  HIDEYUKI ARAI ,  JUN'ICHI NAKA

IPC: G06K19/077 ,  H01L21/822 ,  H01L29/786

Abstract: A wireless communication semiconductor device includes a circuit board, a semiconductor chip mounted on the circuit board, a thin film transistor provided on the circuit board, and an antenna provided on the circuit board. Even if a different unique ID is assigned to each of the wireless communication semiconductor devices, as compared with silicon-based wireless communication semiconductor devices, a manufacturing cost per device is sufficiently reduced, and the reduction in operation speed and reliability is sufficiently prevented.

公开(公告)号：US20200239313A1

公开(公告)日：2020-07-30

申请号：US16635011

申请日：2018-08-07

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： NOBUYUKI MATSUZAWA ,  MASARU SASAGO ,  JUN'ICHI NAKA

IPC: C01B32/156 ,  H01L51/05 ,  H01L51/52

Abstract: Provided is a heterofullerene where n number (where n is a positive even number) of carbon atoms constituting a fullerene are substituted by n number of boron atoms or n number of nitrogen atoms.

公开(公告)号：US20200342282A1

公开(公告)日：2020-10-29

申请号：US16955772

申请日：2019-02-04

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： KOJI OBATA ,  HIDEYUKI ARAI ,  JUN'ICHI NAKA

IPC: G06K19/077 ,  H01Q1/22 ,  H01L29/786

Abstract: Improving safety against peeling-off of a semiconductor device from an article and omitting an adhesion work of the semiconductor device to the article are made possible. Provided is semiconductor device including one or more components selected from a group including semiconductor chip, thin film transistor, antenna, and wiring. The one or more components are directly fixed on a surface of article. Provided is a manufacturing method of semiconductor device including one or more components selected from a group including semiconductor chip, thin film transistor, antenna, and wiring. The manufacturing method includes at least one of following step P1 and step Q1: step P1 of directly mounting the semiconductor chip on a surface of an article; and step Q1 of directly forming one or more components selected from a group including the thin film transistor, the antenna, and the wiring on the surface of the article by a printing method.

公开(公告)号：US20200280269A1

公开(公告)日：2020-09-03

申请号：US16645563

申请日：2018-10-26

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： HIDEYUKI ARAI ,  JUN'ICHI NAKA ,  TOSHIAKI OZEKI ,  KOJI OBATA

IPC: H02N2/18 ,  G01H11/08 ,  H01L41/04 ,  H01L41/08 ,  H01L41/113 ,  H01L41/193 ,  F16H19/00 ,  F16H19/06 ,  F16H19/04

Abstract: The present disclosure provides a vibration power generation device capable of generating large electric power relative to an amount of displacement of a portion of a specimen. Vibration power generation device according to the present invention includes piezoelectric part and displacement enhancer. In response to displacement of a portion of specimen, displacement enhancer displaces a portion of piezoelectric part by a displacement amount greater than an amount of the displacement of the portion of specimen. When the portion of piezoelectric part is displaced, piezoelectric part generates electric power in accordance with an amount of the displacement of the portion of piezoelectric part.

公开(公告)号：US20170310292A1

公开(公告)日：2017-10-26

申请号：US15465583

申请日：2017-03-21

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TOSHIAKI OZEKI ,  JUN'ICHI NAKA

IPC: H03F3/45 ,  H03F3/193

CPC classification number: H03F3/45251 ,  H03F3/193 ,  H03F3/45197 ,  H03F3/45659 ,  H03F2200/294 ,  H03F2200/451 ,  H03F2203/45082 ,  H03F2203/45352

Abstract: A differential amplifier circuit comprises: first and second input terminals; first and second output terminals; a first transistor comprising a gate terminal connected to the first input terminal; a second transistor comprising a gate terminal connected to the second input terminal; a first resistor connected between the source terminal of the first transistor and the source terminal of the second transistor; a third transistor comprising a drain terminal connected to the source terminal of the first transistor, a gate terminal connected to the drain terminal of the first transistor, and a source terminal connected to the first output terminal; a fourth transistor comprising a drain terminal connected to the source terminal of the second transistor, a gate terminal connected to the drain terminal of the second transistor, and a source terminal connected to the second output terminal; first to fourth current sources; and second and third resistors.

公开(公告)号：US20220123758A1

公开(公告)日：2022-04-21

申请号：US17427060

申请日：2020-03-13

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： KOJI OBATA ,  JUN'ICHI NAKA ,  JUNJI NAKATSUKA ,  HIROKI YOSHINO ,  MASAAKI NAGAI

IPC: H03M1/10

Abstract: Provided are an analog-to-digital (AD) converter, a sensor system, and a test system capable of reducing the time for test processing. AD converter includes input part, AD conversion part, first output part, and second output part. The analog signal output from sensor is input to input part. AD conversion part digitally converts an analog signal to generate first digital data and second digital data. First output part outputs the first digital data to control circuit. Second output part outputs the second digital data to test controller before first output part outputs the first digital data. In the test mode, test controller determines whether or not sensor system including sensor is in an abnormal state on the basis of the second digital data.

公开(公告)号：US20220123757A1

公开(公告)日：2022-04-21

申请号：US17427061

申请日：2020-03-09

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： JUN'ICHI NAKA ,  KOJI OBATA ,  JUNJI NAKATSUKA ,  HIROKI YOSHINO ,  MASAAKI NAGAI

IPC: H03M1/06

Abstract: Provided are an analog-to-digital (AD) converter, a sensor processing circuit, and a sensor system capable of improving responsiveness of feedback control. AD converter includes input part, AD conversion part, first output part, and second output part. The analog signal output from sensor is input to input part. AD conversion part digitally converts an analog signal to generate first digital data and second digital data. First output part outputs the first digital data to control circuit. Second output part outputs the second digital data to sensor before first output part outputs the first digital data.