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公开(公告)号：US20200238438A1
公开(公告)日：2020-07-30
申请号：US16649985
申请日：2018-10-11
Applicant: Mitsubishi Electric Corporation , TADA ELECTRIC CO., LTD.
Inventor： Kazuki KUBA , Akihiro UENO , Toshinobu EGUCHI , Masaru YOSHIDA , Junji MIYATA
IPC: B23K26/06 , B23K26/073 , G02B27/40 , B23K26/046
Abstract: A laser processing machine to perform laser processing by focusing a laser beam onto a workpiece, includes a light-focusing optical system to focus the laser beam, wherein the light-focusing optical system has an aberration, and a lateral aberration with respect to a laser beam diameter: D86.5 containing 86.5% of the laser power of a laser beam before being focused is 0.2 mm or more, the lateral aberration being at a light focusing point relative to a light beam corresponding to the laser beam diameter: D86.5.
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Patent Agency Ranking
公开(公告)号：US20240042546A1
公开(公告)日：2024-02-08
申请号：US18377394
申请日：2023-10-06
Applicant: Mitsubishi Electric Corporation , TADA ELECTRIC CO., LTD.
Inventor： Kazuki KUBA , Akihiro UENO , Toshinobu EGUCHI , Masaru YOSHIDA , Junji MIYATA
IPC: B23K26/06 , B23K26/046 , B23K26/073 , G02B27/09
CPC classification number: B23K26/0648 , B23K26/046 , B23K26/0643 , B23K26/073 , G02B27/0927 , B23K26/0665
Abstract: A laser processing machine to perform laser processing by focusing a laser beam onto a workpiece, includes a light-focusing optical system to focus the laser beam, wherein the light-focusing optical system has an aberration, and a lateral aberration with respect to a laser beam diameter:D86.5 containing 86.5% of the laser power of a laser beam before being focused is 0.2 mm or more, the lateral aberration being at a light focusing point relative to a light beam corresponding to the laser beam diameter:D86.5.
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公开(公告)号：US20210318493A1
公开(公告)日：2021-10-14
申请号：US17273319
申请日：2019-09-13
Applicant: Mitsubishi Electric Corporation , Kyoto University
Inventor： Yoko INOUE , Masato KAWASAKI , Tatsuya YAMAMOTO , Kazuki KUBA , Susumu NODA
Abstract: A multiplexing optical system includes a light source, a lens and a lens array. The light source includes a plurality of light emitting elements of surface emitting lasers. The lens is configured to change and condense optical paths of laser light beams emitted from the light emitting elements. The lens array includes a plurality of lens regions arrayed so as to correspond to respective optical paths of the laser light beams changed by the lens, and is configured to condense the laser light beams by the lens regions to form a multiplexed beam.
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公开(公告)号：US20180348451A1
公开(公告)日：2018-12-06
申请号：US15570856
申请日：2016-04-07
Applicant: Mitsubishi Electric Corporation , Kyoto University , HAMAMATSU PHOTONICS K.K. , ROHM CO., LTD.
Inventor： Tatsuya YAMAMOTO , Kazuki KUBA , Masato KAWASAKI , Yoko INOUE , Tetsuo KOJIMA , Junichi NISHIMAE , Susumu NODA
CPC classification number: G02B6/42 , G02B6/4206 , G02B6/425 , H01S5/005 , H01S5/02284 , H01S5/105 , H01S5/18 , H01S5/4012 , H01S5/42
Abstract: A laser module includes: a photonic crystal surface-emitting laser element; a collimating lens array for producing a parallel optical beam; a condenser lens for condensing the optical beam; and an optical fiber which receives the optical beam on one end and transmits the optical beam to the outside. In the collimating lens array, an aperture portion corresponding to a collimating lens allows passage of the optical beam with an energy of not less than 94.0% and not more than 99.5% with respect to 100% of the energy of the optical beam incident on the collimating lens array.
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公开(公告)号：US20180175590A1
公开(公告)日：2018-06-21
申请号：US15579780
申请日：2015-12-25
Applicant: Mitsubishi Electric Corporation
Inventor： Tatsuya YAMAMOTO , Daiji MORITA , Masato KAWASAKI , Kazuki KUBA , Junichi NISHIMAE , Tetsuo KOJIMA
CPC classification number: H01S5/146 , H01S3/08027 , H01S3/0805 , H01S5/0071 , H01S5/0078 , H01S5/02288 , H01S5/141 , H01S5/143 , H01S5/22 , H01S5/4031 , H01S5/4062 , H01S5/4068 , H01S5/4087
Abstract: A semiconductor laser device includes: a semiconductor laser bar to output a plurality of beams with different wavelengths from a continuous light-emitting region; a light-condensing optical system to condense the beams; a wavelength-dispersive optical element having a wavelength dispersing function; an optical filter in which a wavelength of a beam that passes therethrough differs periodically; an aperture located on an optical path of the beams superimposed on an identical axis; and a partially reflecting mirror. A totally reflecting mirror is formed on a back side of the semiconductor laser bar, and wavelengths of a plurality of beams with different wavelengths reflected by the totally reflecting mirror and output from the semiconductor laser bar are respectively identical to wavelengths of beams that pass through the optical filter.
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公开(公告)号：US20170043431A1
公开(公告)日：2017-02-16
申请号：US15118574
申请日：2015-03-02
Applicant: MITSUBISHI ELECTRIC CORPORATION
Inventor： Kazuki KUBA , Naoyuki NAKAMURA , Akihiro UENO
IPC: B23K26/03
CPC classification number: B23K26/032 , B23K26/0648 , B23K26/21 , B23K26/32
Abstract: A laser processing head apparatus with a camera monitor includes a light source for illumination having a near-infrared laser diode that generates a near-infrared laser beam of which upper limit value is a wavelength of a laser beam for processing, and out of processing point-emitted light, a processing point-reflected laser beam and illumination light for imaging, which have passed through a condensed lens and a laser beam reflection mirror and are directed to the camera respectively. An optical filter blocks transmission of the processing point-emitted light and the processing point-reflected laser beam, and transmits the illumination light for imaging.
Abstract translation: 具有照相机监视器的激光加工头设备包括用于照明的光源，其具有产生近红外激光束的近红外激光二极管，其上限值为用于处理的激光束的波长，并且处理点 分别通过聚光透镜和激光束反射镜的经处理点反射的激光束和用于成像的照明光分别指向相机。 光滤波器阻止处理点发射光和处理点反射激光束的传输，并传输用于成像的照明光。
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