公开(公告)号：US20240042546A1

公开(公告)日：2024-02-08

申请号：US18377394

申请日：2023-10-06

Applicant: Mitsubishi Electric Corporation ,  TADA ELECTRIC CO., LTD.

Inventor： Kazuki KUBA ,  Akihiro UENO ,  Toshinobu EGUCHI ,  Masaru YOSHIDA ,  Junji MIYATA

IPC: B23K26/06 ,  B23K26/046 ,  B23K26/073 ,  G02B27/09

CPC classification number: B23K26/0648 ,  B23K26/046 ,  B23K26/0643 ,  B23K26/073 ,  G02B27/0927 ,  B23K26/0665

Abstract: A laser processing machine to perform laser processing by focusing a laser beam onto a workpiece, includes a light-focusing optical system to focus the laser beam, wherein the light-focusing optical system has an aberration, and a lateral aberration with respect to a laser beam diameter:D86.5 containing 86.5% of the laser power of a laser beam before being focused is 0.2 mm or more, the lateral aberration being at a light focusing point relative to a light beam corresponding to the laser beam diameter:D86.5.

公开(公告)号：US20200238438A1

公开(公告)日：2020-07-30

申请号：US16649985

申请日：2018-10-11

Applicant: Mitsubishi Electric Corporation ,  TADA ELECTRIC CO., LTD.

Inventor： Kazuki KUBA ,  Akihiro UENO ,  Toshinobu EGUCHI ,  Masaru YOSHIDA ,  Junji MIYATA

IPC: B23K26/06 ,  B23K26/073 ,  G02B27/40 ,  B23K26/046

Abstract: A laser processing machine to perform laser processing by focusing a laser beam onto a workpiece, includes a light-focusing optical system to focus the laser beam, wherein the light-focusing optical system has an aberration, and a lateral aberration with respect to a laser beam diameter: D86.5 containing 86.5% of the laser power of a laser beam before being focused is 0.2 mm or more, the lateral aberration being at a light focusing point relative to a light beam corresponding to the laser beam diameter: D86.5.

公开(公告)号：US20170043431A1

公开(公告)日：2017-02-16

申请号：US15118574

申请日：2015-03-02

Applicant: MITSUBISHI ELECTRIC CORPORATION

Inventor： Kazuki KUBA ,  Naoyuki NAKAMURA ,  Akihiro UENO

IPC: B23K26/03

CPC classification number: B23K26/032 ,  B23K26/0648 ,  B23K26/21 ,  B23K26/32

Abstract: A laser processing head apparatus with a camera monitor includes a light source for illumination having a near-infrared laser diode that generates a near-infrared laser beam of which upper limit value is a wavelength of a laser beam for processing, and out of processing point-emitted light, a processing point-reflected laser beam and illumination light for imaging, which have passed through a condensed lens and a laser beam reflection mirror and are directed to the camera respectively. An optical filter blocks transmission of the processing point-emitted light and the processing point-reflected laser beam, and transmits the illumination light for imaging.

Abstract translation: 具有照相机监视器的激光加工头设备包括用于照明的光源，其具有产生近红外激光束的近红外激光二极管，其上限值为用于处理的激光束的波长，并且处理点 分别通过聚光透镜和激光束反射镜的经处理点反射的激光束和用于成像的照明光分别指向相机。 光滤波器阻止处理点发射光和处理点反射激光束的传输，并传输用于成像的照明光。