Invention Application
- Patent Title: LASER PROCESSING MACHINE
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Application No.: US16649985Application Date: 2018-10-11
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Publication No.: US20200238438A1Publication Date: 2020-07-30
- Inventor: Kazuki KUBA , Akihiro UENO , Toshinobu EGUCHI , Masaru YOSHIDA , Junji MIYATA
- Applicant: Mitsubishi Electric Corporation , TADA ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo JP Hyogo
- Assignee: Mitsubishi Electric Corporation,TADA ELECTRIC CO., LTD.
- Current Assignee: Mitsubishi Electric Corporation,TADA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo JP Hyogo
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@461271f0
- International Application: PCT/JP2018/037981 WO 20181011
- Main IPC: B23K26/06
- IPC: B23K26/06 ; B23K26/073 ; G02B27/40 ; B23K26/046

Abstract:
A laser processing machine to perform laser processing by focusing a laser beam onto a workpiece, includes a light-focusing optical system to focus the laser beam, wherein the light-focusing optical system has an aberration, and a lateral aberration with respect to a laser beam diameter: D86.5 containing 86.5% of the laser power of a laser beam before being focused is 0.2 mm or more, the lateral aberration being at a light focusing point relative to a light beam corresponding to the laser beam diameter: D86.5.
Information query
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