公开(公告)号：US20170141241A1

公开(公告)日：2017-05-18

申请号：US15353397

申请日：2016-11-16

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  Sonja Hanselmann

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L31/0216 ,  G01J1/02 ,  H01L31/12

CPC classification number: G01J1/0295 ,  G01J1/0209 ,  G01J1/0214 ,  G01J1/0271 ,  H01L31/173

Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.

公开(公告)号：US20180102394A1

公开(公告)日：2018-04-12

申请号：US15828664

申请日：2017-12-01

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Sonja Hanselmann ,  Christoph Friese ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H01L27/146 ,  H01L33/58 ,  H01L31/0203 ,  H01L31/0232

CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0058 ,  H01L2924/00

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

公开(公告)号：US09543354B2

公开(公告)日：2017-01-10

申请号：US14339657

申请日：2014-07-24

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Sonja Hanselmann ,  Christoph Friese ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H01L21/00 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232

CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0058 ,  H01L2924/00

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

Abstract translation: 描述了包括光电子器件（例如，发光或光检测元件）和透明盖的各种光电模块。 在透明盖的侧壁上设置不透明材料，在一些实施方式中，这可以帮助减少透明盖的侧面的光泄漏，或有助于防止杂散光进入模块。 还描述了制造模块的制造技术。

公开(公告)号：US10199412B2

公开(公告)日：2019-02-05

申请号：US15329112

申请日：2015-07-22

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Simon Gubser ,  Sonja Hanselmann ,  Qichuan Yu ,  Cris Calsena ,  Guo Xiong Wu ,  Hartmut Rudmann

IPC: H01L27/146 ,  H01L25/04

Abstract: This disclosure describes optoelectronic modules that include an image sensor having at least two regions separated optically from one another by a wall. The wall can include a bridge portion that extends over the image sensor and further can include a cured adhesive portion, part of which is disposed between a lower surface of the bridge portion and an upper surface of the image sensor. Various techniques are described for fabricating the modules so as to help prevent the adhesive from contaminating sensitive regions of the image sensor. The wall can be substantially light-tight so as to prevent undesired optical cross-talk, for example, between a light emitter located to one side of the wall and a light sensitive region of the image sensor located to the other side of the wall.

公开(公告)号：US09859327B2

公开(公告)日：2018-01-02

申请号：US15367257

申请日：2016-12-02

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Sonja Hanselmann ,  Christoph Friese ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H01L21/00 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/58

CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0058 ,  H01L2924/00

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

公开(公告)号：US20170084663A1

公开(公告)日：2017-03-23

申请号：US15367257

申请日：2016-12-02

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Sonja Hanselmann ,  Christoph Friese ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H01L27/146 ,  H01L31/0232 ,  H01L33/58

CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0058 ,  H01L2924/00

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

公开(公告)号：US10190908B2

公开(公告)日：2019-01-29

申请号：US15984278

申请日：2018-05-18

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  Sonja Hanselmann

IPC: H01L31/02 ,  G01J1/02 ,  H01L31/173

Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.

公开(公告)号：US09976894B2

公开(公告)日：2018-05-22

申请号：US15353397

申请日：2016-11-16

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  Sonja Hanselmann

IPC: H01L31/02 ,  G01J1/02 ,  H01L31/173

CPC classification number: G01J1/0295 ,  G01J1/0209 ,  G01J1/0214 ,  G01J1/0271 ,  H01L31/173

Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.

公开(公告)号：US20150034975A1

公开(公告)日：2015-02-05

申请号：US14339657

申请日：2014-07-24

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Sonja Hanselmann ,  Christoph Friese ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H01L31/16 ,  H01L27/146

CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0058 ,  H01L2924/00

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

Abstract translation: 描述了包括光电子器件（例如，发光或光检测元件）和透明盖的各种光电模块。 在透明盖的侧壁上设置不透明材料，在一些实施方式中，这可以帮助减少透明盖的侧面的光泄漏，或有助于防止杂散光进入模块。 还描述了制造模块的制造技术。

公开(公告)号：US10199426B2

公开(公告)日：2019-02-05

申请号：US15828664

申请日：2017-12-01

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Sonja Hanselmann ,  Christoph Friese ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/58

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.