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    Method of making RFID devices on fabrics by stitching metal wires
    3.
    发明授权
    Method of making RFID devices on fabrics by stitching metal wires 有权
    通过拼接金属线在织物上制造RFID设备的方法

    公开(公告)号：US09449942B1

    公开(公告)日：2016-09-20

    申请号：US14803803

    申请日：2015-07-20

    Applicant: Flextronics AP, LLC

    Inventor： Weifeng Liu ,  Murad Kurwa ,  Anwar Mohammed ,  Zhen Feng

    IPC: H01L23/00 ,  H01L21/56 ,  H01L21/28

    CPC classification number: H01L24/42 ,  G06K19/027 ,  G06K19/07752 ,  G06K19/07754 ,  G06K19/07758 ,  H01L21/28 ,  H01L2224/32225

    Abstract: A method for making a Radio Frequency Identification (RFID) device on fabric is described herein. In a first example, an RFID semiconductor chip is attached to a piece of fabric. The RFID semiconductor chip includes two terminals. A solid wire is stitched into the fabric making an RFID antenna. The solid wire is attached to the terminals of the RFID semiconductor chip. In a second example, a metal wire is selected. The metal wire is stitched into fabric making an RFID antenna. The metal wire includes two ends and a conductive adhesive is applied to two ends of the metal wire. An RFID semiconductor chip is attached to the fabric. The RFID semiconductor chip includes two terminals and the RFID semiconductor chip is attached to the fabric at the two terminals. The conductive adhesive is cured. In both examples, the wire and the RFID semiconductor chip are encapsulated in fabric.

    Abstract translation: 本文描述了一种在织物上制作射频识别（RFID）设备的方法。 在第一示例中，将RFID半导体芯片附接到一块织物上。 RFID半导体芯片包括两个端子。 将实线焊接到制造RFID天线的织物中。 实芯线连接到RFID半导体芯片的端子。 在第二示例中，选择金属线。 将金属线缝合成制造RFID天线的织物。 金属线包括两端，并且导电粘合剂被施加到金属线的两端。 RFID半导体芯片附着在织物上。 RFID半导体芯片包括两个端子，并且RFID半导体芯片在两个端子处附接到织物。 导电粘合剂固化。 在这两个例子中，电线和RFID半导体芯片被封装在织物中。

    Method of making copper pillar with solder cap
    5.
    发明授权
    Method of making copper pillar with solder cap 有权

    公开(公告)号：US09674952B1

    公开(公告)日：2017-06-06

    申请号：US14482977

    申请日：2014-09-10

    Applicant: Flextronics AP, LLC

    Inventor： Weifeng Liu ,  Anwar Mohammed ,  Zhen Feng

    IPC: H05K1/09 ,  H05K1/11 ,  H05K3/40

    CPC classification number: H05K1/092 ,  H05K3/125 ,  H05K3/247 ,  H05K3/4007

    Abstract: An electrical interconnect includes a copper pillar and solder cap. The copper pillar and solder cap are formed onto a contact pad or an under bump metallurgy (UBM). In some applications, the contact pad or UBM is part of an electronic component, such as a semiconductor chip. In other cases, the contact pad is part of laminated substrate, such as a printed circuit board (PCB), or a ceramic substrate. The copper pillar and the solder cap are printed using an ink printer, such as an aerosol ink jet printer. A post heat treatment solidifies the interconnection between the contact pad or UBM, the copper pillar and the solder cap.

    Method of making RFID antenna by placing wire on fabric
    8.
    发明授权
    Method of making RFID antenna by placing wire on fabric 有权

    公开(公告)号：US09684864B1

    公开(公告)日：2017-06-20

    申请号：US14615309

    申请日：2015-02-05

    Applicant: Flextronics AP, LLC

    Inventor： Weifeng Liu ,  Zhen Feng ,  Anwar Mohammed

    IPC: G06K19/06 ,  G06K19/077

    CPC classification number: G06K19/07779 ,  G06K19/027

    Abstract: An RFID device assembly is fabricated by positioning an electrically conductive wire onto a fabric as a pattern that forms an antenna, and securing the wire to the fabric by stitching a non-electrically conductive thread over the wire and to the fabric. The two ends of the electrically conductive wire are positioned for coupling to antenna contact pads on an RFID device. The RFID device is attached to the fabric either before or after the electrically conductive wire is secured to the fabric by the stitched non-electrically conductive thread.

    Using a snap button to make disconnectable connection of electronic devices to fabrics
    10.
    发明授权
    Using a snap button to make disconnectable connection of electronic devices to fabrics 有权
    使用按钮可将电子设备与面料断开连接

    公开(公告)号：US09510649B1

    公开(公告)日：2016-12-06

    申请号：US14803788

    申请日：2015-07-20

    Applicant: Flextronics AP, LLC

    Inventor： Weifeng Liu ,  Murad Kurwa ,  Anwar Mohammed ,  Zhen Feng

    IPC: H01R33/00 ,  A44B17/00 ,  H01R43/16

    CPC classification number: A44B17/0064 ,  A41D1/005 ,  A44B17/0005 ,  A44B17/0041 ,  H01R43/16

    Abstract: A disconnectable snap button connection for connecting electronic devices to fabrics, the disconnectable snap button connection and a method for making the same is described herein. The disconnectable snap button connection includes a component, a piece of conductive material, a piece of non-conductive material; wherein the piece of conductive material is attached to the piece of non-conductive material, a male portion of the disconnectable snap button, wherein the male portion of the disconnectable snap button is attached to the component, and a female portion of the disconnectable snap button, wherein the female portion of the disconnectable snap button is attached to the piece of conductive material. When the male portion of the disconnectable snap button is inserted into the female portion of the disconnectable snap button, a connection is made between the component and the piece of conductive material.

    Abstract translation: 本文描述了用于将电子设备连接到织物的可断开的按钮连接，可断开的按扣连接及其制造方法。 可拆卸的按钮连接包括部件，一块导电材料，一块非导电材料; 其中所述导电材料片附接到所述非导电材料片，所述可断开扣扣的凸形部分，其中所述可断开扣扣的凸形部分附接到所述部件，并且所述可断开扣扣的阴部分 ，其中所述可拆卸按扣的阴部附接到所述导电材料片。 当可拆卸按扣的凸形部分插入到可拆卸按扣的凹形部分中时，在部件和导电材料片之间形成连接。

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