Abstract:
A system that includes an integrated circuit die and a power supply decoupling unit is disclosed. The system includes an integrated circuit die, and interconnection region, and a decoupling unit. The integrated circuit die includes a plurality of circuits, which each include multiple devices interconnected using wires fabricated on a first plurality of conductive layers. The interconnection region includes multiple solder balls, and multiple conductive paths, each of which includes wires fabricated on a second plurality conductive layers. At least one solder ball is connected to an Input/Output terminal of a first circuit of the plurality of circuits via one of the conductive paths. The decoupling unit may include a plurality of capacitors and a plurality of terminals. Each terminal of the decoupling unit may be coupled to a respective power terminal of a second circuit of the plurality of circuits via the conductive paths.
Abstract:
A transceiver circuit having a T-coil circuit, inductive termination, and an equalization circuit is disclosed. The transceiver includes a transmitter having an output coupled to a first node, and a receiver having an input coupled to the first node. A T-coil circuit is coupled between the first node and an input/output (I/O) node. The T-coil circuit includes first and second inductors coupled in series between the first node and the I/O node, the inductors being coupled at a second node. A termination circuit is coupled between the first node and a reference node, the termination circuit including a third inductor. The transceiver circuit also includes an equalization circuit configured to convey an equalization signal to the second node.
Abstract:
Routing structures including signal routing between die areas is described. In an embodiment, routing structures include signal lines with a characteristic thickness that is greater than a width. The signal lines may be twisted, and run directly underneath pads.
Abstract:
Circuits for reflection cancellation in single-ended signaling are disclosed. A transmission circuit includes a control circuit configured to receive a plurality of input signals that include a plurality of symbols having at least one bit and a data driver circuit configured to generate a particular signal on a transmission medium using a particular symbol of the plurality of symbols. The transmission circuit further includes a reflection cancellation circuit configured to, after a generation of the particular signal, generate a reflection cancellation signal on the transmission medium using an inverted value of a different symbol of the plurality of symbols received prior to the particular symbol. A first composite of the particular signal and the cancellation signal is readable at a load as a value of the particular symbol, wherein the load is configured to receive a transmitted signal via the transmission medium.
Abstract:
Routing structures including signal routing between die areas is described. In an embodiment, routing structures include signal lines with a characteristic thickness that is greater than a width. The signal lines may be twisted, and run directly underneath pads.
Abstract:
Routing structures including signal routing between die areas is described. In an embodiment, routing structures include signal lines with a characteristic thickness that is greater than a width. The signal lines may be twisted, and run directly underneath pads.